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939results about "High current circuit adaptations" patented technology
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Inter-circuit encapsulated packaging
InactiveUS20020008963A1Semiconductor/solid-state device detailsSolid-state devicesThermal energyHeat spreader
A modular circuit board assembly is disclosed. The modular circuit board assembly comprises a substrate, a circuit board, and a component, disposed between the circuit board and the substrate, the component physically and electrically coupled to the substrate. In one embodiment, the circuit board also comprises an aperture allowing for the transmission of thermal energy from the component to a heat sink. In still another embodiment of the invention, the heat sink includes a mesa having surface features cooperatively interacting with surface features on the component or members mounted on the component to provide for location and / or retention.
Owner:INCEP TECH
Semiconductor device and display device
InactiveUS20060244741A1Reduce resistanceSuppression pressure dropPrinted circuit aspectsSolid-state devicesElectrical resistance and conductanceDevice material
If misalignment in a line width direction of an electrode (pad) of a connection terminal is caused in attachment of a substrate and an FPC, a connection area of the FPC terminal and the connection terminal becomes smaller and contact resistance is increased. In particular, an increase in contact resistance of the connection terminal to which a power supply potential serving as a power source is inputted is a cause of defective display. In view of the above, an object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.
Owner:SEMICON ENERGY LAB CO LTD
Multi-layer printed circuit board
InactiveUS20070017696A1Printed circuit aspectsHigh current circuit adaptationsPrinted circuit boardElectric current
A multi-layer printed circuit board (PCB) is provided allowing balanced power supply to components requiring large working current. The PCB includes a plurality of layers disposed thereon. A first power area, and a second power area are separately arranged on different layers. The first power area and the second power area vertically aligned within the PCB with generally identical shapes cooperatively provide power to components requiring large working current.
Owner:HON HAI PRECISION IND CO LTD
Shunt connection to a PCB of an energy management system employed in an automotive vehicle
ActiveUS7319304B2Batteries circuit arrangementsTesting electric installations on transportShunt DeviceElectricity
Owner:MIDTRONICS
Planar coil and planar transformer, and process of fabricating a high-aspect conductive device
InactiveUS6600404B1Improve electrical performanceIncreases conductor thicknessTransformers/inductances coils/windings/connectionsPrinted circuit aspectsPlanar transformersPhysics
A planar coil including and insulating substrate, and a coil conductive filament having a thickness of 20 to 400 mum and formed on at least one surface of the insulating substrate, the coil conductive filament having a gap whose aspect ratio (H / G) is at least 1. The coil conductive filament has a cross-section in a substantially mushroom shape having a head and a neck, the head has a width (L) which is a least twice as large as a width (l) of the neck thereof, at most 1.5 times as large as a height of the head, and at least twice as large as a minimum spacing (G) between adjacent coil conductive filaments.
Owner:TDK CORPARATION
Electric power steering apparatus
ActiveUS20070205038A1Small sizeLow costAssociation with control/drive circuitsPrinted circuit aspectsElectric power steeringElectricity
An electric power steering apparatus requires no external connecting member connecting between a power main body and a control main body, and hence can be reduced in size and cost, and the reliability of electrical connection between the power main body and the control main body can be improved. High current parts constituting the power main body and low current parts constituting the control main body are mounted on opposite sides of a circuit board, and are electrically connected with one another via conductor layers of the circuit board and through holes formed therein.
Owner:MITSUBISHI ELECTRIC CORP
Interconnect design for reducing radiated emissions
ActiveUS20070188997A1Emission reductionReduce radiationDigital data processing detailsSemiconductor/solid-state device detailsElectrical conductorLow-pass filter
An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a higher frequency range without negatively modifying current in a lower frequency range and may reduce radiated emissions produced during operation of the integrated circuit. The filter may be implemented by arranging core-power voltage conductors and ground conductors at a first or second level interconnect into one or more voltage groupings and one or more adjacent ground groupings such that series inductance is increased. In some embodiments, the first level interconnect may include conductive bumps or pads between an integrated circuit and a substrate. In some embodiments, the second level interconnect may include solder balls, pins, pads, or other conductors of a package, socket, or interposer.
Owner:ORACLE INT CORP
Shunt connection to a PCB of an energy management system employed in an automotive vehicle
ActiveUS20050057865A1Batteries circuit arrangementsTesting electric installations on transportElectricityShunt Device
A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the flexible electrical connectors to connection points on the PCB of the energy management system. An energy management system that includes a shunt coupled to a printed circuit board using the above method is also provided.
Owner:MIDTRONICS
Multilayer printed wiring board
ActiveUS20070029106A1Improve matchExcellent electrical propertiesSemiconductor/solid-state device detailsPrinted electric component incorporationEngineeringElectromotive force
In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance is reduced and a high frequency IC chip is loaded, electric characteristic and reliability can be improved without generating malfunction or error.
Owner:IBIDEN CO LTD
Large area circuitry using appliques
ActiveUS20080142238A1Low costProvide protectionPrinted circuit assemblingPrinted electric component incorporationLightning strikeMetal foil
An appliqué for forming a surface coating to a substrate is disclosed. The appliqué contains a sectioned metal foil that provides a large area electrical circuit for connecting electrical devices. The appliqué may provide additional functions including lightning strike protection. The substrate may be an aircraft surface.
Owner:THE BOEING CO
Aerosol Jet (R) printing system for photovoltaic applications
InactiveUS20090061077A1Reduce widthReduce thicknessDispersed particle separationSolid-state devicesBusbarSpray nozzle
Method and apparatus for depositing multiple lines on an object, specifically contact and busbar metallization lines on a solar cell. The contact lines are preferably less than 100 microns wide, and all contact lines are preferably deposited in a single pass of the deposition head. There can be multiple rows of nozzles on the deposition head. Multiple materials can be deposited, on top of one another, forming layered structures on the object. Each layer can be less than five microns thick. Alignment of such layers is preferably accomplished without having to deposit oversized alignment features. Multiple atomizers can be used to deposit the multiple materials. The busbar apparatus preferably has multiple nozzles, each of which is sufficiently wide to deposit a busbar in a single pass.
Owner:OPTOMEC DESIGN CO
Semiconductor device and method for manufacturing the same
InactiveUS20050231925A1Small sizeReduce dead spaceSemiconductor/solid-state device detailsCircuit arrangements on support structuresEngineeringSemiconductor
An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.
Owner:DENSO CORP
Array socket with a dedicated power/ground conductor bus
InactiveUS6916183B2Printed circuit aspectsComponent plug-in assemblagesElectricityElectrical conductor
An apparatus for receiving a microchip and having a conductor buses therein. A top surface of the apparatus receives the microchip while the bottom surface is to mount to a circuit board. A plurality of pin receptacles pass through the top surface to receive a corresponding plurality of microchip pins of the microchip. The conductor bus resides at least in part between the top surface and the bottom surface and is electrically coupled to a first plurality of the plurality of the pin receptacles.
Owner:INTEL CORP
Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation
InactiveUS20090314525A1Large widthFacilitated releaseContact member manufacturingTransparent dielectricsEngineeringMultiple layer
A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process. Further, described is a process for producing a wiring board, comprising bringing a precision mold having a mold pattern on a surface of a mold base into contact with a surface of a metal thin film formed on an organic insulating base, pressing the mold to form a depression having a shape corresponding to the mold pattern of the precision mold in the organic insulating base, thereafter forming a metal plating layer having a thickness larger than the depth of the depression to fill the plating metal in the depression, and then polishing the metal plating layer until the organic insulating base is exposed, to form a wiring pattern, and a wiring pattern produced by this process.
Owner:MITSUI MINING & SMELTING CO LTD
Controller system for pool and/or spa
InactiveUS7440864B2Effective protectionEasy to testDc network circuit arrangementsLevel controlMicrocomputerEngineering
A method of programming a microcomputer based controller system for a bathing installation. The microcomputer is configured to receive input command and sensor information from a plurality of input devices including a control panel and a bathing installation sensor, and acts on the input information operating according to a program running on the microcomputer which performs control functions for a plurality of bathing installation functions, including operating a water heater and a water pump of the bathing installation.
Owner:DYMAS FUNDING COMPANY
Wiring board, method of manufacturing the same, and semiconductor device
InactiveUS20060055021A1Improve insulation reliabilityImprove manufacturing yieldWing handlesSemiconductor/solid-state device detailsDevice materialOrganic layer
According to this invention, a wiring board includes a conductive pattern formed from leads each of which is formed on an organic layer and has a thickness t larger than a width W.
Owner:TERAMIKROS INC
Multilayered wiring substrate and method of manufacturing the same
InactiveUS20070057363A1Suppress generationReduce thicknessSemiconductor/solid-state device detailsPrinted circuit aspectsEngineering
Owner:SHINKO ELECTRIC IND CO LTD
LSI package provided with interface module and method of mounting the same
InactiveUS7394665B2Without requiring expensiveSemiconductor/solid-state device detailsSolid-state devicesCouplingComputer module
In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal terminals electrically connected to the signal input and output terminals of the circuit module, second electric terminals for electrically connecting the circuit module to the mounting board, internal wirings electrically connected to the first signal terminals, and first coupling parts electrically connected to the internal wirings. An interface module is provided with a signal transmission line for transmitting the signals and second coupling parts electrically connected to the transmission line. The second coupling part is electrically and mechanically connected to the first coupling parts, respectively.
Owner:KK TOSHIBA
Wiring board and method of manufacturing the same
ActiveUS20060258055A1Improve cooling effectLess thermal resistanceSemiconductor/solid-state device detailsPrinted electric component incorporationMetal foilSemiconductor
A wiring board has a circuit pattern that includes metal foil attached to an insulating layer, and a built-up circuit pattern disposed on top of the metal foil circuit pattern. The built-up circuit pattern is an increased thickness laminate of cold spray processed metal material. Even when a power semiconductor is mounted on the built-up circuit pattern, the heat that is generated by losses therein can be diffused by the built-up circuit pattern. The wiring board has excellent heat dissipation, can be manufactured by a small number of process steps, and is of low cost.
Owner:FUJI ELECTRIC HLDG CO LTD
Solid State Lighting Circuit and Controls
In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.
Owner:METROSPEC TECH
Electronic assembly having stressable contact bridge with fuse function
ActiveUS8665057B2Increase power consumptionReduce power consumptionPrinted circuit aspectsHeating/cooling contact switchesElectrical conductorEngineering
Owner:CONTI TEMIC MICROELECTRONIC GMBH
Electrically conductive structure of circuit board and circuit board using the same
ActiveUS20090107717A1Lower impedanceLow impedance bandwidthCross-talk/noise/interference reductionPrinted circuit aspectsGround contactCoupling
An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The first and second conducting sections are electrically connected to a power and ground contact of an electronic device, respectively. The first and second coupling sections are respectively connected with power and ground layer of a circuit board. The first coupling sections are connected with the first conducting section through first extending sections and the second coupling sections are connected with the second conducting section through second extending sections. At least two coupling sections of the conductive structures are arranged in pairs. The first conductive structure and the second conductive structure are arranged in a staggered array to form two wiring loops having opposite current directions, thereby generating a magnetic flux cancellation effect.
Owner:IND TECH RES INST
Circuit structural body and method for manufacturing the same
ActiveUS7154753B2Improve cooling effectSlim and simple structureSemiconductor/solid-state device detailsSolid-state devicesPower circuitsControl circuit
A circuit structural body includes a printed circuit board having a conductive pattern constituting a power circuit including a semiconductor switching element and disposed on one surface of the printed circuit board, and a conductive pattern constituting a control circuit for controlling the semiconductor switching element and disposed on the other surface of the printed circuit board. The printed circuit board has a through-hole for mounting the semiconductor switching element to both of the conductive patterns. The circuit structural body can be manufactured by a method including the step of laminating a reinforcing plate to one surface of the printed circuit board and the step of mounting the semiconductor switching element from the opposite side to the reinforcing plate.
Owner:AUTONETWORKS TECH LTD +2
Aerosol Jet (R) Printing System for Photovoltaic Applications
InactiveUS20120231576A1Reduce widthReduce thicknessSolid-state devicesSemiconductor/solid-state device manufacturingBusbarEngineering
Method and apparatus for depositing multiple lines on an object, specifically contact and busbar metallization lines on a solar cell. The contact lines are preferably less than 100 microns wide, and all contact lines are preferably deposited in a single pass of the deposition head. There can be multiple rows of nozzles on the deposition head. Multiple materials can be deposited, on top of one another, forming layered structures on the object. Each layer can be less than five microns thick. Alignment of such layers is preferably accomplished without having to deposit oversized alignment features. Multiple atomizers can be used to deposit the multiple materials. The busbar apparatus preferably has multiple nozzles, each of which is sufficiently wide to deposit a busbar in a single pass.
Owner:OPTOMEC INC
Ultra-low impedance power interconnection system for electronic packages
InactiveUS6847529B2Lower impedanceImprove reliabilitySemiconductor/solid-state device detailsSolid-state devicesSystem requirementsInterconnection
A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.
Owner:MOLEX INC
Multilayer substrate and manufacturing method thereof
ActiveUS20060057341A1Suppress mutationHigh pattern accuracySemiconductor/solid-state device detailsPrinted circuit aspectsImpedance matchingConductive materials
Owner:TDK CORPARATION
Circuit Module
ActiveUS20080080151A1Enhance board packaging densityReduce the overall diameterPrinted circuit assemblingPrinted circuit aspectsElectrical connectionControl circuit
In respect to an electrical connection between a control circuit board 20 and bus bars 14 interbonded together, it is an object to enhance stability in quality and reliability in connection. As a solution for achieving the object, the control circuit board 20 is provided with a conductor segment 26 to be electrically connected to a specific one of the bus bars 14 on the opposite side of a rear surface thereof bonded to the bus bars 14, and a through-hole 24 penetrating a main body thereof at a position adjacent to the conductor segment 26 so as to expose the specific bus bar 14 therethrough. Further, an electrically-connecting member 70 is disposed to bridge over the through-hole 24 and the conductor segment 26, and soldered onto the conductor segment 26 and the bus bar portion located in the through-hole 24.
Owner:AUTONETWORKS TECH LTD +2
Semiconductor device and method for manufacturing semiconductor device
ActiveUS20140367736A1Increase productivitySemiconductor/solid-state device detailsConversion constructional detailsElectrical conductorDevice material
A semiconductor device is a composite module in which three power semiconductor modules are arranged at a predetermined interval in the same plane and pin-shaped conductors that are drawn from the power semiconductor modules to the outside are connected to three main terminal plates such that they are integrated with each other. When the entire composite module is accommodated in a protective case and a radiation fin is provided, bolts are inserted into through holes to fix the protective case to the radiation fin. In this way, it is possible to accommodate the composite module in the protective case while reliably bringing the bottom of an insulating substrate into close contact with the radiation fin.
Owner:FUJI ELECTRIC CO LTD
Solid state lighting circuit and controls
In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.
Owner:METROSPEC TECH
Parasitic inductance reduction for multilayered board layout designs with semiconductor devices
ActiveUS20140183550A1Minimizes parasitic inductanceEliminate disadvantagesTransistorConversion constructional detailsPower semiconductor deviceMagnetic effect
A highly efficient, single sided circuit board layout design providing magnetic field self-cancellation and reduced parasitic inductance independent of board thickness. The low profile power loop extends through active and passive devices on the top layer of the circuit board, with vias connecting the power loop to a return path in an inner layer of the board. The magnetic effect of the portion of the power loop on the top layer is reduced by locating the inner layer return path directly underneath the power loop path on the top layer.
Owner:EFFICIENT POWER CONVERSION CORP
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