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162results about How to "Increase nucleation density" patented technology

Metal-organic framework (MOF) material for permeating and separating gases and preparation method thereof

The invention discloses a metal-organic framework (MOF) material for permeating and separating gases and a preparation method thereof. Specifically, an MOF film disclosed by the invention is provided with a functional group, which contributes to nucleating on a substrate, increase the nucleating density on the substrate and contributes to the growth of a dense film; and the functional group can coact with certain specific gases, so that selective permeation of gases is facilitated. Due to the adoption of a film preparation method disclosed by the invention, the growing process of the film is simplified, the structure and shape of the film are optimized simultaneously, and film permeating and separating performance is enhanced. The MOF film prepared with the method has the advantages of high permeation amount, high separating coefficient, low energy consumption and avoidance of secondary pollution, and is particularly suitable for permeating and separating gases such as H2, CO2, CH4 and the like.
Owner:宁波大膜科技有限公司

Wide-range thin-wall series-6 aluminum alloy section for high speed train and preparation method of wide-range thin-wall series-6 aluminum alloy section

ActiveCN108893661AHigh extrusion force per unit areaReduce deformation resistanceIngot castingUltimate tensile strength
The invention belongs to the technical field of preparation of aluminum alloy sections, and relates to a wide-range thin-wall series-6 aluminum alloy section for a high speed train and a preparation method of the wide-range thin-wall series-6 aluminum alloy section. Aluminum alloy comprises the following elements in percentages by weight: 0.50-0.65% of Si, less than or equal to 0.25% of Fe, less than or equal to 0.10% of Cu, 0.03-0.15% of Mn, 0.45-0.55% of Mg, less than or equal to 0.05% of Cr, less than or equal to 0.05% of Zn, less than or equal to 0.10% of Ti, less than or equal to 0.05% ofa single impurity, less than or equal to 0.15% of total impurities and the balance of Al. Deformation resistance and friction resistance in an extruding process are reduced by reasonably controllingthe temperature relationship of an ingot casting, an extrusion barrel and a die, the extruding speed is increased to be 8-13 m/min, the quenching temperature of the product is ensured, thus, any coarse grain rings are not generated when a thin-walled apron board is extruded at high speed, after being subjected to on-line quenching, the product is directly subjected to artificial ageing at the temperature of 175+/- 5 DEG C for 4-8 hours, the mechanical property of the product can meet requirements in TB/T.3260.4-2011 TO 1.2 mm thin-walled sections, the actual tensile strength reaches 250-270 MPa, the yield strength reaches 210-230 MPa, the specific elongation is 8-10%, and the grade of the grain size of an aluminum section microscopic structure reaches and even exceeds 4.
Owner:中铝特种铝材(重庆)有限公司

Diamond / W-C gradient structure composite coating and preparing method thereof

The invention discloses a composite coating of diamond / W-C gradient structure, and a preparation method thereof. The composite coating is characterized in that a composite coating which takes a W-C gradient structure as a transition layer and takes a diamond coating as a wearable coating is formed on a WC-Co hard alloy; the preparation method comprises the steps as follows: the hard alloy is used as a sample; a surface layer WC is dipped in Murakami reagent so as to form a Co-rich layer; subsequently, pure tungsten is taken as target material and argon and carbonaceous gas are used as reaction gases to prepare the W-C gradient structure of different structures as the transition layer by a reaction sputtering method by adjusting the concentration of carbonaceous active gas in the reaction gas, thus preparing the diamond wearable coating by a chemical vapor deposition technique. The composite coating solves the problem of the bonding strength of the film / substrate and ensures the surface smoothness of the diamond film.
Owner:CENT SOUTH UNIV

Thin-wall 6-series aluminum profile for rail transit vehicle body and preparation method thereof

ActiveCN108950322AFully overfedFull solid solution effecSurface layerNucleation
The invention belongs to the technical field of aluminum alloy manufacturing, and relates to a thin-wall 6- series aluminum profile for a rail transit vehicle body and a preparation method thereof. The aluminum alloy comprises the following components in percentage by weight, 0.5-0.65% of Si, less than or equal to 0.25% of Fe, less than or equal to 0.10% of Cu, 0.03-0.15% of Mn, 0.45-0.55% of Mg,less than or equal to 0.05% of Cr, less than or equal to 0.05% of Zn, less than or equal to 0.10% of Ti, less than or equal to 0.05% of a single impurity, less than or equal to 15% of total impuritiesand the balance Al. The temperature of the homogenization treatment is 550-580 DEG C, the content of elements such as Mn and Cr is reduced, the recrystallization temperature in the alloy extrusion process is reduced, the nucleation density and the proportion of recrystallization of the aluminum profile in the wall thickness direction during extrusion of the aluminum profile are increased, the characteristic that recrystallization is easy to occur when the thin-wall sectional materials are extruded is fully utilized, a product with the uniform and consistent surface layer core grain structureis obtained in the extrusion process, and the method for improving the recrystallization temperature of the alloy by increasing the content of Mn and Cr elements is subverted.
Owner:中铝特种铝材(重庆)有限公司

Surface Preparation for Thin Film Growth by Enhanced Nucleation

Various processes and related systems are provided for making structures on substrate surfaces. Disclosed are methods of making a structure supported by a substrate by providing a substrate having a receiving surface and exposing at least a portion of the receiving surface to output from a remote plasma of an inert gas. The remote plasma has an energy low enough to substantially avoid etching or sputtering of the receiving surface but sufficient to generate a treated receiving surface. The treated surface is contacted with a deposition gas, thereby making the structure supported by the substrate.
Owner:THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS

Perfluoropolyether, touch screen and fingerprint-proof membrane containing perfluoropolyether membrane and preparation thereof

The invention provides a method for preparing perfluoropolyether through carrying out ring opening polymerization on tetrafluoro oxetane and the perfluoropolyether thereby. According to the method, the ring opening polymerization of the tetrafluoro oxetane is initiated by using fluoride salt as an initiator and a perfluoropolyether chemical compound F-(OCF2CF2CF2)n-CF2CF3 is collected through controlling the vacuum degree and the distillation temperature, where the n=2-30. The invention provides a method for applying the perfluoropolyether material to a fingerprint-proof membrane for touch screens at the same time. According the method, a buffer layer is formed on a glass substrate after being subjected to O2 glow discharge bombardment and a perfluoropolyether membrane is formed on the upper surface of the buffer layer, wherein the buffer layer is a PECVD (Plasma Enhanced Chemical Vapor Deposition)-deposited SiO2 film. A good adhesive force is provided between the SiO2 buffer layer and the glass substrate through depositing the SiO2 buffer layer by utilizing PECVD, so that the adhesive force between the perfluoropolyether fingerprint-proof membrane and the glass substrate is increased to a certain extent.
Owner:陈琦 +2

Smoothing Agents to Enhance Nucleation Density in Thin Film Chemical Vapor Deposition

ActiveUS20120107503A1High degree of smoothnessEnhance nucleation densityChemical vapor deposition coatingMicroelectronicsNano size
The present invention provides methods for making structures, including nanosized and microsized thin film structures that exhibit a high degree of smoothness useful for applications in microelectronics. Deposition processing of the invention utilize smoothing agents capable of selectively adjusting the relative rates of processes involved in thin film formation and growth to access enhanced nucleation densities resulting in smooth thin film structures, including ultrathin (e.g., <10 nm) smooth films.
Owner:THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS

Method for fabricating a high coercivity hard bias structure for magnetoresistive sensor

A hard bias (HB) structure for longitudinally biasing a free layer in a MR sensor is disclosed that includes a mildly etched seed layer and a hard bias (HB) layer on the etched seed layer. The HB layer may contain one or more HB sub-layers stacked on a lower sub-layer which contacts the etched seed layer. Each HB sub-layer is mildly etched before depositing another HB sub-layer thereon. The etch may be performed in an IBD chamber and creates a higher concentration of nucleation sites on the etched surface thereby promoting a smaller HB average grain size than would be realized with no etch treatments. A smaller HB average grain size is responsible for increasing Hcr in a CoPt HB layer to as high as 2500 to 3000 Oe. Higher Hcr is achieved without changing the seed layer or HB material and without changing the thickness of the aforementioned layers.
Owner:HEADWAY TECH INC

Hard coating preparation method with heat diffusion of carbon nanomaterials as pretreatment

The invention discloses a hard coating preparation method with heat diffusion of carbon nanomaterials as pretreatment. The preparation method comprises the steps of solid heat diffusion treatment of carbon nanomaterials, cleaning and etching of pretreatment base materials and preparation of a hard coating. In the step of solid heat diffusion treatment of the carbon nanomaterials, nanoscale diamond, carbon nanotubes, graphene, graphite and carbon fiber are used as carbon sources, solid heat diffusion treatment is carried out at a certain temperature, and the concentration of the nano carbon sources is distributed in a graded manner in the depth direction of the base materials. In the step of the cleaning and etching of the pretreatment base materials, the decontamination treatment, polishing, cleaning, etching of corrosive liquid and drying are carried out to enable the surface of the base materials to be flat, smooth and clean, and the nanoscale second-phase particles are exposed on the surface of a base body through etching of the specific corrosive liquid. In the step of preparation of the hard coating, substances in gas, liquid and solid states are used as carbon sources, and the diamond / diamond-like hard coating is prepared through physical / chemical vapor deposition, solid heat diffusion and high-energy spraying technologies.
Owner:CHINA UNIV OF MINING & TECH

Method for preparing thickness controllable trilayer type diamond membrane

InactiveCN1928151ASolve Thickness ProblemsResolving Contradictions Between RoughnessesChemical vapor deposition coatingDeposition temperatureGas phase
The present invention is preparation process of three-layer diamond film in controllable thickness, belongs to the field of chemical vapor deposition technology of inorganic non-metal material, and aims at obtaining diameter film with proper roughness and thickness simultaneously. In an available chemical vapor deposition plant with hot filament and by means of regulating the carbon source concentration, depositing temperature, reaction pressure, applied bias and other parameters, three-layer diamond film is deposited on silicon chip. The present invention makes it possible to produce thick and flat diamond film without need of the post polishing treatment on the film.
Owner:SHANGHAI UNIV

Transparent conductive film with single layer structure, preparation method and application thereof

The invention discloses a transparent conductive film with a single layer structure, a preparation method and application thereof. The preparation includes: putting a cleaned substrate into a vacuum chamber of a vacuum magnetron sputtering device, filling argon when the vacuum degree of the chamber is 1*10<-4>-7*10<-4>Pa, and controlling the total air pressure at 0.16Pa, adjusting the sputtering power of a target material to 10-60W, then opening a sample baffle plate, and employing direct current magnetron sputtering technique for deposition on the substrate surface to obtain the transparent conductive film. The transparent conductive film is composed of silver and a metal oxide. By direct sputtering of an alloy target composed of silver and the metal oxide or co-sputtering of silver and ametal oxide target, the transparent metal conductive film with good continuity and stability under a small thickness can be prepared, thereby reaching the purposes of lowering the structural complexity and reducing material consumption.
Owner:NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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