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Method for connecting thin film and lead wire by using spraying process

A wire and film technology, applied in the field of wire fixing, can solve problems such as poor temperature resistance, unstable transmission signals, and infirmity, and achieve the effects of reliable fixing, small thickness, and smooth connection nodes

Pending Publication Date: 2022-03-04
天津航空机电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problems of poor temperature resistance, infirmity, and unstable transmission signal of the connection between the film and the lead, a lead fixing technology for the cross-scale connection of the film and the lead, especially for the connection of the curved surface, was invented.

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  • Method for connecting thin film and lead wire by using spraying process
  • Method for connecting thin film and lead wire by using spraying process

Examples

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Embodiment 1

[0035] An embodiment of the present invention is a method for connecting a film and a lead by using a spraying process.

[0036] Its specific structure is: there is a thin-film thermocouple on the surface (1) of the planar ceramic substrate, and there is a thin-film electrode (2) at the bottom, and the connection between the thin-film electrode and the lead wire (3) is sequentially from inside to outside: conductive paste ( 4) A copper lead wire (5) with a diameter of 2 mm, a fixed protective layer (6) with a thickness of 160 μm, wherein the end of the copper lead wire is pressed into a flat shape before use, and the fixed protective layer is prepared by plasma spraying technology. The above-mentioned method for connecting a film and a lead by a spraying process comprises the following steps:

[0037] Step 1: using plasma to clean the thin film electrode on the surface of the substrate, the operating parameters of the plasma are;

[0038] Step 2: Press the lead end of Φ2mm in...

Embodiment 2

[0043] An embodiment of the present invention is a method for connecting a film and a lead by using a spraying process.

[0044] Its specific structure is: there is a thin-film thermocouple on the surface (1) of a cylindrical ceramic substrate of Φ15mm, and a thin-film electrode (2) exists at the bottom, and the connection between the thin-film electrode and the lead wire (3) is sequentially from inside to outside: conductive paste (4), a copper lead wire (5) with a diameter of 4 mm, and a fixed protective layer (6) with a thickness of 200 μm, wherein the end of the copper lead wire is pressed into a flat shape before use, and the fixed layer protective layer is prepared by plasma spraying technology.

[0045] The above-mentioned method for connecting a film and a lead by a spraying process comprises the following steps:

[0046] Step 1: using plasma to clean the thin film electrode on the surface of the substrate, the operating parameters of the plasma are;

[0047] Step 2: ...

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Abstract

The invention relates to the field of special connection, and discloses a method for connecting a thin film and a lead by using a spraying process, a fixed protective thin film is prepared at the joint of the thin film and the lead through the spraying process, non-destructive connection of a thin film electrode and the lead is realized, and a fixed protective coating of 150 microns or more is formed at the joint. The bonding strength between the fixed coating and a matrix is 20-40 MPa, and the matrix can be a metal matrix, a ceramic matrix or a polymer matrix. According to the invention, the ceramic powder is heated to a semi-molten state by adopting a spraying process and is sprayed at the joint of the film and the lead, so that the bonding strength of the formed connecting coating is high, and the damage of high-temperature welding to the film and the lead with smaller thickness scale is overcome. The method is economical, environmentally friendly, high in joint bonding strength, excellent in performance and suitable for continuous operation of a production line, and has wide application prospects in the fields of aerospace, electronics and electrics, ship engineering and the like.

Description

technical field [0001] The invention belongs to the field of lead wire fixing, and in particular relates to a method for connecting a film whose thickness scale is at the micron scale and a lead wire whose diameter scale is at the millimeter scale by using a spraying process. Background technique [0002] In order to realize the extraction of the detection signal of the thin-film sensor, it is necessary to use a lead wire or a compensation wire at the end of the sensor to form a good electrical contact with the sensor sensitive layer film, and to lead out the electrical signal. The airflow scours and breaks, causing the thin film sensor to fail. Therefore, lead protection and signal extraction are also important technologies for the practical application of thin film sensors. Traditional thin-film signal leads usually adopt methods such as thermocompression welding, high-temperature inorganic glue coating, and high-temperature conductive silver paste coating. [0003] The ...

Claims

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Application Information

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IPC IPC(8): B21F15/00H01L35/34
CPCB21F15/00H10N10/01
Inventor 梁振宗陈虎杨绍武
Owner 天津航空机电有限公司
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