347 results about "Infrared focal plane array" patented technology

A hybrid three dimensional imaging camera comprises a 2-D video camera utilizing a focal plane array visible light detector and a 3-D flash laser radar utilizing an infrared focal plane array detector. The device is capable of capturing a complete 3-D scene from a single point of view. A production system combining multiple hybrid 3-D cameras around a subject provides 3-D solid models of an object or scene in the common field of view.

A real time imaging system is described which displays subcutaneous veins whereby facilitating diagnosis, inspection and easy intravenous access for administration of drugs. The imaging system comprises an infrared source (1), a pinhole focusing unit (7), an infrared Focal Plane Array (8), and a display unit (10). The infrared source (1) emits infrared light which penetrates and is subsequently scattered differently at different layers and depths of the anatomical structure (11) while substantially being absorbed by the blood vessels. Reflected light (4) from the anatomical structure (11) contains the imaging information of the subcutaneous blood vessels of the anatomical structure (11) which is then focused by said pinhole focusing unit (7) upon said infrared Focal Plane Array (8). The image captured by said infrared Focal Plane Array is then displayed on the display unit (10).

The invention discloses a device for testing an infrared focal plane array device, which comprises a radiation source and focal plane array module, a drive control module and a data acquisition processing module, wherein the radiation source and focal plane array module comprises an infrared radiation source, an optical system and a tested infrared focal plane array; the drive control module comprises a bias control module, a temperature control module and a time sequence control module; and the data acquisition processing module comprises an analog-to-digital signal converter, a video output module, a data acquisition card and a data analysis processing module. The device of the invention has the characteristics of low cost, high efficiency, accuracy, reliability and the like, is suitable for testing the large-scale infrared focal plane array device, and is of very important instructive significance to the designer of the device and the designer of an imaging system.

The invention requests to protect an infrared focal plane array blind pixel detection method based on integral time adjustment, belongs to the technical field of signal detection. Aiming at the condition limitation that the traditional blind pixel detection method based on a standard black body radiation source depends on an expensive black body and a fixed dark room and the blind pixel detectioncannot be performed as required anytime anywhere, the invention provides a method of flexibly and conveniently adjusting a response output value of the infrared focal plane array in different integral time through a CPLD (complex programmable logic device) programming, computing a response rate of each detection unit according to the response output value and detecting the blind pixel according to the blind pixel definition. The detection unit response output value, the blind pixel detection and the blink pixel compensation in different integral time are recorded. The method provided by the invention has a simple implementation process, and has application and spread value in the IRFPA (infrared focal plane array) blind pixel detection.

A method for offset correction in an imaging system comprising acquiring image data representative of at least a portion of a frame of pixel intensity values from the detector array at two times with a shutter closed. The method includes determining an offset value function for individual pixels based on the image data acquired with the shutter closed. The method includes acquiring subsequent scene image data with the shutter open, and adjusting the scene image data relative to the flat field as predicted by the offset value function at the time the scene image data was acquired to correct for offset drift of the imaging system. In some embodiments, the imaging array is an infrared Focal Plane Array (IR FPA) in a thermal imaging camera.

A thermal infrared detector includes a substrate; a temperature sensor having electrical characteristics changed in accordance with changes in temperature caused by infrared absorption; heat-insulating supporting legs supporting and thermally insulating the temperature sensor and serving as signal lines for reading out electrical signals from the temperature sensor; and an infrared absorption layer in thermal contact the temperature sensor. Each of the temperature sensor, the heat-insulating supporting legs, and the infrared absorption layer is in a different plane and the planes are spatially separated from each other.

The invention discloses a wafer-level vacuum encapsulated infrared focal plane array (IRFPA) device and a method for producing the same, wherein a double-wafer bonding mode is adopted to produce an infrared detector and realize the wafer-level encapsulation, a complementary metal-oxide-semiconductor integrated chip (CMOSIC) and a micro-electromechanical systems (MEMS) device are separately produced, so the integration of the CMOSIC is realized, the production flexibility of the MEMS infrared detector device is also increased, and the wafer-level encapsulation can be realized at the same time. The invention has the advantages that: a reflector for a complementary metal-oxide-semiconductor integrated chip (CMOS) reading circuit and a resonance absorption structure is produced on a wafer, the other wafer is utilized to produce the MEMS structural part of the IRFPA and is simultaneously used for producing the infrared window of the IRFPA, the resonance absorption structure is utilized to provide the infrared absorption efficiency of the infrared IRFPA device, the wafer-level encapsulation of the IRFPA device is also realized at the same time, so the size and the production cost of the IRFPA device are benefited to be reduced.

Adjacent pixels of an infrared focal plane array (IR FPA) can be configured to have different spectral or polarization responses by adjustment of the lengths or orientations of the antenna arms which couple radiation into the sensors. The manufacturing costs of such an antenna-coupled IR FPA would be much less than integration of spectral or polarization filters onto each pixel, or fabrication of adjacent pixels with materials of different bandgaps. The antenna-coupled pixels can be made smaller than usual pixels, allowing this diversity of spectral or polarization information on the FPA without losing spatial resolution. The infrared (IR) sensors can be tunnel diodes, schottky diodes, photovoltaics, photoconductors, bolometers, and pyroelectrics. Application areas can include military and civilian remote sensing, automotive driving aids, industrial sensing, medical imaging, and general surveillance.

A three dimensional imaging camera comprises a system controller, pulsed laser transmitter, receiving optics, an infrared focal plane array light detector, and an image processor. The described invention is capable of developing a complete 3-D scene from a single point of view. The 3-D imaging camera utilizes a pulsed laser transmitter capable of illuminating an entire scene with a single high power flash of light. The 3-D imaging camera employs a system controller to trigger a pulse of high intensity light from the pulsed laser transmitter, and counts the time from the start of the transmitter light pulse. The light reflected from the illuminated scene impinges on a receiving optics and is detected by a focal plane array optical detector. An image processor applies image enhancing algorithms to improve the image quality and develop object data for subjects in the field of view of the flash ladar imaging camera.

The invention discloses a rapidly converged scene-based non-uniformity correction method, wherein the aim of non-uniformity correction is achieved by minimizing interframe registration error of two adjacent images. The method mainly comprises the following steps of: initializing gain and offset correction parameters and acquiring an uncorrected original image; acquiring a new uncorrected original image, and carrying out non-uniformity correction on the new uncorrected original image and the previous uncorrected original image by utilizing the current non-uniformity correction parameters; obtaining relative displacement, scene correlation coefficient and interframe registration error of two corrected images by utilizing an original point masking phase correlation method; and updating correction parameters along the negative gradient direction by adopting a steepest descent method. The method disclosed by the invention has the advantages of high correction accuracy, fast convergence speed, no ghost effect and low calculated amount and storage content and is especially applicable to being integrated into an infrared focal plane imaging system, and the effect of improving imaging quality, environmental suitability and time stability of an infrared focal plane array is achieved.

The invention discloses a TEC(thermoelectric cooler)-free uncooled infrared focal plane array reading circuit, and relates to the technical field of uncooled infrared focal plane array. A reading circuit comprises a bias generation circuit, a column-level analog front-end circuit, and a row-level circuit; the row-level circuit comprises a row-level mirror image pixel, is controlled by a row selection switch,and can output a third bias voltage; the bias generation circuit is connected with the row-level circuit, the input end of the bias generation circuit is connected with the output end of the row-level circuit; a first bias voltage and a second bias voltage are generated and outputtedbased onan inputted constant voltage and a third bias voltage; the column-level analog front-end circuitcomprises a blind pixel; the column-level analog front-end circuit is electrically connected with the bias generation circuit, the input end of the column-level analog front-end circuit is connected with the output end of the bias generation circuit to obtain two currents, and the difference between the two currents generated is amplified in a transimpedance mode and outputted as a voltage. By adopting the technical scheme of theTEC(thermoelectric cooler)-free uncooled infrared focal plane array reading circuit, the circuit has a stable output point unaffected by the substrate temperature andthe self-heating effect, and the stability of the circuit is improved.

The invention discloses a capacitive MEMS non-refrigerated infrared detector and a preparation method thereof, which belong to the technical field of infrared photo-detection and microelectronic mechanical systems. The infrared detector comprises a micro-cantilever array, a circuit for reading out cantilever deformation and a substrate for supporting the cantilever array, wherein the micro-cantilever array forms an infrared focal plane array of the detector, and each pixel has a bi-material cantilever structure which is fixed on the substrate through an anchor point; and the cantilever structure is provided with a plate electrode, the substrate is provided with another plate electrode, the two plate electrodes form a capacitor structure together, and the variation of a capacitance signal of the capacitor structure is read out by the circuit positioned on the substrate for reading out the cantilever deformation. The preparation method can achieve the monolithic integration of the focal plane array and the reading circuit, and is applicable for mass production.

The present invention provides an infrared focal plane array nonuniform self-adapting correcting method pertaining to the field of infrared focal plane detector and the aim of the invention resides in controlling the degenerating of the object, improving the calculating speed and simplifying the hardware realization. The present invention includes an initialization step, a pre-processing step, a coarse correcting step and an exact correcting step. The method adopts an arithmetic combining one point correcting and a self-adapting correcting of neuronic network and containing an edge extracting module and a combined correcting arithmetic is obtained by combining the excellence of each arithmetic, thus, the space low-frequency noise is eliminated effectively and the object degenerating is controlled and the calculating speed is improved comparing to the neuronic network arithmetic directed by the edge.

An uncooled focal plane array (FPA) for imaging at full-band infrared and terahertz regime is provided. The FPA utilizes bimaterial cantilever array as the pixels (101) and are fabricated on a visible light transparent substrate (103). The bimaterail cantilever (101) comprises an absorber (102), two bimaterial legs (202), two thermal isolation legs (203), two anchors (102), and a mirror. The radiation to be detected casts on the front side of bimaterial cantilevers (101), while the transparent substrate (103) is illuminated by visible light to readout the deformation of the bimaterial cantilevers (101) caused by the energy absorption by the absorber (102). The FPA is fabricated by surface sacrificial layer processes, especially by using metamaterial to enhance the function of the absorber and polyimide as the sacrificial layer. The advantages of the uncooled focal plane array include multiband work,high sensitivity and resolution, good reliability and uniformity, low cost and easy fabrication.

A foundation cloud measuring method combining infrared and lasers comprises the following steps that (1) atmosphere downward infrared radiation data are obtained through an uncooled infrared focal planar array sensor, zenith backward extinction coefficient profile data are obtained through a laser sensor, and the obtaining time of the atmosphere downward infrared radiation data is synchronous with the obtaining time of the zenith backward extinction coefficient profile data; (2) water vapor and aerosol radiation under cloud are estimated by combining the data, clear sky threshold values calculated through a radiation transmission pattern are used for conducting initial cloud detection, it is assumed that the cloud is a black body, and the cloud base height is obtained through inversion; (3) sequence analysis is conducted on infrared radiation images with high time resolution, the clear sky threshold values are combined to conduct further cloud detection, and the cloud cover is calculated; (4) proportionality coefficients between the cloud base height obtained through the infrared radiation inversion and the cloud base height obtained through laser measurement are fitted; (5) the cloud base height of a whole view field is corrected, and the typical cloud base heights of every ten minutes are obtained through calculation.

The invention relates to an infrared focal plane array blind pixel detection method and device so as to solve the problem of poor stability of a conventional blind pixel detection method. The method, when judging blind pixels, utilizes the feature that the grey level value of an infrared image based on an uniform background is similar to normal distribution to carry out windowing and calculation with each pixel being a center. The accuracy rate of the scheme is poor; and through research, the poor accuracy rate is found to be caused by noise interference. Therefore, on the basis of the above, a frame of detector original image is collected each time, and statistics judgment is carried out on calculation results in a time domain range, and wrong blind pixel detection caused by noise is effectively prevented through setting evidence threshold value, thereby improving detection accuracy.

The invention disclose design of a full waveband infrared focal plane array based on the MEMS technology and a manufacturing method thereof and particularly relates to the full waveband infrared focal plane array capable of realizing visible light reading from a substrate side. The full waveband infrared focal plane array comprises a transparent substrate comprising a micro cantilever pixel array and a supporting micro cantilever pixel array, a micro cantilever pixel comprises an infrared sensitive face and a micro cantilever supporting leg, and the infrared sensitive face comprises a main structure layer, an infrared absorption structure layer and an optical reflector face. When infrared light is irradiated to the focal plane array, absorbed energy is converted by the infrared absorption structure arranged on the infrared sensitive face into heat energy to make the micro cantilever pixel generate deflection, and an optical detection system reads deformation quantity and distribution of the micro cantilever pixel array through the transparent substrate. The full waveband infrared focal plane array can carry out full waveband infrared detection and imaging through employing the meta-material structure arranged on the infrared sensitive face, under the non-refrigeration work environment, the simple polyimide sacrificial layer technology can be utilized for manufacturing.

A method of generating an image sequence that includes the steps of detecting scene irradiance using detectors in a focal plane array, generating an output image sequence for each of the detectors based on the detected irradiance, and correcting the output image sequence generated by a first subset of detectors in the focal plane array and the output image sequence generated by a second subset of detectors in the focal plane array using the correction provided to the first subset of detectors.

The invention discloses a calibration-based scene self-adaption IRFPA (Infrared Focal Plane Array) heterogeneity correction method, belongs to the field of infrared focal plane detection, combines the advantages of small calculation and strong real-time property in a calibration algorithm and the advantage that a scene heterogeneity algorithm can change a correction coefficient in a self-adaption manner, and proposes a calibration-based scene self-adaption IRFPA heterogeneity correction method. The method comprises the following steps: extracting a uniformly radiated infrared template image; calculating a multipoint temperature correction algorithm gain coefficient and a polarization coefficient; calculating the association coefficient between an infrared scene image and the infrared template image; performing heterogeneity correction of real-time scene image. The method has a simple implementation procedure, small calculation, an obvious image correction effect, and application and popularization values.

The invention discloses an infrared focal plane array detector simulation device and an infrared focal plane array detector simulation method. The device comprises a communication interface unit, a control unit, a storage, a driving signal input and detection unit, a direct digital frequency synthesis unit and a detector driving circuit interface, wherein the driving signal input and detection unit acquires driving signals from a detector driving circuit through the detector driving circuit interface; the control unit judges whether the signals meet the requirement of an infrared focal plane array detector; when the driving signals are absolutely right, the control unit reads infrared scene information in the storage or infrared scene information output through the communication interface, and outputs the infrared scene information to the direct digital frequency synthesis unit; and the infrared scene information is synthesized into analog signals according to a rule of detector response signals and then is output. The infrared focal plane array detector simulation device can replace an actual infrared focal plane array detector in the early stage of debugging an infrared imaging system, and can detect the driving signals of the driving circuit and feed information back; and the development schedule is accelerated and the development cost is reduced.

The invention provides a no-shutter uncooled infrared imaging system and a nonuniformity correction method. The system comprises an optical lens, an infrared detector, a field-programmable gate array, an analog-digital converter, a storage device and an image encoder. The optical lens collects optical signals of a target; the infrared detector converts the optical signals into analog voltage signals which are then converted by the analog-digital converter into digital signals which are output to the field-programmable gate array; the analog-digital converter carries out sampling on the analog signals output by the infrared detector and then transmits the signals to the field-programmable gate array; and the field-programmable gate array processes the digital signals and outputs the processed signals. The method is characterized by, to begin with, collecting response values of the system for the same uniform target background; calculating substrate temperature of an infrared focal plane array; then, calculating background value under the current state according to the background values and the substrate temperature; and finally, carrying out nonuniformity correction by utilizing one-point correction. The method has the advantages of easy realization and high precision and can be widely applied to the current uncooled infrared imaging system.

An improvement in a semi-active laser last pulse logic missile seeker is disclosed and claimed. In one embodiment, the improvement includes a first polarizer disposed in the detection field of view of the PIN photodiode detector and a second polarizer disposed in the detection field of view of the staring imaging infrared focal plane array. Each of the first and second polarizers has an identically configured plurality of segments. Each segment allows transmission of a different polarization than other segments and is sized to completely cover the fields of view of both the PIN photodiode detector and the staring imaging infrared focal plane array. First and second actuators are connected to the first and second polarizers, respectively, to synchronously and simultaneously step identical and corresponding segments in a plurality of discrete steps within the fields of view in response to incoming temporal and spatial laser returns.

The embodiment of the invention discloses a readout circuit of an uncooled infrared focal plane array. The readout circuit comprises a first bias circuit producing a detection output signal, a second bias circuit producing a first reference output signal, a first integration circuit and an analog-to-digital conversion circuit. The analog-to-digital conversion circuit includes a ramp signal generator which generates a ramp signal based on the output of a second reference microbolometer in a third bias circuit. According to the readout circuit, 'difference calculation' and 'amplification' of the detection output signal and the first reference output signal are completed by an integrator in an analog domain, 'ratio solution' is completed by an analog-to-digital converter in the process of analog-to-digital conversion, and analog-to-digital conversion and infrared detection are integrated more closely. Moreover, only one reference microbolometer is adopted in a column-level integrated readout channel, only one reference microbolometer is adopted in the chip-level ramp signal generator, and the readout circuit occupies a smaller area and has a smaller number of noise sources.

The invention discloses an infrared focal plane array imaging demonstrating system. Said system comprises an infrared radiating resource, infrared optical lens, an infrared focal plane detector, a programmable infrared detector driver, a high-speed interface, a high-speed data collecting card, a main processing unit and a high-functional computer. The infrared radiation is focalize on the infrared focal plane detector via the infrared optical lens; each unit on the infrared focal plane detector can convert the infrared radiating signal into electrical signal driven by driving and offset signals provided by the programmable infrared detector driver; clock and triggering signal needed by the programmable infrared detector driver is set by program programming of the high-functional computer which is transmitted to the programmable infrared detector driver by the main processing unit, high-speed data collecting card and high-speed interface. This invention enables designing stuff intuitively observe and evaluate the real imaging effect of the designed system and arithmetic and timely rectify and check the design and arithmetic, avoiding all sorts of troubles during process of system debugging.

The invention relates to a method of automatically blind pixel detecting and compensating in infrared focal plane array. And the method comprises the following steps: (1) obtaining the infrared images with consistent homogeneity according to the adaptive infrared non-uniformity correction method, (2) installing the sliding window and resizing the data neighborhood of the center pixel of the sliding window and then judging whether the difference between the data of the center pixel of the sliding window and all mean values of the pixel data outside the neighborhood of the value is greater than the set threshold. If the difference is greater than the set threshold, the current center pixel in the sliding window is the blind pixel. The method of automatically blind pixel detecting and compensating in infrared focal plane array has the advantages that on the one hand the method is capable of providing an effective detection to the distribution of the blind pixel owned complicated conditions, and on the other hand edge preserving the blind pixel compensation, which owns better detection to the blind pixel block and develops the imaging quality of the thermal imager.

The invention discloses a packaging device of a non-refrigerated infrared focal plane array device and is characterized by comprising a body and a cover which are matched to work and are packaged into a whole by heating and tightly compression in a vacuum chamber, wherein (1) the body comprises a first substrate, the surface of the substrate is provided with a heavily doped region with P and N properties, the middle of the substrate is provided with a strip-shaped metal border, the upper part inside the strip-shaped metal border region is provided with a reading circuit region, a focal plane array region is arranged on the lower part, the area of the heavily doped region is larger than that of the focal plane array region which is provided with M*N units, a plurality of pressure welding discs are arranged between the strip-shaped metal pattern and the substrate edge, and a plurality of reference resistances are arranged in the focal plane array region; and (2) the cover comprises a second substrate, two sides of the second substrate are provided with diamond-like carbon films, any side of the second substrate is provided with a cover metal border corresponding to the strip-shaped metal border in the body, and a metal solder is arranged on the cover metal border.

The invention relates to a non-refrigeration infrared focal plane array seeker. The structure is characterized in that one end part of a bridge leg is connected with a bridge surface, and the other end part of the bridge leg is connected to a base through an anchor post; the base is a read-out integrated circuit substrate, and the surface of the base is provided with a reflection film layer; the bridge surface is hanged deadly above the reflection film layer, and forms a vacuum clearance layer with the base; the bridge leg is arranged at two sides corresponding to the bridge surface, and the respective lower surface of the bridge leg and the bridge surface are distributed on the same plane; the bridge surface is sequentially provided with a support layer, an absorption layer, an insulation layer, a heat sensitive layer and a protection layer from bottom to up; the bridge leg is sequentially provided with a heat resistance layer, an electric conduction layer and a passivation layer from bottom to up; and the anchor post consists of a metal tungsten post and an oxide silicon post, and is sequentially provided with metal tungsten and silicon oxide materials from the inside to outside. The anchor post provided by the invention is a novel anchor post, compared with the traditional anchor post formed by the traditional filling technology, the area occupied by the anchor post is shortened, and the technology difficulty is reduced.

The invention relates to a high-precision infrared thermal-imaging temperature measurement method and a high-precision infrared thermal-imaging temperature measurement system. The method includes: acquiring a gray image of a detected area by an infrared focal plane array and an optical mechanism; acquiring a temperature of a reference object and a gray value of a reference object gray image area in the gray image; acquiring a gray value of a to-be-measured object gray image area in the gray image to acquire a first temperature of a to-be-measured object; subtracting the gray value of the to-be-measured object from the gray value of the reference object to obtain a gray difference, and obtaining a temperature difference according to the gray difference and the change relationship between the first temperature and the image gray value; obtaining the temperature of the to-be-measured object by the temperature of the reference object and the temperature difference. The high-precision infrared thermal-imaging temperature measurement method and the high-precision infrared thermal-imaging temperature measurement system achieve high-precision infrared thermal-imaging temperature measurement based on the detector operating temperature and a relative measurement method, thereby being high in temperature measurement precision, small in temperature measurement precision fluctuation and high in stability.

The invention discloses an infrared focal plane array seeker integrated structure and a manufacturing method, belonging to the field of semiconductor manufacturing. The structure comprises a first silicon wafer and a second silicon wafer; a second surface of the first silicon wafer is provided with an infrared sensitive element array and a bonding pad; a first surface is provided with a pluralityof first electric contact elements; the first silicon wafer is provided with a plurality of first silicon through hole micro interconnections and a plurality of second silicon through hole micro interconnections; the infrared sensitive element array is correspondingly and electrically connected with the first electric contact element through the first silicon through hole micro interconnections; the bonding pad is correspondingly and electrically connected with the first electric contact element through the second silicon through hole micro interconnections; the first surface of the second silicon wafer is provided a signal processing circuit of the infrared sensitive element and a plurality of second electric contact elements which are electrically connected with the signal processing circuit; and the first electric contact element and the second electric contact element are respectively and correspondingly connected. According to the invention, the thermal disturbance is reduced, and the stability and reliability of a non-refrigeration infrared focal plane array seeker are improved.