Lead-free nanometer solder containing Yb, A1 and B
A lead-free solder, nanotechnology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problem of reducing the mechanical properties of the melting temperature of the solder, the contribution of the melting temperature of the solder is small, and the peeling of the solder joints. and other problems, to meet the requirements of high reliability, low melting temperature, and good mechanical properties
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Embodiment 1
[0014] The composition mass percentage of nano-lead-free solder containing Yb, Al, and B: 4.0%Ag, 0.5%Cu, 0.01%Yb, 0.01%Al, 0.01%B, and the balance is Sn.
[0015] The main performance test of solder: the solidus temperature is about 194 ℃, and the liquidus temperature is about 200 ℃ (considering the experimental error), which has superior performance.
Embodiment 2
[0017] The composition mass percentage of nano-lead-free solder containing Yb, Al, and B: 3.8%Ag, 0.2%Cu, 0.5%Yb, 0.5%Al, 0.5%B, and the balance is Sn.
[0018] The main performance test of the solder: the solidus temperature is about 196°C, and the liquidus temperature is about 202°C (considering the experimental error), which has superior performance.
Embodiment 3
[0020] The composition mass percentage of nano-lead-free solder containing Yb, Al, and B: 3.0%Ag, 0.5%Cu, 0.05%Yb, 0.01%Al, 0.05%B, and the balance is Sn.
[0021] The main performance test of the solder: the solidus temperature is about 193°C, and the liquidus temperature is about 199°C (considering the experimental error), which has superior performance.
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