Copper electroplate liquid and preparation method thereof
A technology of copper electroplating solution and solution, applied in the field of copper electroplating solution and preparation, can solve the problems of easy scorching, toxicity of electroplating solution, poor ductility of coating layer, etc.
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Embodiment 1
[0028] The formula of this electroplating solution is as follows: copper sulfate 80g / L, cupric chloride 50g / L, sodium sulfate 40g / L, potassium sulfate 60g / L, brightener 5g / L, wetting agent 5g / L, buffering agent 25g / L, Add deionized water to 1000ml.
[0029] The preparation method of the copper electroplating solution is to weigh an appropriate amount of wetting agent according to the formula, add deionized water, and stir until dissolved; then weigh an appropriate amount of silver nitrate, potassium sulfate, and sodium sulfate and add them to the above solution, and stir at room temperature until dissolved; then heat the above solution to 65°C with a water bath, add an appropriate amount of brightening additives, adjust the pH value of the solution with a buffer, and stir evenly.
Embodiment 2
[0031] The formula of this electroplating solution is as follows: copper sulfate 97g / L, copper chloride 60g / L, sodium sulfate 47g / L, potassium sulfate 75g / L, brightener 11 g / L, wetting agent 8.5g / L, buffering agent 32g / L L, add deionized water to 1000ml.
[0032] The preparation method of the copper electroplating solution is to weigh an appropriate amount of wetting agent according to the formula, add deionized water, and stir until dissolved; then weigh an appropriate amount of silver nitrate, potassium sulfate, and sodium sulfate and add them to the above solution, and stir at room temperature until dissolved; then heat the above solution to 65°C with a water bath, add an appropriate amount of brightening additives, adjust the pH value of the solution with a buffer, and stir evenly.
Embodiment 3
[0034] The formula of this electroplating solution is as follows: copper sulfate 114g / L, copper chloride 70g / L, sodium sulfate 54g / L, potassium sulfate 90g / L, brightener 17 g / L, wetting agent 12g / L, buffering agent 39 g / L L, add deionized water to 1000ml.
[0035] The preparation method of the copper electroplating solution is to weigh an appropriate amount of wetting agent according to the formula, add deionized water, and stir until dissolved; then weigh an appropriate amount of silver nitrate, potassium sulfate, and sodium sulfate and add them to the above solution, and stir at room temperature until dissolved; then heat the above solution to 65°C with a water bath, add an appropriate amount of brightening additives, adjust the pH value of the solution with a buffer, and stir evenly.
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