The invention discloses a heat radiating process method for a printed-circuit board, belongs to
electron technology, and applies to the technical field of
avionics. The a
cold plate is bonded on a printed-circuit board through a dedicated bonding device, a component is enabled to grovel on the
cold plate, and heat radiating is carried out through the bonding membrane material and the
cold plate, wherein the membrane material is arranged among the printed-circuit board base materials, the
metal conducting materials on the inner portion and the surface of the printed-circuit board, the printed-circuit board and the cold plate. The cold plate is formed by arranging holes in an
aluminium alloy plate according to the
welding locating of the components of the printed-circuit board through hard
anodic oxidation surface treatment. The bonding material between the printed-circuit board and the cold plate is a
polyimide double-faced
adhesive membrane. The bonding device is a convex thick steel mold plate and a concave thick steel mold plate with a certain curvature, and enables the printed-circuit board and the cold plate can be completed a flattening function simultaneously with bonding. The heat radiating process method for the printed-circuit board achieves the
processing of the bonding and the flattening of the cold plate and the printed-circuit board at one time, solves the problem of product performance deterioration due to the fact that heat emitted by component after being powered on can not be released in time, increases the
mechanical strength, the
antiseptic property and the insulating property of the printed-circuit board, and restrains the layer splitting and the deformation of the printed-circuit board generated by high-
temperature wave soldering.