31 results about "Lead (electronics)" patented technology

An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, a power source and electronics in electrical communication and disposed within the sealed housing interior, and a lead connector projecting into the sealed housing interior. The lead connector includes a closed end, an open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics and the lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.

An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire, a diversion or diverter circuit associated with the energy dissipating surface, and at least one switch disposed between the diversion circuit and the AIMD electronics for diverting energy in the implanted lead or the leadwire through the diversion circuit to the energy dissipating surface. The switch may comprise a single or multi-pole double or single throw switch. The diversion circuit may be either a high pass filter or a low pass filter.

This invention recognizes the hazards of beryllium and beryllium oxide in automotive applications and offers alternative material solutions. In particular, commercial electrochromic mirrors use beryllium comprising alloys for busbars and may also use beryllium oxide for the electronics used to power and control these mirrors. Further, this can be combined by reducing other known hazards such as mercury, cadmium, lead and antimony compounds.

A surrogate implantable medical device includes a thermally conductive and electrically conductive housing. A header connector block includes a header block body, where the header block body is attached to the housing. At least one connector cavity is located within the header block body and configured to be attachable to an implantable lead. At least one conductive leadwire is disposed at least partially within the header block body having a first end and a second end. The at least one conductive leadwire's first end is electrically connected to the at least one connector cavity and the at least one conductive leadwire's second end is electrically connected to the housing. The housing does not contain active electronics.

A printed circuit board assembly (PCBA) for underground applications has a printed circuit board (PCB) and a plurality of electronic components mounted on the PCB. The PCB includes a polyimide substrate, lead-free surface finish, multiple traces, multiple surface mount pads, and multiple vertical interconnect channels. The ratio of the width of one of the plurality of surface mount pads to the width of the traces connected to it is 2 or less.

The invention discloses an experimental device and method for on-line detection of tire temperature. The device includes a fixture (13), an integrated electronic component (12), a thermocouple, and the temperature detection signal lead-out end (6) of the thermocouple is connected to the integrated electronic component (12), and the integrated electronic component (12) is installed on the fixed device (13), the fixture (13) is installed on the rim. The thermocouple has a measuring terminal (5) and a pair of electrodes (3), (4). A pair of electrodes (3) and (4) of the thermocouple are twisted and connected to form a measuring end (5), and embedded in the desired measurement point of the tire. ), connected to the integrated electronic assembly (12). The fixing device (13) includes a rim fixing plate (9), a welding post (8), an integrated electronic component fixing plate (7), and the integrated electronic component fixing plate (7) is fixed on the rim fixing plate (9) by the welding post (8). superior. The integrated electronic assembly (12) includes a thermocouple signal receiving circuit, a signal processor, a USB interface, a memory card, a power supply, and a display, and the temperature detection signal lead-out end (6) of the thermocouple is connected to the thermocouple signal receiving circuit, and the integrated electronic assembly (12) Installed on the fixed plate (7) of the integrated electronic assembly.

A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics.

The invention discloses a calibration system, comprising: a resistance detector, suitable for detecting the resistance of an electronic device; a first container, containing an etching solution suitable for etching lead wires; and a heater, suitable for heating the electronic device. When the first resistance of the electronic device at the first temperature detected by the resistance detector is within the first predetermined range, use the heater to heat the electronic device to a second temperature higher than the first temperature, and use the resistance detector to detect The second resistance of the electronic device at the second temperature, if the detected second resistance is outside the second predetermined range, the lead wire is etched with an etching solution to adjust the resistance value of the electronic device until the electronic device is at the second The second resistance at temperature is within a second predetermined range such that the resistance of the electronic device meets predetermined accuracy requirements. The invention reduces the manufacturing difficulty of the electronic device, and can also reduce the reject rate and save the manufacturing cost.

The invention discloses a lead-free nanometer solder containing Yb, A1 and B, and belongs to the field of lead-free solders for microelectronic assembly. The lead-free solder comprises 0.5-4.5% of Ag, 0.2-1.5% of Cu, 0.01-0.5% of Yb, 0.01-0.5% of A1, 0.01-0.5% of B, and the balance being Sn. The preparation method for the lead-free nanometer solder includes the steps of preparing Sn ingot, intermediate alloy of Sn-Cu, intermediate alloy of Sn-Ag, intermediate alloy of Sn-Yb, intermediate alloy of Sn-A1, and intermediate alloy of Sn-B which are commercially available, smelting the lead-free solder by means of the manufacturing process of high-energy and ultrasonic stirring based on ratio requirements, smelting and casting the lead-free solder into a bar under the protection atmosphere of an inert gas so as to prevent burning loss of the elements, make the bar into an electrode, and finally prepare the lead-free nanometer solder particles by a DC (direct current) electric arc method of consumable electrodes. The lead-free nanometer solder containing Yb, A1 and B has the advantages of good wettability and mechanical properties, and capability of meeting the needs of the electronics industry.

The invention relates to a process for forming a lead-based ceramic oxide dielectric material comprising at least one pyrochlore crystalline phase, which process comprises the following steps: a) a step of depositing at least one amorphous layer of said lead-based ceramic oxide material on a substrate; and b) a crystallization annealing step carried out on said amorphous layer at a temperature not exceeding 550° C., by means of which a lead-based ceramic oxide dielectric material comprising at least one pyrochlore phase is obtained. Application to the fabrication of capacitors on integrated circuits.

The invention discloses a preparation method of low-temperature lead-free alloy solder, which comprises the following component raw materials in weight percentage: In 18-24%, Bi 2-5%, Sb 0.1-0.4%, Cu 0.1% ‑0.7%, Ce 0.02‑0.06% and the balance Sn. The melting point of the low-temperature lead-free solder of the present invention is 163°C-194°C; the metallographic structure of the alloy solder is uniform and refined, the wetting and spreading are good, the bonding with the substrate pad and the weldment is firm, the solder joints are bright and full, and have good mechanical properties And electrical performance; the low-temperature lead-free alloy solder better solves the process requirements for using low-temperature lead-free alloy solder in the lead-free process of the electronics industry, and practices the relevant regulations on energy conservation, emission reduction and environmental protection.