The invention discloses a preparation method of a multilayer
ceramic circuit board. The multilayer
ceramic circuit board is formed by stacking and bonding a plurality of electroplated
ceramic substrates (DPC). The method comprises the following steps: firstly, preparing a DPC
ceramic substrate containing a surface circuit layer and vertical
interconnection metal columns through a pattern
electroplating process; then preparing a
metal solder on the circuit layer of the DPC
ceramic substrate, stacking and aligning a plurality of DPC ceramic substrates, and then bonding to realize mechanical stable connection and electric
interconnection between the DPC ceramic substrates; and finally, filling high-temperature-resistant insulating glue between the DPC substrates, and curing to obtain the multi-layer ceramic circuit board. By utilizing the characteristics of good heat conduction /
heat resistance, high pattern precision, vertical
interconnection and the like of the DPC ceramic substrates, mechanical connection and electric interconnection between the DPC substrates are realized through
metal bonding, the multilayer ceramic circuit board with high reliability and high precision is prepared, and the requirements of
miniaturization and integrated packaging of power devices are met.