The invention provides a manufacture method for a gold finger circuit board and the circuit board manufactured by the method. The manufacture method for the gold finger circuit board comprises the steps of offering a base board with a ladder groove, manufacturing a gold finger structure inside the ladder groove, wherein the gold finger structure comprises a gold finger figure and a lead wire connected with the gold finger figure, covering heat resisting solder resisting ink on the surface of the lead wire, coating heat resisting adhesive tape on the surface of the gold finger figure in an attached mode, offering a plurality of plates which are arranged inside the ladder groove in a stack mode, pressing the plurality of plates in a fit mode, milling a top plate corresponding to the adhesive tape in the stacked plates, taking out a sandwich plate clamped between the plate at the top of the plates and the heat resisting adhesive tape, removing the heat resisting adhesive tape covered on the surface of the gold finger figure, electroplating the gold finger figure, forming a gold finger, and obtaining the required gold finger circuit board. The manufacture method can accurately manufacturing the thickness of the required circuit board, can achieve manufacture of the gold finger inside the ladder groove, and is simple in process.