31results about How to "The electroplating process is simple" patented technology

The invention relates to a plastic plating method, in particular to a method for implementing semi-dry plating on the surface of a plastic substrate, realizing the surface metallization of a plastic material, simplifying a plating process, greatly reducing wastewater discharge amount, lessening environmental pollution and expanding the range of platable plastic substrates. The method comprises the following steps of: cleaning and dedusting the plastic substrates without using water; carrying out primary activation treatment to the plastic substrate surface; sequentially carrying out the treatment of a PVD (Physical Vapor Deposition) metalized bottom layer, an alloy transition layer and a metal conductive layer to the plastic substrate surface subjected to the activation treatment; carrying out ultrasonic washing and secondary activation treatment to the treated plastic substrate; directly electroplating acid copper on the treated plastic substrate or transferring in a nickeling bath to implement nickeling; transferring the treated plastic substrates into a chromeplating bath for final chromium plating or transferring in a PVD furnace for depositing a chromium layer.

The invention discloses a nickel-nano-diamond composite plating solution, which is composed by the blending of the modified nano-diamond water or dilute sulfuric acid solution and the water solution of nickel sulfate, nickel chloride, boric acid, saccharin and butynediol with the size ratio 0.1-2:22. The invention also discloses the preparation method of the composite plating solution. The composite plating solution of the invention has a high degree of stability, in which the key issues existed in the nano-diamond composite plating technique, that the nano-diamond is easy to be in agglomeration and settlement and the plating solution is unstable, are resolved. Moreover the stable control of the structure and properties of the composite coating is faciliated. During the preparation process, the ultrasound technology and the organic surface-active agent are not required to adopt, which is not only help reduce the plating cost and simplify the plating technique, but also the environmental problems resulted from the adoption of the organic surface-active agents comprising sulfur, phosphorous and other elements are avoided. The composite coating obtained from the plating solution through a simple plating process is bright and smooth. Compared with the coating that has no nano-diamond and is obtained under the same conditions, the micro-hardness of the composite coating can be increased at most by 38%, and the coefficient of friction can be reduced by 29%.

The invention discloses an electroplating process. The electroplating process comprises the following steps of: providing a plastic matrix; forming a paint layer containing a metal powder and a paint on the surface of the plastic matrix by spraying; performing laser irradiation treatment on the paint layer to change the paint layer into a combined coating; and performing electroplating on the surface of the combined layer to form an electroplated layer. The electroplating process is simple, the manufacturing procedures of coarsening and activating of the conventional electroplating process are reduced, and special limits on the material of the plastic matrix are not required. Additionally, the invention further provides an electroplated part prepared by the process aforementioned.

The embodiment of the invention discloses an Au-Pd alloy electroplating solution which comprises an Au salt, a Pd salt, a chelating agent and conducting salts. The Au-Pd alloy electroplating solution comprises the following components: 0.1-20g / l of Au salt based on the content of a single substance Au, 0.1-15 g / L of Pd salt based on the content of a single substance Pd, 30-300 g / L of chelating agent and10-30 g / L of conducting salt, wherein based on the content of metal substance, the mass ratio of gold salt to palladium salt is (0.5-20):1. In addition, the invention also discloses the preparation method and the electroplating process of the Au-Pd alloy electroplating solution. By using the Au-Pd alloy electroplating solution and electroplating process thereof, the process is simple, and an obtained Au-Pd alloy electroplating layer has the advantages of high electrical conductivity, strong wear resistance and corrosion resistance, metal white or light golden yellow appearance, and the like.

The invention relates to a method for forming a nickel-tungsten alloy coating, comprising the following steps: placing a workpiece to be plated and an anode material into an electroplating solution for electroplating, so as to form a nickel-tungsten alloy coating on the surface of the workpiece; the electroplating solution includes the following components: nickel Salt, tungstate, complexing agent and anode stabilizer; the complexing agent is selected from citric acid and / or citrate; the anode stabilizer is an enamine compound. The invention discloses a method for forming a nickel-tungsten alloy coating that can not only prolong the service life of an electroplating solution, but also form a dense and bright coating on a workpiece.

The invention provides an electroplating method of carrying out La-TiO2-Ag layer cyanide-free composite electroplating on the surface of a steel base material. The electroplating method is safe and environment-friendly, a preparation technology is simple, a La-TiO2-Ag layer is flat and smooth in surface, a coating is compact, is uniform in structural components and good in surface quality and presents metallic luster, the effect of the coating using a hydantoin series electroplating solution is far higher than that of a coating using a similar cyanide-free electroplating solution system, the stability of the electroplating solution is high, the corrosion resistance and the oxidation resistance are high, and the La-TiO2-Ag layer has better antibacterial and bactericidal performance.

The invention provides a miniature planar dual-frequency-band high precision satellite navigation antenna. The miniature planar dual-frequency-band high precision satellite navigation antenna includesa dielectric plate and a printed circuit base plate, wherein the dielectric plate includes a plurality of high frequency feeding points, a high frequency radiating surface, a plurality of low frequency feeding points, and a low frequency radiating surface; short circuit pins are distributed in the inner ring of the low frequency radiating surface; upward branch knots and downward branch knots aredistributed around the dielectric plate; the upward branch knots contact the printed circuit base plate; the downward branch knots are connected to the low frequency radiating surface; and coupling slits are formed between the upward branch knots and the downward branch knots. The miniature planar dual-frequency-band high precision satellite navigation antenna preferably solves the problems of antenna miniaturization, dual-frequency-band, antenna phase center elevation and the like, provides a design scheme for the miniature planar dual-frequency-band of the high precision satellite navigation antenna, effectively reduces the volume of the antenna, and effectively reduces the weight of the antenna at the same time.

The invention relates to a PC / ABS material with high binding force and easy to electroplate and a preparation method thereof. The PC / ABS material is prepared from the following components by a weight ratio: 33.4 to 61.3 percent of PC, 20 to 30 percent of ABS, 15 to 30 percent of modified carbon fiber, 3 to 5 percent of compatilizer, 0.2 to 0.5 percent of dispersant, 0.3 to 1 percent of antioxidant and 0.2 to 0.5 percent of lubricant. The preparation method of the PC / ABS material comprises the following steps of mixing all the components into a mixing agitator according to a proportion to carry out mixing; blending and granulating an obtained mixture through a twin screw extruder. The method provided by the invention is simple, easy and feasible; the dispersion, in a PC / ABS matrix, of the carbon fiber is promoted through the introduction of the compatilizer, so that the excellent electric conduction performance can be given to a PC / ABS alloy composition through a minute quantity of the carbon fiber; the linear expansion coefficient of the composition is decreased; an electroplating procedure can be directly carried out; coarsening, activating and chemical plating procedures are omitted; the electroplating procedure is simplified; a product composition provided by the invention has high mechanical strength; further, the dimensional stability is good.

The invention belongs to the technical field of nanomaterial processing and non-metal surface electroplating, and in particular relates to a nano-conductive carbon paste for surface electroplating of non-metal insulating materials and a preparation method thereof, comprising conductive carbon black, nonylphenol polyoxyethylene ether, polyvinylpyrrolidone , Styrene acrylate emulsion, tetraethyl orthosilicate and water. Coating the conductive carbon paste prepared by the present invention on the surface of non-metal substrate can save the process of sensitization, activation and electroless metal plating, without using formaldehyde as reducing agent, without using expensive metals such as palladium and silver, which greatly simplifies The electroplating process reduces the cost of electroplating and reduces the pollution to the environment.

The invention discloses a Ni-Cu-P ternary alloy coating serving as a welding spot reaction barrier layer and an electroplating preparation technology thereof. The Ni-Cu-P ternary alloy coating serving as the welding spot reaction barrier layer comprises the following components in percentage by weight: 70-90% of Ni, 3-10% of Cu and 7-20% of P. The thickness of the coating is 2-15mu m. The preparation method comprises the following steps of: putting an electroplated cathode piece (metallized Si chip or Cu piece) and an electroplated anode sheet (Pt piece) into electroplate liquid; introducing dipulse current for dipulse electroplating; and forming an Ni-Cu-P alloy coating on the surface of the cathode piece. The components of the Ni-Cu-P alloy coating prepared by using the electroplating preparation technology conform to the use requirement of a welding spot reaction barrier layer for electronic packaging and interconnection, the coating and the cathode piece substrate (metallized Si chip or Cu piece) are tightly combined, a plating layer is flat, and the Ni-Cu-P ternary alloy coating is fine in cellular tissue, even in thickness, and compact in structure and is basically free from holes.

The invention belongs to the technical field of metal surface treatment, and discloses a method for rapid electrolytic-deposition of a coating on a surface of a magnesium alloy. According to the method, sand blasting equipment is adopted for carrying out sand blasting treatment on the surface of the magnesium alloy, then ultrasonic cleaning is carried out on the surface of the magnesium alloy, anda coating material is sprayed on the surface of the magnesium alloy which is subjected to the sand blasting treatment by adopting a cold spraying method; the working gas of the cold spraying is compressed air, wherein the pressure is 0.6 MPa to 0.8 MPa, the preheating temperature of the cold spraying gas is 400-600 DEG C, the powder feeding distance is 10 mm, the relative moving speed of a nozzleis 600-2000 mm / min, and a cold-sprayed copper-based coating is prepared; and the cold-sprayed copper-based coating is placed in an electroplating solution, electroplating parameters are set, and a composite coating of a copper base and an electroplating layer is prepared through electroplating. The composite coating is good in microstructure and stable in physical property, the bonding strength of the cold-sprayed coating and the base material is high, the thickness of the cold spraying layer and the base material is controllable, and the composite coating has excellent corrosion resistance and wear resistance. According to the method, the electroplating process of the magnesium alloy is simplified, and the pollution to the environment is reduced.

The invention discloses a pedestal pan type quick physical examination device which comprises a pedestal pan main body and a pedestal pan ring at an upper opening of the pedestal pan main body, wherein the physical examination device further comprises a supporting connecting rod, handrails and a physical examination test device; a left leg electrode and a right leg electrode in the test device are arranged on left and right surfaces of the pedestal pan ring; the supporting connecting rod is arranged on the rear side of the pedestal pan ring and is fixedly connected with the pedestal pan main body; the handrails and the supporting connecting rod are connected with each other and are arranged on the two sides of the pedestal pan ring; left arm and right arm test electrodes in the test device are arranged on fore knuckle arm supporting surfaces of the two handrails; a supporting rod is arranged at one end of the supporting connecting rod; a blood pressure cuff of the test device is mounted on the supporting rod. According to the invention, the test devices for various physiological parameters, such as electrocardio, blood pressure and blood oxygen, are integrated into a pedestal pan structure, so that the usage of various accessories is reduced, the system integration degree is high, the fault rate is reduced, the daily physiological parameter test is convenient and the device is specially fit for the aged and disabled people.

The invention provides a cyanide-free composite electroplating method for plating a RE-TiO2-Ag layer on the surface of a steel substrate. RE rare earth element is selected from La<3+>, Pr<3+>, Gd<3+> or Yb<3+>, and titanium oxide is from titanium oxide powder with the size of 20-100nm or a titanium oxide sol solution. The electroplating method is safe and environment-friendly, the preparation process is simple, and an obtained electroplated layer is uniform, compact, strong in corrosion resistance and strong in oxidation resistance and has relatively good antibacterial and bactericidal properties.