The invention discloses a manufacturing method for a PCB for a charging
pile. The manufacturing method comprises the following steps: S1, earlier-stage
processing is carried out; S2,
copper depositionis carried out; S3, blue glue pasting is carried out: a gold-plated area and a non-gold-plated area are preset on the PCB, a to-be-gold-plated bonding pad to be gold-plated is arranged on the presetgold-plated area, blue glue is pasted on the non-gold-plated area, and a
copper layer is exposed in the gold-plated area; S4, first micro-
etching and blue glue tearing off are carried out: the copperlayer in the gold-plated area is subjected to micro-
etching, and the blue glue in the non-gold-plated area is torn off: S5, ink printing is carried out: the preset gold-plated area is covered by the ink and is then baked, and after
exposure and development, the bonding pad to be gold-plated is exposed; S6, a dried film is selected and
gold plating is carried out: the two sides of the PCB are covered with the dried film, the bonding pad to be gold-plated is exposed and developed, and
gold plating is carried out after
nickel plating is carried out on the bonding pad to be gold-plated; S7, film stripping and ink stripping are carried out; S8, second micro-
etching is carried out; and S9, post-
processing is carried out. According to the method, the conditions of gold infiltration and circuit infiltration and
corrosion are avoided, the product quality is ensured, the production efficiency is improved, and the prepared PCB can bear large current.