Crimping type IGBT power module based on gradient functional composite material packaging

Abstract

The invention relates to a crimping type IGBT power module based on gradient function composite material packaging, an IGBT sub-module between a collector metal layer and an emitter metal layer comprises a collector gradient function composite material layer, an IGBT power chip, an emitter gradient function composite material layer, a copper pedestal and a grid PCB which are successively crimped from top to bottom, a packaging shell support is sleeved outside the crimped IGBT sub-module, and gate spring ejector pins are placed in gaps of the crimped emitter gradient function composite material layer and the copper pedestal. The thermal expansion coefficients of the collector gradient function composite material layer, a collector metal layer, the collector surface of the IGBT power chip, the emitter gradient function composite material layer, the emitter surface of the IGBT power chip and the copper pedestal are matched. The problems that in an existing crimping type IGBT power module, thermal expansion coefficients between the IGBT power chip and a packaging material assembly are not matched, so that the electric heating contact performance of an assembly interface is reduced, the heat dissipation efficiency is reduced, and the service life of a device is shortened are solved.

Description

technical field [0001] The invention belongs to the field of power semiconductor devices and relates to a crimping type IGBT power module packaged based on gradient functional composite materials. Background technique [0002] Compared with IGBT power modules with welded package structure, IGBT power modules with crimped package structure have the advantages of high power density, double-sided heat dissipation, low on-state loss, strong impact resistance, large flow capacity, failure short circuit and easy series connection, etc. It is suitable for the application conditions of high-voltage and large-capacity power equipment such as MMC converter valves in flexible direct current transmission systems. A small number of crimp-type IGBT power modules can meet the voltage level and capacity requirements of MMC converter valves, effectively reducing the The integrated manufacturing and operation and maintenance of large-capacity power equipment are difficult, and have broad mark...

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Problems solved by technology

[0004] In view of this, the present invention solves the problem that the thermal expansion coefficient mismatch between the IGBT power chip and the packaging material components in the existing crimping type IGBT power module causes the effective contact area between the components to gradually decrease under the action of alternating thermal stress, resulting in the component interface To solve the problems of reduced electrothermal contact performance, reduced heat dissipation efficiency, and shortened service life of devices, a crimp-type IGBT power module based on gradient functional composite material packaging is provided to achieve the best matching of the thermal expansion coefficient between the IGBT power chip and the packaging material, and improve the performance of the IGBT. The electrical conduction and thermal conduction performance of the power device during operation can prolong the service life of the device

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