35results about How to "Strong plating ability" patented technology

The invention relates to a silver electrode paste. The silver electrode paste comprises, by mass, 25%-75% of spherical silver powder, 0%-35% of flaky silver powder, 2%-18% of glass powder and 15%-48% of organic carriers. The silver electrode paste is obtained through proper matching of the components. Experiments show that the silver electrode paste is good and stable in physical performance, low in volatility, wide in silver content range, strong in platability, wide in sintering temperature range, large in after-plating adhesive force, and stable in quality.

The invention relates to a treatment method of thermoelectric materials before welding. The treatment method is characterized by including steps of alkali wash and acid wash of a thermoelectric material sheet, coarsening of the thermoelectric material sheet, chemical nickel plating and soldering flux immersing. According to the treatment method, sodium hypophosphite is added into a solution which is subjected to chemical nickel plating, the temperatures are kept to be 85-95 DEG C, and a P-Ni alloy nickel layer which is high in binding forces, excellent in weldability and uniform in thickness is formed on the surface of the thermoelectric material sheet and used as a transition layer. When a thermoelectric refrigeration assembly manufactured by the thermoelectric material sheet and formed by welding thermoelectric elements works in the temperature environment of (-55) DEG C-115 DEG C, the thermoelectric elements can not fall off, space resistant radiation is 300 Krad (Si), and the failure rate is 200 fit. The service life of the thermoelectric refrigeration assembly can reach 15 years in the working environment, and the thermoelectric refrigeration assembly can be widely applied to electrical devices with high reliability and long service life.

The invention discloses a preparation method of a cyanide-free zinc-plating brightener special for a sylvite system. The preparation method comprises the following steps that (A) 13.6-27.2 g of organic aldehyde compound, 45.8-75.8 g of secondary solvents and 300-500 ml of water are added into a reaction vessel, then heating is conducted, and the temperature rises to 40-50 DEG C, 10.5-22.5 g of reductive drug solution is dropped, and the dropping time is 50-80 minutes; (B) after dropping of the reductive drug solution is completed, the temperature of the reaction vessel rises to 80-85 DEG C, and after heat preservation and stirring for reacting are conducted for 6-10 hours under the temperature of 80-85 DEG C, a first step reaction intermediate can be obtained; (C) then 12.4-24.6 g of phytic acid aqueous solution is slowly dropped into the first step reaction intermediate, and the dropping time is 30-40 minutes; and (D) after dropping is completed, the reaction temperature is 70-90 DEGC, constant temperature is kept for 3-4 hours, cooling and recovery are conducted, and the cyanide-free zinc-plating brightener is obtained. According to the brightener obtained through the preparation method of the cyanide-free zinc-plating brightener, the deposition rate of a plating can be increased stably, brittleness of the plating is low, the working temperature range is wide, environment pollution is very little, and the brightener is beneficial to environmental protection.

The invention discloses a technique for continuously producing a nickel-zinc electroplated anti-fingerprint plate, which comprises the following steps: carrying out alkaline nickel electroplating on a substrate steel plate, and carrying out acidic zinc electroplating. The electroplating section technique is organically added into the production line to continuously produce the nickel-zinc electroplated anti-fingerprint plate. The product obtained by using the technique has the advantages of smooth surface, uniform and fine plating crystal, high bonding strength, high adhesive force, high corrosion resistance and excellent mechanical properties, and is especially applicable to harsh environments, such as high heat, high coldness, high humidity, strong heat and the like.

The invention discloses a Ni-Cu-P ternary alloy coating serving as a welding spot reaction barrier layer and an electroplating preparation technology thereof. The Ni-Cu-P ternary alloy coating serving as the welding spot reaction barrier layer comprises the following components in percentage by weight: 70-90% of Ni, 3-10% of Cu and 7-20% of P. The thickness of the coating is 2-15mu m. The preparation method comprises the following steps of: putting an electroplated cathode piece (metallized Si chip or Cu piece) and an electroplated anode sheet (Pt piece) into electroplate liquid; introducing dipulse current for dipulse electroplating; and forming an Ni-Cu-P alloy coating on the surface of the cathode piece. The components of the Ni-Cu-P alloy coating prepared by using the electroplating preparation technology conform to the use requirement of a welding spot reaction barrier layer for electronic packaging and interconnection, the coating and the cathode piece substrate (metallized Si chip or Cu piece) are tightly combined, a plating layer is flat, and the Ni-Cu-P ternary alloy coating is fine in cellular tissue, even in thickness, and compact in structure and is basically free from holes.

Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.