43results about How to "Compact package" patented technology

The invention relates to a chip-suspension-type packaging heat dissipation improved structure of a semiconductor, which comprises a chip, metal leads, a bonding material, a lead frame and a plastic package material, and also comprises a spring heat dissipater, wherein transmission pins are arranged on the lead frame, and the chip is arranged on the transmission pins through the bonding material and is in electrical interconnection with the lead frame through the metal leads; the spring heat dissipater, the chip, the metal leads, the bonding material and the lead frame are plastic-packaged bythe plastic package material to form a plastic package body, and the periphery of the spring heat dissipater is fixed by the plastic package material; and one end of the spring heat dissipater is connected with the chip, and the other end thereof is exposed to the surface of the plastic package body to dissipate the heat of the chip out of the plastic package body, thereby solving the heat dissipation difficulties that no exposed chip bears a base or a flip chip is packaged, and greatly improving the electrothermal performance and reliability of products.

The invention discloses an optical fiber grating temperature sensor, which comprises an optical fiber grating, an optical fiber fixing sheet for fixing the optical fiber grating, the optical fiber fixing sheet is built into a packaging tube, and two optical cable connectors with a through hole opened in the center of the cross section along the axial direction are connected to the At both ends of the packaging tube, the fiber fixing piece is located between the two optical cable connectors, and the fiber gratings fixed on the fiber fixing piece respectively pass through the through holes of the two optical cable connectors. The fiber grating temperature sensor adopting this packaging structure, on the one hand, the packaging tube has a certain thickness and strength, and the packaging through the packaging tube ensures a strong protection for the fiber grating; on the other hand, the temperature of the fiber grating is greatly improved. The sensor's response speed to ambient temperature. At the same time, the packaging structure of the fiber grating temperature sensor is simple and compact, and is convenient for implementation.

The invention belongs to the technical field of photoacoustic detection, and discloses a transceiver-integrated all-optical ultrasonic transducer device and a preparation method thereof. The device comprises a structured base (2), a suspension film (3), a double-clad optical fiber ( 1) and the F-P cavity (4) that they cooperate to build; the suspended film is a composite photoacoustic conversion film, which can absorb the laser beam energy of the excitation light and convert it into ultrasonic waves and emit them outward to realize the emission of sound waves; at the same time, it can receive ultrasonic waves The echo, through the deformation-induced sound wave return signal, affects the cavity length of the F-P cavity and the returned detection optical signal, and the sound wave can be received by detecting the returned detection optical signal. The present invention improves the structure of each component and their cooperative working methods, etc., and uses the suspended film and the further constructed F-P cavity to complete the entire process of ultrasonic emission and reception on a suspended film, and the device structure is more compact , The operation of photoacoustic imaging is easier and the result is more accurate.

The invention discloses a detachable polymer lithium ion battery, which comprises at least two polymer lithium ion batteries connected in parallel, and an upper stainless steel sheet, a lower stainless steel sheet, a top case and a bottom case which are fixedly connected and form a battery cell accommodation cavity , the two sides and the bottom of the upper stainless steel sheet and the lower stainless steel sheet are respectively bent inwardly to form side connecting edges and pins, and the bottom shell is provided with slots corresponding to the pins, so The tops of the upper stainless steel sheet and the lower stainless steel sheet are respectively connected to the top shell by injection molding, and the overlapping parts of the side connecting edges of the upper stainless steel sheet and the lower stainless steel sheet are welded and connected. The invention provides a cell packaging structure with precise packaging, maximum capacity density and low cost. Two or more polymer cells are stacked and welded in parallel and then welded with a protective plate. The battery casing packaging structure The combination of plastic casing and metal casing is adopted to save the packaging size and make the battery packaging structure more compact.

The invention relates to a flip-chip high-heat-radiation spheroidal array encapsulation structure, which comprises a chip, an electric interconnection material, a lower filling material, a base plate, a plastic sealing material and a welding ball. A spring heat radiator is also arranged in the encapsulation structure. The electric interconnection material is planted on the front side of the chip, and is inversely arranged on the base plate, and the electric interconnection between the chip and the base plate is realized through the electric interconnection material, the lower filing material fills a gap between the chip and the base plate, the plastic sealing material plastically seals the spring heat radiator, the chip, the electric interconnection material, the lower filling material and the base plate for forming a plastic sealing body, the circumambience of the spring heat radiator is fixed by the plastic sealing material, one end of the spring heat radiator is connected with the chip, and the other end of the spring heat radiator is exposed on the surface of the plastic sealing body for radiating the heat of the chip out of the plastic sealing body. The problem of heat radiation of the encapsulation of carrying bases or inversely arranged chips without exposed metals is solved, and the electric heating performance and the reliability of the products are greatly improved.

The invention relates to a high-heat-dispersion reverse solder spherical array encapsulation method which comprises the following steps of: implanting a chip into a substrate by using a binding material; pasting a spring radiator on the chip; electrically connecting the chip and the substrate by a metal lead; plastically encapsulating the spring radiator, the chip, the metal lead, the binding material and the substrate with a plastic encapsulating material to form a plastic encapsulated body; and fixing the periphery of the spring radiator by the plastic encapsulating material, wherein one end of the spring radiator is connected with the chip, and the other end is exposed out of the surface of the encapsulated body so that the heat of the chip is dispersed out of the encapsulated body. The invention solves the problems of heat dispersion in encapsulation without an exposed metal carrier plates and greatly improves the electrothermal performance and the reliability of the product.

The invention discloses a packing device of a split air conditioner and a method for packing the split air conditioner by using the packing device. The split air conditioner comprises an indoor unit, an outdoor unit and an installing attachment, wherein the installing attachment comprises a connecting copper pipe and a connecting cable, and the indoor unit, the outdoor unit and the installing attachment are arranged in one packing paper box together; the packing paper box is of an upper-down separating structure, and the packing paper box is fixedly bundled through more than two packing belts; the indoor unit is arranged on the upper part and the side surface of the outdoor unit, the front side, the rear side or the right side of the outdoor unit and a packing liner of the outdoor unit and the inner wall of the packing paper box can form a gap together, and the installing attachment is arranged in the gap; and the left and right end surfaces and the middle part of the indoor unit are all provided with upper packing liners matched with the shapes of the left and right end surfaces and the middle part of the indoor unit in the length direction. The packing device and the packing method disclosed by the invention have the characteristics that the structure is simple and reasonable, the volume of the complete machine is small, the rigidity is good, the strength is high, the operation is flexible, the fabricating cost is low, and the packing device is easy to pack.

The invention relates to an encapsulation structure for an MEMS (micro-electromechanical system) variable optical attenuator. The encapsulation structure comprises a focusing lens, a tail fiber sleeve and an optical chip, wherein the optical chip is manufactured by adopting the MEMS, the tail fiber sleeve is fixedly arranged in a hollow cylindrical magnet through bonding glue for forming a magnetic assembly 1, one end of the focusing lens is a light signal incident surface, the other end of the focusing lens is provided with a light reflecting surface, the focusing lens is fixedly arranged in the other hollow cylindrical magnet through bonding agents, the optical chip is fixedly arranged on the end part, used for being sucked with the magnetic assembly 1, on the hollow cylindrical magnet through bonding agents, and a magnetic assembly 2 is formed; the magnetic assembly 1 and the magnetic assembly 2 which are in a mutual magnetic suction state and are reinforced through the bonding agents form a variable optical attenuator assembly, the optical attenuator assembly is arranged in a hollow external protecting sleeve, in addition, two ends of the external protecting sleeve are filled and encapsulated by bonding agents, and the variable optical attenuator is formed. The invention aims at providing the encapsulation structure and an encapsulation method for the MEMS with the advantages of miniaturization, low cost and high reliability.

The present invention relates to an infrared detector and its forming method, an infrared detector packaging structure and its forming method. The infrared detector includes: a detector including a substrate, and the substrate has a first surface and a second surface opposite to each other. A sensing circuit is formed on the first surface; a base, the base surface has a depression, the bottom surface of the depression is a curved surface, and the position of the depression corresponds to the sensing circuit; the detector is fixed on the base surface, the second surface of the substrate is in contact with the bottom surface of the depression, so that the sensing surface of the detector is a curved surface. The infrared detector has a relatively low cost.

The invention discloses a fast response fiber bragg grating temperature sensor which comprises a fiber bragg grating, a fiber fixing sheet used for fixing the fiber bragg grating, a first optical cable connector and a second optical cable connector, wherein the fiber fixing sheet is arranged in a packaging tube, centers of cross sections of the first and the second optical cable connectors are provided with through holes along the axial direction, the fiber bragg grating fixed on the fiber fixing sheet respectively passes through the through holes of the first and the second optical cable connectors; and a tube wall material on one surface is at least removed from the outer wall of the packaging tube along the axial direction. According to the fiber bragg grating temperature sensor provided by the invention, the thickness of the partial region of the packaging tube is larger, so that higher protection strength is obtained for the fiber bragg grating, and response speed of the fiber bragg grating temperature sensor to the environment temperature is greatly increased. Meanwhile, the fiber bragg grating temperature sensor has a simple and compact packaging structure and is convenient for implementation.

The invention provides a semiconductor package with passive devices and a stacking method of the semiconductor package. The semiconductor package with the passive devices comprises a first device, a second device and at least one independent passive device, wherein one part of the first device is connected to a substrate, the other part of the first device is connected to the second device, and the independent passive devices are arranged below the first device. The semiconductor package with the passive devices can have a compact packaging structure, obtain better signals and provide the improved electrical characteristics.