The invention discloses a method for manufacturing multilayer flex-rigid printed circuit boards, and aims to solve the technical problem of filling efficiency and product quality in the process of
processing the multilayer flex-rigid printed circuit boards. The method comprises that: preprocesses of a rigid circuit board part and a flexible circuit board part are carried out respectively, laminated and formatted, and then thermally compressed and overlapped, and a filler piece is processed by a
punching method for the rigidity wiring board part; and when a rigid circuit board is processed, a rigid single-side
copper-clad material is adopted, and then the following steps are completed in order: drilling,
punching, transfer of inner layer patterns,
etching of an inner layer circuit, circuit inspection, surface multibond, and semi-
solid preparation of a rigid outer layer film of a
washer and pure
copper foil. Compared with the prior technology, hardware mould is directly used to perform
die cutting on the filler piece on the position of a filling area; therefore, the method reduces the generation of bug dust in the
processing process, has good leak tightness of the filling position, and greatly improves the reliability of performance and product percent of pass.