The invention provides a porous ultrathin
grinding wheel for
chip cutting and a preparation method thereof. The ultrathin
grinding wheel is composed of a super-hard
abrasive and a
metal-based matrix, the super-hard
abrasive comprises
diamond and cubic
boron nitride, the
metal-based matrix is a Ti-Al-based
alloy, and a porous structure on the ultrathin
grinding wheel is generated by utilizing a
Kirkendall effect reaction caused by a
diffusion rate difference between Ti / Al elements. The preparation method comprises the steps of carrying out material preparation, carrying out cold press molding, carrying out
sintering molding and carrying out
machining, wherein the
sintering molding is composed of two
sintering procedures of pore forming and performance adjusting, the sintering conditions of the pore forming procedure are 600-700 DEG C and 10-240 min, and the sintering conditions of the performance adjusting procedure are 750-1100 DEG C and 5-120 min. According to the porous ultrathin
grinding wheel for
chip cutting and the preparation method thereof, chemical bonding is achieved through mutual
diffusion of Ti elements and the super-hard
abrasive, so that the holding force of abrasive particles is improved, and the ultrathin
grinding wheel can be further thinned; and the self-
sharpening capacity of the ultrathin
grinding wheel is improved by introducing the porous structure through the
Kirkendall effect between the Ti / Al elements, so that the
cutting quality of a
chip is improved, and materials such as a pore forming agent do not need to be added, so that the production cost is reduced.