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Method for fixing copper sleeve on notebook computer panel

A notebook computer, copper sleeve fixing technology, applied in the direction of metal processing, metal processing equipment, manufacturing tools, etc., can solve the problems of copper sleeve drawing strength reduction, copper sleeve fixing hole deformation, etc., to increase the amount of glue, improve the diameter The effect of expanding outward and increasing the tightness

Inactive Publication Date: 2015-01-28
SHANGHAI DIANJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the problems in the prior art that the drawing strength of the copper sleeve between the plastic and the copper sleeve on the notebook computer panel is reduced and the copper sleeve fixing hole is deformed at high temperature, the present invention proposes a fixed copper sleeve on the notebook computer panel. method

Method used

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  • Method for fixing copper sleeve on notebook computer panel
  • Method for fixing copper sleeve on notebook computer panel

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Embodiment Construction

[0012] Below in conjunction with embodiment and attached Figure 1-2 The present invention is further described.

[0013] The invention provides a method for fixing a copper sleeve on a notebook computer panel, the method comprising the following steps: setting the diameter of a fixing hole corresponding to hot pressing into the copper sleeve at least 0.4 cm smaller than the maximum diameter of the copper sleeve; At least one pair of reinforcing ribs is arranged on the outer periphery of the fixing hole; the copper sleeve is hot-pressed into the fixing hole by means of high temperature and pressure for fixing.

[0014] figure 1 It is an assembly diagram of the method for fixing the copper sleeve on the notebook computer panel of the present invention. The hot-pressed copper rod 20 is fixed on the fixing block 21 of the machine, and the thermocouple 22 heats the hot-pressed copper rod 20 to about 200 ° C, so that the temperature of the copper sleeve 11 raised. The hot-presse...

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Abstract

The invention provides a method for fixing a copper sleeve on a notebook computer panel. The method comprises the following steps: setting the diameter of a fixing hole which is correspondently and thermally sleeved by the copper sleeve to be 0.4cm smaller than the maximum diameter of the copper sleeve; arranging at least one pair of reinforcing ribs on the periphery of the fixing hole; thermally pressing the copper sleeve into the fixing hole to be fixed by adopting a high-temperature pressurizing manner. By adopting the method for fixing the copper sleeve on the notebook computer panel, adhesive amount entering a clearance can be increased by adjusting the inner diameter of the fixing hole, so that the binding force between the fixing hole and the copper sleeve can be increased.

Description

technical field [0001] The invention relates to the field of mechanical manufacturing, in particular to a method for fixing a copper sleeve on a notebook computer panel. Background technique [0002] A plurality of copper sleeves need to be provided on the panel of the notebook computer, and the purpose is to cooperate with the screws to fix other components. At present, the copper sleeve is usually fixed by high temperature and pressure. In the actual production process, there are often technical problems such as the reduction of the drawing strength of the copper sleeve between the plastic and the copper sleeve and the deformation of the copper sleeve fixing hole at high temperature. Contents of the invention [0003] In order to overcome the problems in the prior art that the drawing strength of the copper sleeve between the plastic and the copper sleeve on the notebook computer panel is reduced and the copper sleeve fixing hole is deformed at high temperature, the pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P19/02
CPCB29C66/74281B29C65/44
Inventor 王晓梅
Owner SHANGHAI DIANJI UNIV
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