The invention discloses a mechanical-type chip clamping-pressing device for vacuum plasma technology. The mechanical-type chip clamping-pressing device for the vacuum plasma technology comprises a chip substrate, an electrode, ceramic pressure rings, pressure ring connecting rods, a connecting rod support, a permanent magnet group, a drive motor and a motor support, wherein the chip substrate is positioned on the electrode, the ceramic pressure rings are arranged above the chip substrate and are connected with the connecting rod support through the pressure ring connecting rods, the permanent magnet group comprises a first group of permanent magnets and a second group of permanent magnets, wherein the first group of permanent magnets and the second group of permanent magnets are arranged in a corresponding mode are in magnetic coupling with each other, the first group of permanent magnets is fixedly connected with the connecting rod support, and the second group of permanent magnets is fixed on the drive motor which is movably connected with the motor support. The mechanical-type chip clamping-pressing device for the vacuum plasma technology can overcome the technical defect that an mechanical-type chip clamping-pressing device in the prior art can not be compatible with chip substrates with different thicknesses and surface evenness, is reliable in using, can reduce and eliminate instantaneous impact force generated by the ceramic pressure rings to the chip substrate when the ceramic pressure rings are contacted with the surface of the chip substrate, reduces the probability that the surface of the chip substrate is damaged or cracked, and improves production efficiency.