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A kind of 3D printing light curing resin

A light-curing resin and 3D printing technology, which is applied in the direction of additive processing, can solve the problems of parts deformation and affecting precision, and achieve the effects of improving molding precision, solving warping deformation, and improving mechanical properties

Active Publication Date: 2020-04-10
XI AN JIAOTONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the change of the internal molecular structure of the light-curing resin during the curing process, curing shrinkage occurs, which leads to deformation of the parts and affects the accuracy

Method used

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  • A kind of 3D printing light curing resin
  • A kind of 3D printing light curing resin
  • A kind of 3D printing light curing resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A 3D printing photocurable resin, wherein the mass percentages of each component are: 30% bisphenol A type E-51 epoxy resin, 20% alicyclic epoxy resin, 5% 1,6-hexanediol diacrylic acid Esters, 5% trimethylolpropane triacrylate, 20% 3-hydroxymethyl-1-oxetane, 10% 2-hydroxymethyloxetane, 5% benzoin dimethyl ether, 5 % Rigid Polysiloxane.

Embodiment 2

[0019] A 3D printing photocurable resin, wherein the mass percentages of each component are: 30% bisphenol A type E-51 epoxy resin, 30% alicyclic epoxy resin, 10% 1,6-hexanediol diacrylic acid Esters, 5% trimethylolpropane triacrylate, 6% 3-hydroxymethyl-1-oxetane, 6% 2-hydroxymethyloxetane, 5% benzoin dimethyl ether, 8 % Rigid Polysiloxane.

Embodiment 3

[0021] A 3D printing photocurable resin, wherein the mass percentages of each component are: 40% bisphenol A type E-51 epoxy resin, 30% alicyclic epoxy resin, 5% 1,6-hexanediol diacrylic acid Esters, 5% trimethylolpropane triacrylate, 5% 3-hydroxymethyl-1-oxetane, 5% 2-hydroxymethyloxetane, 5% benzoin dimethyl ether, 5% % Rigid Polysiloxane.

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Abstract

A 3D printing photocurable resin, comprising 50-80% by mass of epoxy resin, 5-20% by mass of acrylate prepolymer, and 10-40% by mass of reactive diluent, The mass percent content is 1-6% photoinitiator, the mass percentage content is 2-15% filler, the filler is rigid polysiloxane, and the rigid polysiloxane cage structure acts as a skeleton or support, thereby reducing the volume of the material Shrinkage, and because its side group has acrylic group, it can be uniformly dispersed in the main resin, and has good compatibility with the resin, improving the mechanical properties, and will not reduce shrinkage like ordinary inorganic fillers, but due to inorganic and Poor organic compatibility leads to lower mechanical properties.

Description

technical field [0001] The invention relates to the technical field of photocurable resins, in particular to a 3D printing photocurable resin. [0002] technical background [0003] 3D printing technology, also known as additive manufacturing technology, is a technology for manufacturing three-dimensional products by adding materials layer by layer through 3D printing equipment based on the designed 3D model. 3D printing integrates cutting-edge technologies in many fields such as digital modeling technology, electromechanical control technology, information technology, material science and chemistry. It is a kind of rapid prototyping technology and is known as the core technology of the "third industrial revolution". Due to the change of the internal molecular structure of the photo-curable resin during the curing process, curing shrinkage occurs, which leads to deformation of the parts and affects the accuracy. Therefore, the development of a resin with low shrinkage during...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L51/08C08L83/04C08F283/10C08F222/14B33Y70/10
CPCC08F283/10C08L51/08B33Y70/00C08L83/04C08F222/103C08F222/102
Inventor 段玉岗康小青
Owner XI AN JIAOTONG UNIV
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