Fabrication method of gold-plated finger board

Abstract

The invention discloses a fabrication method of a gold-plated finger board. According to the main points of the technical scheme, the fabrication method comprises the following steps: carrying out front process treatment on a board of a circuit board; painting a green ink; pasting blue glue; plating gold fingers; carrying out laser cutting; pasting the blue glue; etching secondary leads; carrying out screen printing of characters; and the like. According to a novel fabrication method, the secondary leads in the gold plating process are put on the leads at the bottom ends of the gold fingers; the connected secondary leads are developed and exposed during exposure in a solder mask process; after the gold fingers are plated; the connected leads are eliminated through an inner layer etching liquid; and the area is covered with a character oil clot in the character process, so that the problem that the gold finger board is scratched and scraped due to lead protrusion after the gold finger board is molded and bevel edges are routed and the problem of a fabrication difficulty due to the fact that copper is exposed out of the gold surfaces of the top ends of the gold fingers after the gold finger board is molded are effectively solved.

Description

【Technical Field】 [0001] The invention relates to a manufacturing method of a gold-plated finger plate. 【Background technique】 [0002] The traditional manufacturing method is to pull out some leads from the top of the gold finger to the edge of the board, as the lead to the gold finger during electroplating, and gong the lead when the gold finger is formed after plating, such as figure 1 As shown, after this traditional method is formed, there will be a small piece of secondary lead residue on the top of the gold finger. When the golden finger is beveled, there will be copper exposed on the top of the finger and residual bumps on the secondary lead, which will cause the problem of scratching on the gold surface. The quality is not easy to control. . [0003] The present invention is made based on this situation. [Content of the invention] [0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for manufacturing a gold-pla...

AI Technical Summary

Problems solved by technology

[0002] The traditional production method is to pull some leads from the top of the gold finger to the edge of the board, as the lead wires leading to the gold finger during electroplating, and remove the leads when the gold finger is formed after plating, such as figure 1 As shown, after the traditional method is formed, there will be a small section of sub-lead remaining on the top of the gold finger. When the gold finger is beveled, there will be exposed copper on the top of the finger and residual protrusions on the sub-lead, which will cause the problem of scratching on the gold surface, and the quality is difficult to control.

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