Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Surface installation module

A surface-mounted, process edge technology, applied in the direction of assembling printed circuits with electrical components, electrically connecting printed components, printed circuit components, etc., can solve problems such as warping and deformation of circuit boards

Inactive Publication Date: 2011-04-20
SHANGHAI SIMCOM LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a surface mount (SMT) module, which has a reinforcement structure, to improve the warping deformation problem of the circuit board in the existing SMT module

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface installation module
  • Surface installation module
  • Surface installation module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Please refer to figure 1 and figure 2 , which are respectively the front and back schematic diagrams of a surface mount (SMT) module according to a preferred embodiment of the present invention. As shown in the figure, the SMT module includes a process side 10 and a circuit board 20 , wherein the circuit board 20 is located inside the process side 10 , and there is a hollow area 30 between the circuit board 20 and the process side 10 . A plurality of pad groups 40 are provided on the edge of the circuit board 20 (for the sake of clarity, only three groups are marked in the figure, and the other three groups of symmetrical pad groups are not marked here). The circuit board 20 and the process side 10 are connected by a plurality of first rib groups 50 and a plurality of second rib groups 60, wherein the plurality of first rib groups 50 and the plurality of pad groups 40 are arranged at intervals. A second rib group 60 (for the sake of clarity, only three groups are mar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a surface installation module which comprises a process edge, a circuit board, a plurality of bonding pad groups, a plurality of first reinforcing rib groups and a plurality of second reinforcing rib groups, wherein the circuit board is positioned in the process edge, and a hollow area is arranged between the circuit board and the process edge; the bonding pad groups are arranged at the edge of the circuit board; the first reinforcing rib groups are spaced with the bonding pad groups and connected between the process edge and the circuit board; and the second reinforcing rib groups correspond to the bonding pad groups and are connected between the process edge and the circuit board. Accordingly, the connection between the circuit board and the process edge is realized by two kinds of reinforcing rib groups so that the circuit board is provided with more warping resistant stress points, thereby improving the warping resistant design of the circuit board in a lower-cost and convenient way and effectively solving the problem of warping deformation of the circuit board.

Description

technical field [0001] The invention relates to the technical field of surface mount (SMT), in particular to a surface mount module with a reinforced structure. Background technique [0002] At present, circuit boards packaged by surface mount (SMT) technology are more and more favored by customers, but such circuit boards inevitably suffer from warping and deformation. The warping and deformation of the circuit board can easily cause the components installed on the circuit board and its printed circuit to loosen or even be damaged, which will lead to a decrease in the pass rate and service life of the product, and will also lead to a decrease in the solderability of the circuit board. Decline. Contents of the invention [0003] The purpose of the present invention is to provide a surface mount (SMT) module, which has a reinforcement structure, so as to improve the problem of warping and deformation of the circuit board in the existing SMT module. [0004] In order to so...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/34
Inventor 李卫星
Owner SHANGHAI SIMCOM LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com