Semiconductor flip-chip bonding packaging heat radiation improved structure
A technology of flip-chip packaging and improved structure, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc. Fully dissipate the problem, achieve the effect of stress absorption function, meet ultra-high heat dissipation requirements, and improve product reliability
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[0028] Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.
[0029] Embodiments of the present invention relate to an improved heat dissipation structure for semiconductor flip-chip packaging, such as figure 1 As shown, it includes a chip 2, an electrical interconnection material 3, a lead frame 4 and a molding compound 6, and the improved heat dissipation structure of the package also includes a spring radiator 1; the lead frame 4 is provided with a transmission pin 5; the The front si...
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