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199 results about "Integrated electronics" patented technology

Method for Making Advanced Smart Cards With Integrated Electronics Using Isotropic Thermoset Adhesive Materials With High Quality Exterior Surfaces

Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.
Owner:CARDXX

Implantable biocompatible component integrating an active sensor for measurement of a physiological parameter, a micro-electromechanical system or an integrated circuit

An implantable biocompatible component (10) integrating an active element of the type of a sensor for the measurement of a physiologic parameter, a micro-electromechanical system and an integrated electronic circuit. This component (10) has a substrate (12) and a lid (22) in silicon or quartz. The substrate (12) integrates the active element (14) and biocompatible metallic pads (16), electrically connected to the active element. The lid (22) encompasses and peripherally closes the substrate in a hermetic manner, level with the face integrating the active element. This component is void of metallic case for insulation between the active element and outside environment, and of insulative feedthrough for electrical connection to the active element. The substrate and lid can be directly welded to each other through their faces in vis-à-vis, or by interpositioning a sealing ring made of a biocompatible material.
Owner:SORIN CRM

Tool magazine and automatic tool changer comprehensive performance detecting system

The invention relates to a tool magazine and automatic tool changer comprehensive performance detecting system, which adopts a three-shaft acceleration sensor, a wireless vibration sensor, an industrial camera, a PSD (position sensory device) camera and a sound pressure sensor as detecting elements for detecting the comprehensive performance of a large-sized tool magazine and an automatic tool changer thereof. An IEPE (integrated electronics piezo electric) analog quantity collection card, a wireless gateway, an image collection card and an analog voltage collection card are adopted as a data collection or a signal transmission device to detect performances of the large-sized tool magazine and the automatic tool changer on the five aspects such as vibration of the tool magazine, vibration of a mechanical arm, positioning error of the tool magazine, the tool changing movement precision of a mechanical hand and the working noise of the entire machine and to transmit collected signals to an industrial personal computer. LabVIEW is adopted as a tool to design processing software special for analyzing and calculating data and for analyzing, operating and storing the acquired experimental data. The tool magazine and automatic tool changer comprehensive performance detecting system has the advantages of strong portability, wide measurement range, high measurement precision, low requirement on the professional technical level of an operator and the like and has strong practical application value.

Photo-definable glass with integrated electronics and ground plane

The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors, transmission lines and transformers) in photo definable glass ceramic substrates in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
Owner:3D GLASS SOLUTIONS INC
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