36results about How to "Improve electrothermal performance" patented technology

The invention relates to a chip-suspension-type packaging heat dissipation improved structure of a semiconductor, which comprises a chip, metal leads, a bonding material, a lead frame and a plastic package material, and also comprises a spring heat dissipater, wherein transmission pins are arranged on the lead frame, and the chip is arranged on the transmission pins through the bonding material and is in electrical interconnection with the lead frame through the metal leads; the spring heat dissipater, the chip, the metal leads, the bonding material and the lead frame are plastic-packaged bythe plastic package material to form a plastic package body, and the periphery of the spring heat dissipater is fixed by the plastic package material; and one end of the spring heat dissipater is connected with the chip, and the other end thereof is exposed to the surface of the plastic package body to dissipate the heat of the chip out of the plastic package body, thereby solving the heat dissipation difficulties that no exposed chip bears a base or a flip chip is packaged, and greatly improving the electrothermal performance and reliability of products.

The invention discloses an anti-corrosion and anti-explosion self-temperature-control electric tracing band. The anti-corrosion and anti-explosion self-temperature-control electric tracing band comprises a PTC material core which is internally provided with two wires, the PTC material core is wrapped by a single-face metal and plastic composite belt which is internally provided with a drainage wire, the plastic layer of the single-face metal and plastic composite belt faces inwards, and the metal layer of the single-face metal and plastic composite belt faces outwards. The metal and plastic composite belt is wrapped by an insulating layer, the insulating layer is wrapped by a braided shield layer, the braided shield layer is wrapped by a restrictive coating, and the periphery of the restrictive coating is provided with a plicated texture. The anti-corrosion and anti-explosion self-temperature-control electric tracing band is simple in structure and good in electromagnetic shielding performance and can be used safely under the high-temperature environment.

The invention discloses a halogen-free flame-retardant low-voltage electrothermal film and a preparation method thereof. The halogen-free flame-retardant low-voltage electrothermal film is prepared with macromolecules as a matrix and conductive filler and a halogen-free flame retardant wrapped by the conductive filler as raw materials. The preparation method of the electrothermal film is simple; compared with a traditional electrothermal film, the electrothermal film has good electrothermal performance under low voltage below 36V, solves the potential safety hazard of fire hazard when the electrothermal film works at high temperature for a long time, reduces the production cost, and can be widely applied to the fields of physical therapy and health care, building insulation, household heating and the like.

The invention relates to a flip-chip high-heat-radiation spheroidal array encapsulation structure, which comprises a chip, an electric interconnection material, a lower filling material, a base plate, a plastic sealing material and a welding ball. A spring heat radiator is also arranged in the encapsulation structure. The electric interconnection material is planted on the front side of the chip, and is inversely arranged on the base plate, and the electric interconnection between the chip and the base plate is realized through the electric interconnection material, the lower filing material fills a gap between the chip and the base plate, the plastic sealing material plastically seals the spring heat radiator, the chip, the electric interconnection material, the lower filling material and the base plate for forming a plastic sealing body, the circumambience of the spring heat radiator is fixed by the plastic sealing material, one end of the spring heat radiator is connected with the chip, and the other end of the spring heat radiator is exposed on the surface of the plastic sealing body for radiating the heat of the chip out of the plastic sealing body. The problem of heat radiation of the encapsulation of carrying bases or inversely arranged chips without exposed metals is solved, and the electric heating performance and the reliability of the products are greatly improved.

The invention relates to a high-heat-dispersion reverse solder spherical array encapsulation method which comprises the following steps of: implanting a chip into a substrate by using a binding material; pasting a spring radiator on the chip; electrically connecting the chip and the substrate by a metal lead; plastically encapsulating the spring radiator, the chip, the metal lead, the binding material and the substrate with a plastic encapsulating material to form a plastic encapsulated body; and fixing the periphery of the spring radiator by the plastic encapsulating material, wherein one end of the spring radiator is connected with the chip, and the other end is exposed out of the surface of the encapsulated body so that the heat of the chip is dispersed out of the encapsulated body. The invention solves the problems of heat dispersion in encapsulation without an exposed metal carrier plates and greatly improves the electrothermal performance and the reliability of the product.

The invention relates to a method for manufacturing a gradient composite of a W-Cu system by the aid of a tape casting process. The method includes steps of (1), manufacturing metal powder non-water-based tape casting slurry and performing tape casting: defoaming and filtering metal powder non-water-based slurry which is mixed by means of ball milling, then performing tape casting on the metal powder non-water-based slurry a tape casting machine, and drying the metal powder non-water-based slurry in air to obtain a single-component metal tape casting membrane; (2), designing, cutting and laminating a gradient structure: cutting tape casting diaphragms with different W-Cu components according to a design of a thickness-direction distribution function C=C<0>+AXx of copper contents, and laminating the cut tape casting diaphragms to form a green body with the gradient structure; (3), removing adhesive of the green body and performing hot pressed sintering: removing the adhesive of the green body in nitrogen and hydrogen mixed atmosphere, and then performing hot pressed sintering on the green body in a vacuum hot press furnace. The method has the advantages that a technology is simple, the cost is low, the thickness of a single-component layer of the composite manufactured by the method can reach a micron dimension, variation of a component is gentle, a transitional layer is smooth and continuous, and the gradient composite is excellent in electro-thermal performance and can be applied to the thermoelectric fields of electric contacts, electronic packaging and the like.

The invention discloses a method for preparing aluminum oxide dispersed copper by means of external oxidation. The method comprises the following steps: 1. performing sufficient external oxidation treatment on aluminum-copper alloy powder; mixing; 3. deoxidizing and hot-pressing sintering the specific oxidized alloy powder; 4. densifying the dispersed aluminum-copper billet to obtain alumina dispersed copper. The present invention fully oxidizes the aluminum-copper alloy powder, and the aluminum in it is oxidized preferentially, which can greatly reduce the oxidation of the copper powder. After mixing the external alumina-copper alloy powder and copper powder, deoxidation hot-press sintering is carried out. The oxidized part of the copper powder is reduced and solid-phase sintered to form, the reduction and profile preparation process are combined, there is no secondary oxidation process, the performance of aluminum oxide dispersed copper is improved, and the structure of the dispersed aluminum copper billet is enhanced by densification treatment Strength, the doped phase is fully oxidized, and the composition is uniformly controlled in aluminum oxide dispersed copper.

The invention discloses an asphalt mixture for improving microwave absorption efficiency, which is composed of the following raw materials in weight percent: 8% to 15% of asphalt filler mixed with magnetite powder, 4% to 6% of asphalt cement, and 40% of basalt coarse aggregate % to 60%, basalt fine aggregate 20% to 40%; among them, the asphalt filler mixed with magnetite powder is formed by mixing magnetite powder and ordinary limestone powder, and the weight of the magnetite powder accounts for 31% to 100% of the total weight of mineral powder asphalt filler. The invention also provides a preparation method of asphalt mixture which improves microwave absorption efficiency. The invention improves the microwave absorption efficiency of the asphalt mixture, ensures the excellent road performance of the asphalt mixture, has the characteristics of high microwave heating efficiency, low economic cost, good construction performance and road performance, and can be used for road maintenance and deicing , Pothole rapid repair, asphalt mixture regeneration, etc.

The application relates to the field of conductive pastes, in particular to a graphene conductive paste. The graphene conductive paste comprises the following components, by weight: 1 to 10 parts of epoxy-functionalized graphene, 4 to 15 parts of epoxy resin, 2 to 6 parts of epoxy-modified siloxane, 2 to 6 parts of epoxy reactive diluents, and 0.1 to 0.8 parts of latent curing agents. Furthermore,the graphene conductive paste also includes 5 to 20 pars, by weight, of conductive black modified with a silane coupling agent. In addition, the application also provides a method for preparing the graphene conductive paste. The method includes: carrying out epoxy functionalization of graphene powder; carrying out epoxy modification of siloxane; carrying out mixing and stirring of all components;and carrying out conductive black modification. According to the graphene conductive paste provided by the application, the high dispersibility of graphene and good adhesion of the conductive paste are realized; and with the conductive black, the amount of graphene is reduced and the cost is lowered.

The invention relates to an improved method for semi-conductor flip-chip bonding package cooling, which comprises the following steps that: a chip with electrical interconnecting material planted on the front side is arranged on a transmission tube pin of a lead frame upside down; a spring radiator is attached on the back side of the chip; plastic sealed material is used for sealing the spring radiator, the chip, the electrical interconnecting material and the lead frame to form a plastic sealed body, and the periphery of the spring radiator is fixed by the plastic sealed material; and one end of the spring radiator is connected with the chip and the other end thereof is exposed on the surface of the plastic sealed body so as to release the heat of the chip out of the plastic sealed body; and the improved method for semi-conductor flip-chip bonding package cooling solves the difficulty problem of cooling of some packages without exposed chip bearing base or flip chip, and greatly improves the electric heating performance and the reliability of the product.