The invention discloses an
electroplating method based simple super-hydrophobic tube inner
surface preparation device. The
electroplating method based simple super-hydrophobic tube inner
surface preparation device comprises a tube fitting and an
electroplating anode which are coaxially arranged between a base and a top plate, wherein a lead screw passes through the top plate and the base for enclosing the electroplating
anode and the tube fitting into a sealed reaction cavity; a conductive
copper sheet is mounted on the upper surface, at the top end of the tube fitting, of the electroplating
anode; the upper side surface of the conductive
copper sheet is connected to a guide wire; the guide wire is accessed into a power supply through a top plate through hole; the top plate and the tube fitting are provided with openings, and are accessed into a circulating pipeline; a
peristaltic pump drives a solution in a plating solution slot to enter the tube fitting to react, and then flow back into the plating solution slot to accomplish a cycle; and an ultrasonic
transducer is mounted at the lower end of the base, and is coaxial with the tube fitting. The electroplating method based simplesuper-hydrophobic tube inner
surface preparation device solves the problem that in-tube super-hydrophobic surface preparation is difficult, has the advantages of being high in
cost performance, conveniently and quickly replacing the tube fitting, being strong in sealing property, adopting
ultrasonic cavitation effect to reduce retention of gas bubbles in an electroplating process, and acceleratessurface reaction, so that uniformity of a hydrophobic
surface structure is improved, and the purpose of controlling surface
topography can be achieved by programing specified current output.