The invention discloses a method for preparing polyphenyl particle heat-insulation boards. The method is characterized in that raw materials for the polyphenyl particle heat-insulation boards include,by cubic meter per unit, polyphenyl particles,
cement, siliceous mineral
powder,
gelatin powder, organic
emulsion, water repellents and water; the method includes uniformly stirring the organic
emulsion, the water repellents and the water to obtain mixed liquid during production, uniformly mixing the mixed liquid and the polyphenyl particles with one another in compressing barrels according to certain proportions, repeatedly compressing the mixed liquid and the polyphenyl particles in the compressing barrels by hydraulic machines, then adsorbing the mixed liquid in the surfaces of the polyphenyl particles and internal shallow surface
layers of the polyphenyl particles, wrapping the surfaces of the polyphenyl particles and the internal shallow surface
layers of the polyphenyl particles with the mixed liquid, scattering the compressed polyphenyl particles by stirring machines, then inputting
powder materials into the stirring machines, stirring the compressed polyphenyl particles and the powder materials to obtain polyphenyl particle coated dry mixtures, jacking the polyphenyl particle coated dry mixtures in compressing tanks by the hydraulic machines in the up-down directions, carrying out pressure maintaining curing, then releasing the polyphenyl particle coated dry mixtures from molds by the hydraulic machines to obtain polyphenyl particle heat-insulation board bulks and thencutting the polyphenyl particle heat-insulation board bulks according to required sizes to obtain the required polyphenyl particle heat-insulation boards. The
cement, the siliceous mineral powder andthe
gelatin powder are uniformly mixed with one another to obtain the powder materials. The method has the advantages that the method is reasonable in design and easy to implement and includes simpletechnological steps, the polyphenyl particle heat-insulation boards prepared by the aid of the method are small in
porosity, boards are low in heat conduction coefficient and water absorption per volume and high in pull strength, and
engineering application of the polyphenyl particle heat-insulation boards can be guaranteed.