The invention belongs to the technical field of micro and nano-fabrication, and provides a special fixture applied to an aluminum thick film resistivity method
vacuum evaporation device. The special fixture is of a
bilateral symmetry structure and comprises a left clamp, a left
electrode, a first
tungsten wire cover plate, a first
tungsten wire, a second
tungsten wire, aluminum rings, a second tungsten wire cover plate, a right
electrode and a right clamp; the use amount of used
evaporation source aluminum rings is 2.5 times that of aluminum rings before transformation, after the use amount ofthe
evaporation source aluminum rings is increased, the limit thickness of one-time
evaporation can be increased to the
micrometer scale from few hundred nanometers, and through increasing of the useamount of evaporation source aluminum rings, the limit thickness of a
coating film is obviously improved; when the transformed clamps and tungsten wires are used for evaporating the aluminum film, the distance between a sample and an evaporation source is increased, the included angle between the sample and the evaporation source is 71.4 degrees, at the time, the single-time aluminum film evaporation limit thickness is the
micrometer scale, and the clamp can achieve the aim of evaporating the aluminum thick film.