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Porous Cu-Sn-based ultra-thin grinding wheel for chip dicing and preparation method thereof

A porous, cu-sn technology, applied in the direction of manufacturing tools, metal processing equipment, grinding/polishing equipment, etc., can solve the problem that the cutting quality cannot be further improved, the thinning of the ultra-thin grinding wheel is difficult, and the self-reduction of the ultra-thin grinding wheel is reduced. Improve the self-sharpening ability, improve the quality of cutting, and improve the holding force of abrasive grains

Active Publication Date: 2021-07-09
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the mechanically embedded abrasive must ensure sufficient coating thickness, it is difficult to continue thinning the ultra-thin grinding wheel; on the other hand, Cu-based binders often need to improve the connection of mechanically embedded abrasives by increasing the density of the metal bond. Strong, dense carcass reduces the self-sharpening ability of the ultra-thin grinding wheel, resulting in the inability to further improve the cutting quality

Method used

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  • Porous Cu-Sn-based ultra-thin grinding wheel for chip dicing and preparation method thereof
  • Porous Cu-Sn-based ultra-thin grinding wheel for chip dicing and preparation method thereof

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Effect test

Embodiment 1

[0023] A method for preparing a porous Cu-Sn based ultra-thin grinding wheel for chip scribing, the ultra-thin grinding wheel is composed of a superabrasive and a metal-based matrix, the ultrathin grinding wheel has a porous structure; the superabrasive is Diamond; the volume ratio of the ultra-hard abrasive to the ultra-thin grinding wheel is 60%, and the abrasive grain size is 9-12 μm; the metal-based matrix is ​​a Cu-Sn-Ti alloy; the Cu-Sn-Ti The metal Sn content in the alloy is 15wt.%, the metal Ti content is 10wt.%, the metal Cu is the balance, and the particle size of each metal powder is 9-12 μm;

[0024] Its preparation method concrete steps are as follows:

[0025] (1) Material preparation: first accurately weigh Cu powder, Sn powder, Ti powder and superabrasive micropowder, put them into a three-dimensional vortex mixer for material mixing for 4 hours, then pass through a 200-mesh screen; then press 6% mass Then add glue, stir and mix until there is no large agglome...

Embodiment 2

[0032] A method for preparing a porous Cu-Sn based ultra-thin grinding wheel for chip scribing, the ultra-thin grinding wheel is composed of a superabrasive and a metal-based matrix, the ultrathin grinding wheel has a porous structure; the superabrasive is Cubic boron nitride; the volume ratio of the ultra-hard abrasive to the ultra-thin grinding wheel is 12.5%, and the abrasive grain size is 3-5 μm; the metal-based matrix is ​​a Cu-Sn-Ti alloy; the Cu- The metal Sn content in the Sn-Ti alloy is 20wt.%, the metal Ti content is 10wt.%, the metal Cu is the balance, and the particle size of each metal powder is 7-8 μm;

[0033] Its preparation method concrete steps are as follows:

[0034] (1) Material preparation: first accurately weigh Cu powder, Sn powder, Ti powder and superabrasive micropowder, put them into a three-dimensional vortex mixer for material mixing for 4 hours, then pass through a 200-mesh screen; then press 6% mass Then add glue, stir and mix until there is no ...

Embodiment 3

[0041] A method for preparing a porous Cu-Sn based ultra-thin grinding wheel for chip scribing, the ultra-thin grinding wheel is composed of a superabrasive and a metal-based matrix, the ultrathin grinding wheel has a porous structure; the superabrasive is Diamond; the volume ratio of the ultra-hard abrasive to the ultra-thin grinding wheel is 25%, and the abrasive grain size is 9-12 μm; the metal-based matrix is ​​a Cu-Sn-Ti alloy; the Cu-Sn-Ti The metal Sn content in the alloy is 35wt.%, the metal Ti content is 6wt.%, the metal Cu is the balance, and the particle size of each metal powder is 9-12 μm;

[0042] Its preparation method concrete steps are as follows:

[0043] (1) Material preparation: first accurately weigh Cu powder, Sn powder, Ti powder and superabrasive micropowder, put them into a three-dimensional vortex mixer for material mixing for 3 hours, then pass through a 140-mesh screen; then press 4% mass Then add glue, stir and mix until there are no large lumps, ...

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Abstract

The invention provides a porous Cu-Sn-based ultra-thin grinding wheel for chip dicing and a preparation method thereof. According to the porous Cu-Sn-based ultra-thin grinding wheel, a metal matrix tire of the ultra-thin grinding wheel is Cu-Sn-Ti alloy, and a porous structure of the ultra-thin grinding wheel is generated by utilizing a Kirkendall effect caused by a diffusion rate difference between Cu / Sn elements. The preparation method comprises the steps of material preparation, cold press molding, brazing molding and machining, wherein the brazing molding process comprises two heating procedures of pore forming and active brazing, the parameters of the pore forming procedure are 200-250 DEG C and 30-240 minutes, and the parameters of the active brazing process are 650-950 DEG C and 5-100 minutes. According to the porous Cu-Sn-based ultra-thin grinding wheel and the preparation method thereof, a metal bonding agent and a super-hard abrasive material undergo chemical metallurgical reaction by utilizing an active brazing technology, so that the holding force of abrasive particles is improved, and the ultra-thin grinding wheel can be further thinned; and the self-sharpening capacity of the ultra-thin grinding wheel is improved by introducing the porous structure through the Kirkendall effect between the Cu / Sn elements, so that the chip dicing quality is improved, and in addition, materials such as a pore forming agent do not need to be added, so that the production cost is lowered.

Description

【Technical field】 [0001] The invention relates to the technical field of manufacturing chip scribing grinding wheel tools, in particular to a porous Cu-Sn-based ultra-thin grinding wheel for chip scribing and a preparation method thereof. 【Background technique】 [0002] Wafer dicing is an important process in the semiconductor industry, which bears the economic cost of the previous multiple processes. Due to high processing efficiency, good grinding quality and low economic cost, ultra-thin grinding wheels have become irreplaceable cutting tools in the semiconductor industry. With the miniaturization and increase in capacity of semiconductor chips, the cutting space between highly dense chips is getting smaller and smaller, which will greatly increase the technical requirements for the thickness and strength of ultra-thin grinding wheels. Bonding agents for ultra-thin grinding wheels are mainly divided into three categories: resin, ceramics, and metal. Metal bonding agents ...

Claims

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Application Information

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IPC IPC(8): B24D3/10B24D3/34B24D18/00
CPCB24D3/10B24D3/342B24D18/0009B24D18/009
Inventor 李勉穆德魁徐西鹏
Owner HUAQIAO UNIVERSITY
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