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Infrared detector and forming method thereof, and infrared detector packaging structure and method thereof

A technology of infrared detector and packaging structure, which is applied in the field of sensing, can solve the problems of low efficiency and high cost, and achieve the effects of improving production efficiency, reducing process cost, and improving the vacuum degree of packaging

Active Publication Date: 2020-05-01
ZHEJIANG DALI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since hundreds of detector chips can be cut out from a single wafer, this form of packaging is inefficient and expensive
Currently, packaging costs for uncooled infrared detectors using traditional packaging types account for 90% of the overall detector cost

Method used

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  • Infrared detector and forming method thereof, and infrared detector packaging structure and method thereof
  • Infrared detector and forming method thereof, and infrared detector packaging structure and method thereof
  • Infrared detector and forming method thereof, and infrared detector packaging structure and method thereof

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Embodiment Construction

[0036] The specific implementations of the infrared detector and its forming method, the infrared detector packaging structure and its method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0037] Please refer to Figure 1A to Figure 1B It is a structural schematic diagram of an infrared detector according to a specific embodiment of the present invention, wherein, Figure 1B For a top view diagram, Figure 1A for along Figure 1B Schematic cross-sectional view of the secant line AA'.

[0038] The infrared detector 100 includes: a substrate 101, the surface of the substrate 101 has a depression, and the bottom surface of the depression is a curved surface; the detector includes a substrate 102, and the substrate has an opposite first surface and a second surface , a sensor circuit 110 is formed on the first surface; the detector is fixed on the surface of the substrate 101, and the second surface of the sub...

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Abstract

The invention relates to an infrared detector and a forming method thereof, and an infrared detector packaging structure and a forming method thereof. The infrared detector comprises a detector and abase, wherein the detector comprises a substrate, the substrate is provided with a first surface and a second surface which are opposite to each other, a sensing circuit is formed on the first surface, the surface of the base is provided with a recess, a bottom surface of the recess is a curved surface, and the position of the recess corresponds to that of the sensing circuit, the detector is fixed on a surface of the base, and the second surface of the substrate is attached to the bottom surface of the recess, so a sensing surface of the detector is a curved surface. The infrared detector islow in cost.

Description

technical field [0001] The invention relates to the field of sensing technology, in particular to an infrared detector and a forming method thereof, an infrared detector packaging structure and a packaging method thereof. Background technique [0002] Infrared imaging technology is widely used in military, industrial, agricultural, medical, forest fire prevention, environmental protection and other fields, and its core component is the infrared focal plane array (IRFPA). According to the working principle, it can be divided into: cooled infrared detector and uncooled infrared detector. [0003] Refrigerated detectors mainly use the narrow-bandgap semiconductor photoelectric effect to convert infrared light signals into electrical signals, also known as photon detectors, and usually work at 77K or lower temperatures, which requires bulky and expensive refrigeration equipment. In addition, materials such as HgCdTe and InSb used to make photon detectors are expensive, difficul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0203H01L31/09H01L31/18G01J5/10
CPCH01L31/0203H01L31/09H01L31/18G01J5/10Y02P70/50
Inventor 钱良山张云胜姜利军
Owner ZHEJIANG DALI TECH
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