Method for preparing polyphenyl particle heat-insulation boards

Abstract

The invention discloses a method for preparing polyphenyl particle heat-insulation boards. The method is characterized in that raw materials for the polyphenyl particle heat-insulation boards include,by cubic meter per unit, polyphenyl particles, cement, siliceous mineral powder, gelatin powder, organic emulsion, water repellents and water; the method includes uniformly stirring the organic emulsion, the water repellents and the water to obtain mixed liquid during production, uniformly mixing the mixed liquid and the polyphenyl particles with one another in compressing barrels according to certain proportions, repeatedly compressing the mixed liquid and the polyphenyl particles in the compressing barrels by hydraulic machines, then adsorbing the mixed liquid in the surfaces of the polyphenyl particles and internal shallow surface layers of the polyphenyl particles, wrapping the surfaces of the polyphenyl particles and the internal shallow surface layers of the polyphenyl particles with the mixed liquid, scattering the compressed polyphenyl particles by stirring machines, then inputting powder materials into the stirring machines, stirring the compressed polyphenyl particles and the powder materials to obtain polyphenyl particle coated dry mixtures, jacking the polyphenyl particle coated dry mixtures in compressing tanks by the hydraulic machines in the up-down directions, carrying out pressure maintaining curing, then releasing the polyphenyl particle coated dry mixtures from molds by the hydraulic machines to obtain polyphenyl particle heat-insulation board bulks and thencutting the polyphenyl particle heat-insulation board bulks according to required sizes to obtain the required polyphenyl particle heat-insulation boards. The cement, the siliceous mineral powder andthe gelatin powder are uniformly mixed with one another to obtain the powder materials. The method has the advantages that the method is reasonable in design and easy to implement and includes simpletechnological steps, the polyphenyl particle heat-insulation boards prepared by the aid of the method are small in porosity, boards are low in heat conduction coefficient and water absorption per volume and high in pull strength, and engineering application of the polyphenyl particle heat-insulation boards can be guaranteed.

Description

Technical field: [0001] The invention relates to the field of building energy-saving materials, and mainly relates to a preparation method of a polystyrene particle insulation board. Background technique: [0002] At present, the preparation technology of polystyrene particle insulation board is mainly made of polystyrene particles, cement, silica powder, rubber powder, water repellent and other materials. Stir the material evenly, then add water to stir it into a slurry, then put in polyphenylene particles and stir it into a slurry, pour the slurry into the mold, press it with a hydraulic press, and remove the mold after curing to form a large polystyrene particle insulation board block, and then cut into polystyrene particle insulation boards of a certain size and thickness according to the requirements of use. Due to the large porosity of the polystyrene particle insulation board made by this method, the thermal conductivity of the board is high, the volume water absorpt...

AI Technical Summary

Problems solved by technology

Due to the large porosity of the polystyrene particle insulation board made by this method, the thermal conductivity of the board is high, the volume water absorption rate is large, and the drawing strength is low, which seriously limits the application of the polystyrene particle insulation board in engineering.

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