A
copper palladium alloy monocrystal bonding wire and a manufacturing method thereof are disclosed. Base material of the
copper palladium monocrystal bonding wire comprises, by weight, 1.35%-10.18% of
palladium, 0.0001%-0.0003% of
Calcium, 0.0002%-0.0008% of
Rhenium and the balance
copper. The manufacturing method comprises the following steps: extracting high purity copper and high purity palladium; preparing monocrystalline copper
palladium alloy rod; plating palladium on surface; coarse drawing and fine drawing; carrying out a heat treatment; cleaning the surface;
shunting winding. The invention abandons the traditional technique: drawing firstly and then
electroplating. In the method of the invention, the monocrystalline copper
palladium alloy wire with a wire
diameter of less than 3mm is produced, then palladium layer is electroplated, and finally, the palladium
copper alloy bonding wire finished product is produced by drawing. By using the invention,
oxidation resistance of bonding
copper wire can be effectively raised; the
oxidation resistance of the bonding
copper wire can be equal to the
oxidation resistance of bonding gold wire; shelf-life of the bonding
copper wire product after being sealed off can be substantially prolonged.
Mechanical strength of
alloy finished products which are added elements, such as palladium,
calcium,
rare earth and the like, can be higher than materials produced by other ways, which is beneficial to further reduce the wire
diameter of the bonding wire and shorten
welding spacing, and is suitable for
integrated circuit package with high-density and multi-pin.