2170 results about "Melt temperature" patented technology

The present invention relates to water-dispersible materials (e.g. fibers or films) and to a method of producing same. The materials of the invention comprise a water soluble component, for example, a sulfonated polycondensate thermoplastic, and a modifying auxiliary component, for example, a low melt temperature thermoplastic.

A high density integrated circuit structure and method of making the same includes providing a first silicon substrate structure having semiconductor device formations in accordance with a first circuit implementation and metal interlevel lines disposed on a top surface thereof and a second silicon substrate structure having a second circuit implementation and metal interlevel lines disposed on a top surface thereof. The first substrate structure includes a planarized low-K dielectric disposed between the metal interlevel lines and a protective coating separating the metal interlevel lines from is the low-K dielectric, the metal interlevel lines of the first silicon substrate structure have a melting temperature on the order of less than 500 DEG C. and the low-K dielectric having a dielectric K-value in the range of 2.0-3.8. The second substrate structure also includes a planarized low-K dielectric disposed between the metal interlevel lines and a protective coating separating the metal interlevel lines from the low-K dielectric, the metal interlevel lines having a melting temperature on the order of less than 500 DEG C. and the low-K dielectric having a dielectric K-value in the range of 2.0-3.8. Lastly, the first substrate structure is low temperature bonded to the second substrate structure at respective metal interlevel lines of the first and second substrate structures.

A resin-soluble thermoplastic polymer veil toughening element for a curable composition wherein the polymer element is a non-woven veil in solid phase adapted to undergo at least partial phase transition to fluid phase on contact with a component of the curable resin matrix composition in which it is soluble at a temperature which is less than the temperature for substantial onset of gelling and/or curing of the curable composition and which temperature is less than the polymer elements melt temperature; a method for the preparation thereof, a preform support structure for a curable composition comprising the at least one thermoplastic veil element together with structural reinforcement fibers, methods for preparation thereof, a curable composition comprising the at least one thermoplastic veil element or the support structure and a curable resin matrix composition, a method for preparation and curing thereof, and a cured composite or resin body obtained thereby, and known and novel uses thereof.

Shampoo compositions comprise (a) from about 5% to about 50% of one or more detersive surfactants, by weight of the shampoo composition; (b) a dispersed gel network phase comprising, by weight of the shampoo composition, (i) at least about 0.05% of one or more fatty amphiphiles; (ii) at least about 0.01% of one or more secondary surfactants; and (iii) water; and (c) at least about 20% of an aqueous carrier, by weight of the shampoo composition. A process for preparing a shampoo composition comprises the steps of: (a) combining a fatty amphiphile, a secondary surfactant, and water at a temperature sufficient to allow partitioning of the secondary surfactant and the water into the fatty amphiphile to form a pre-mix; (b) cooling the pre-mix below the chain melt temperature of the fatty amphiphile to form a gel network; (c) adding the gel network to one or more detersive surfactants and an aqueous carrier to form a shampoo composition.

The present invention relates to technology and apparatus with high energy beam to sinter or melt and deposit material successively to realize laminated solid manufacture. The present invention features that the electronic beam scan controller controls the electronic beam to scan fast in pattern projection mode for heating powder homogeneously. Each scanning of the electronic beam has short time in the selected area, so that the scan initiating point has no great temperature change generated during the whole scanning course. Through one or several frames of scanning, the material in the forming area has temperature synchronously raised to reach the sintering or re-melting temperature for deposition onto the forming area before synchronous cooling. The present invention has greatly reduced heat stress and raised forming precision and quality.

Embodiments of the invention include a method comprising disposing a thin metallic layer having a low melting temperature between one end of a conductive post on a substrate and a conducting structure on an opposing substrate. Heated platens in contact with the substrates can apply pressure and heat to the thin metallic layer and cause it to be entirely consumed and subsequently transformed into a bonding layer having a melting temperature higher than the melting temperature of the original thin metallic layer. Prior to, during, or after the conductive post is bonded to the conducting structure, the region around the conductive post and between the substrates may be filled with a dielectric material, such as polyimide.

A controlled releasing composition comprising a plurality of microparticles and a matrix as well as the preparation method thereof is disclosed. The plurality of microparticles comprise a first material and the matrix comprises a second material. The melting temperature of the first material is higher than the melting temperature of the second material.

The present invention relates to the identification of a particular nucleotide polymorphism in a nucleic acid sample in a single reaction utilizing oligonucleotide primers with different melting temperature characteristics.

A hot-melt extruded composition having finely divided drug-containing particles dispersed within a polymeric and/or lipophyllic carrier matrix is provided. The carrier softens or melts during hot-melt extrusion but it does not dissolve the drug-containing particles during extrusion. As a result, a majority or at least 90% wt. of the drug-containing particles in the extrudate are deaggregated during extrusion into essentially primary crystalline and/or amorphous particles. PEO is a suitable carrier material for drugs insoluble in the solid state in this carrier. Various functional excipients can be included in the carrier system to stabilize the particle size and physical state of the drug substance in either a crystalline and/or amorphous state. The carrier system is comprised of at least one thermal binder, and may also contain various functional excipients, such as: super-disintegrants, antioxidants, surfactants, wetting agents, stabilizing agents, retardants, or similar functional excipients. A hydrophilic polymer, such as hydroxypropyl methylcellulose (HPMC E15), polyvinyl alcohol (PVA), or poloxamer, and/or a surfactant, such as sodium lauryl sulfate (SLS), can be included in the composition. A process for preparing the extrudate is conducted at a temperature approximating or above the softening or melting temperature of the matrix and below the point of solubilization of drug-containing particles in the carrier system, and below the recrystallization point in the case of amorphous fine drug particles.

A thermoplastic composition comprises poly(arylene ether) having an initial intrinsic viscosity greater than 0.25 dl/g as measured in chloroform at 25° C.; a polyolefin having a melt temperature greater than or equal to 120° C. and a melt flow rate of 0.3 to 15; a first block copolymer having a aryl alkylene content greater than or equal to 50 weight percent based on the total weight of the first block copolymer; a second block copolymer having an aryl alkylene content less than 50 weight percent based on the total weight of the second block copolymer; and a flame retardant, wherein the poly(arylene ether) is present in an amount greater than the amount of polyolefin. The composition is useful in the production of covered wire.