924results about "High current circuit adaptations" patented technology

A modular circuit board assembly is disclosed. The modular circuit board assembly comprises a substrate, a circuit board, and a component, disposed between the circuit board and the substrate, the component physically and electrically coupled to the substrate. In one embodiment, the circuit board also comprises an aperture allowing for the transmission of thermal energy from the component to a heat sink. In still another embodiment of the invention, the heat sink includes a mesa having surface features cooperatively interacting with surface features on the component or members mounted on the component to provide for location and/or retention.

A multi-layer printed circuit board (PCB) is provided allowing balanced power supply to components requiring large working current. The PCB includes a plurality of layers disposed thereon. A first power area, and a second power area are separately arranged on different layers. The first power area and the second power area vertically aligned within the PCB with generally identical shapes cooperatively provide power to components requiring large working current.

A planar coil including and insulating substrate, and a coil conductive filament having a thickness of 20 to 400 mum and formed on at least one surface of the insulating substrate, the coil conductive filament having a gap whose aspect ratio (H/G) is at least 1. The coil conductive filament has a cross-section in a substantially mushroom shape having a head and a neck, the head has a width (L) which is a least twice as large as a width (l) of the neck thereof, at most 1.5 times as large as a height of the head, and at least twice as large as a minimum spacing (G) between adjacent coil conductive filaments.

An electric power steering apparatus requires no external connecting member connecting between a power main body and a control main body, and hence can be reduced in size and cost, and the reliability of electrical connection between the power main body and the control main body can be improved. High current parts constituting the power main body and low current parts constituting the control main body are mounted on opposite sides of a circuit board, and are electrically connected with one another via conductor layers of the circuit board and through holes formed therein.

An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a higher frequency range without negatively modifying current in a lower frequency range and may reduce radiated emissions produced during operation of the integrated circuit. The filter may be implemented by arranging core-power voltage conductors and ground conductors at a first or second level interconnect into one or more voltage groupings and one or more adjacent ground groupings such that series inductance is increased. In some embodiments, the first level interconnect may include conductive bumps or pads between an integrated circuit and a substrate. In some embodiments, the second level interconnect may include solder balls, pins, pads, or other conductors of a package, socket, or interposer.

A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the flexible electrical connectors to connection points on the PCB of the energy management system. An energy management system that includes a shunt coupled to a printed circuit board using the above method is also provided.

In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance is reduced and a high frequency IC chip is loaded, electric characteristic and reliability can be improved without generating malfunction or error.

Method and apparatus for depositing multiple lines on an object, specifically contact and busbar metallization lines on a solar cell. The contact lines are preferably less than 100 microns wide, and all contact lines are preferably deposited in a single pass of the deposition head. There can be multiple rows of nozzles on the deposition head. Multiple materials can be deposited, on top of one another, forming layered structures on the object. Each layer can be less than five microns thick. Alignment of such layers is preferably accomplished without having to deposit oversized alignment features. Multiple atomizers can be used to deposit the multiple materials. The busbar apparatus preferably has multiple nozzles, each of which is sufficiently wide to deposit a busbar in a single pass.

An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.

A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process. Further, described is a process for producing a wiring board, comprising bringing a precision mold having a mold pattern on a surface of a mold base into contact with a surface of a metal thin film formed on an organic insulating base, pressing the mold to form a depression having a shape corresponding to the mold pattern of the precision mold in the organic insulating base, thereafter forming a metal plating layer having a thickness larger than the depth of the depression to fill the plating metal in the depression, and then polishing the metal plating layer until the organic insulating base is exposed, to form a wiring pattern, and a wiring pattern produced by this process.

According to this invention, a wiring board includes a conductive pattern formed from leads each of which is formed on an organic layer and has a thickness t larger than a width W.

A wiring board has a circuit pattern that includes metal foil attached to an insulating layer, and a built-up circuit pattern disposed on top of the metal foil circuit pattern. The built-up circuit pattern is an increased thickness laminate of cold spray processed metal material. Even when a power semiconductor is mounted on the built-up circuit pattern, the heat that is generated by losses therein can be diffused by the built-up circuit pattern. The wiring board has excellent heat dissipation, can be manufactured by a small number of process steps, and is of low cost.

An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The first and second conducting sections are electrically connected to a power and ground contact of an electronic device, respectively. The first and second coupling sections are respectively connected with power and ground layer of a circuit board. The first coupling sections are connected with the first conducting section through first extending sections and the second coupling sections are connected with the second conducting section through second extending sections. At least two coupling sections of the conductive structures are arranged in pairs. The first conductive structure and the second conductive structure are arranged in a staggered array to form two wiring loops having opposite current directions, thereby generating a magnetic flux cancellation effect.

A circuit structural body includes a printed circuit board having a conductive pattern constituting a power circuit including a semiconductor switching element and disposed on one surface of the printed circuit board, and a conductive pattern constituting a control circuit for controlling the semiconductor switching element and disposed on the other surface of the printed circuit board. The printed circuit board has a through-hole for mounting the semiconductor switching element to both of the conductive patterns. The circuit structural body can be manufactured by a method including the step of laminating a reinforcing plate to one surface of the printed circuit board and the step of mounting the semiconductor switching element from the opposite side to the reinforcing plate.

A multilayer substrate according to the present invention includes a plurality of laminated insulating layers and conductive patterns formed between the respective insulating layers. The conductive patterns include a first conductive pattern having a predetermined thickness and a second conductive pattern thicker than the first conductive pattern. The first and second conductive patterns are located in the same layer. The first conductive pattern is formed by pattern-etching a conductive layer having a uniform thickness by the subtractive method. The second conductive pattern is formed by forming a pattern-forming groove and then filling the inside of the pattern-forming groove with a conductive material simultaneously with forming a via hole. The first conductive pattern is suitable for an LC pattern for a high-frequency circuit requiring small variations in the width and the thickness of the pattern as well as accuracy in the thickness relative to an insulating pattern, and for a normal conductive pattern requiring impedance matching. The second conductive pattern is suitable for an L pattern for a choke coil.

A semiconductor device is a composite module in which three power semiconductor modules are arranged at a predetermined interval in the same plane and pin-shaped conductors that are drawn from the power semiconductor modules to the outside are connected to three main terminal plates such that they are integrated with each other. When the entire composite module is accommodated in a protective case and a radiation fin is provided, bolts are inserted into through holes to fix the protective case to the radiation fin. In this way, it is possible to accommodate the composite module in the protective case while reliably bringing the bottom of an insulating substrate into close contact with the radiation fin.