The present invention is applicable to the technical field of electronic devices, and provides a method for manufacturing a
metal oxide TFT device, comprising selecting a substrate and preparing a gate on the substrate; sequentially disposing an insulating layer, a
semiconductor layer and a
photoresist on the gate; The gate is a
mask, which is exposed from the back of the substrate, and the
photoresist covering the channel part of the
semiconductor layer is retained; the
electrode layer is deposited on the
semiconductor layer and the
photoresist; the photoresist and the
electrode layer covering the photoresist are peeled off to
expose channel; etch the
electrode layer and semiconductor layer to form an isolated source and drain; deposit a
passivation layer to lead out the source and drain. In the present invention, the gate is used as a
mask to realize self-alignment through back
exposure and photoresist stripping, the process is simple and the alignment accuracy is high, the
parasitic capacitance is weakened, the performance of the device is improved, and no
etching barrier layer is required. The process is simplified, the bad influence of the
etching barrier layer on the semiconductor channel is avoided, and the alignment of the
mask plate is no longer a key alignment requirement, thereby reducing the manufacturing difficulty.