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Au-Pd alloy electroplating solution as well as preparation method and electroplating process thereof

A technology of gold-palladium alloy and electroplating process, which is applied in the field of gold-palladium alloy electroplating solution and its preparation, and electroplating technology, and can solve the problems of reducing the conductivity, solderability and corrosion resistance of the coating, complex process and control, etc.

Active Publication Date: 2012-09-19
RAMBO NANOTECH SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Alloy electroplating of various metals requires complex processes and control. Moreover, alloy coatings prepared with gold, palladium and other metals will sacrifice more of the properties of pure gold coatings in terms of function, such as reducing the conductivity of the coating, Solderability and corrosion resistance

Method used

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  • Au-Pd alloy electroplating solution as well as preparation method and electroplating process thereof
  • Au-Pd alloy electroplating solution as well as preparation method and electroplating process thereof
  • Au-Pd alloy electroplating solution as well as preparation method and electroplating process thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0106] A kind of preparation method of gold-palladium alloy electroplating solution, the gold concentrated solution that elemental gold content is 750g and the palladium concentrated solution that elemental palladium content is 300g are mixed, then add ethylenediamine 6kg in mixed solution, add sodium acetate conductive salt 2kg, auxiliary agent 0.5kg, then add a small amount of deionized water to make up to 100L, mix evenly, obtain the gold-palladium alloy electroplating solution whose mass ratio of gold concentrated solution and palladium concentrated solution is 2.5:1 in terms of metal element content.

Embodiment 2

[0108] A kind of preparation method of gold-palladium alloy electroplating liquid is that the gold concentrated solution that elemental gold content is 900g and the palladium concentrated solution that elemental palladium content is 400g are mixed, then add triethanolamine 6kg in mixed solution, add ammonium acetate conductive salt 2kg, Auxiliary agent 3kg, then add a small amount of deionized water to make the volume 100L, mix evenly, obtain the gold-palladium alloy electroplating solution whose mass ratio of gold concentrated solution and palladium concentrated solution is 2.25:1 in terms of metal element content.

Embodiment 3

[0110] A kind of preparation method of gold-palladium alloy electroplating liquid, the gold concentrated solution that elemental gold content is 1000g and the palladium concentrated solution that elemental palladium content is 200g are mixed, then add triethanolamine 10kg in mixed solution, add potassium citrate conductive salt 1kg , auxiliary agent 2kg, then add a small amount of deionized water to be fixed to 100L, mix uniformly, obtain the gold-palladium alloy electroplating solution that the ratio of gold concentrated solution and palladium concentrated solution mass is 5: 1 in metal elemental content.

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Abstract

The embodiment of the invention discloses an Au-Pd alloy electroplating solution which comprises an Au salt, a Pd salt, a chelating agent and conducting salts. The Au-Pd alloy electroplating solution comprises the following components: 0.1-20g / l of Au salt based on the content of a single substance Au, 0.1-15 g / L of Pd salt based on the content of a single substance Pd, 30-300 g / L of chelating agent and10-30 g / L of conducting salt, wherein based on the content of metal substance, the mass ratio of gold salt to palladium salt is (0.5-20):1. In addition, the invention also discloses the preparation method and the electroplating process of the Au-Pd alloy electroplating solution. By using the Au-Pd alloy electroplating solution and electroplating process thereof, the process is simple, and an obtained Au-Pd alloy electroplating layer has the advantages of high electrical conductivity, strong wear resistance and corrosion resistance, metal white or light golden yellow appearance, and the like.

Description

technical field [0001] The invention relates to the field of metal electroplating, in particular to a gold-palladium alloy electroplating solution, a preparation method thereof and an electroplating process. Background technique [0002] At present, in the electronics industry, pure gold electroplating film is widely used in the surface treatment of electrical contact parts due to its good conductivity, weldability, ductility and excellent corrosion resistance, in order to obtain low contact resistance, Electronic products with good electrical conductivity, corrosion resistance and high long-term stability. However, in recent years, the price of gold has continued to rise, resulting in an increase in the cost of gold plating. Therefore, most of the improvement of the gold plating process starts from the aspect of saving the amount of gold used. Among them, the thinning of the gold coating is to compensate for the rising cost of raw materials. However, if the coating is too ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/62
Inventor 郭振华郭艳华仇荣宗张骅
Owner RAMBO NANOTECH SHENZHEN
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