Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A packaging structure and packaging method of a mems adjustable optical attenuator

A technology of dimming attenuation and packaging structure, which is applied in the coupling of optical waveguides, etc., can solve the problems of device cost increase and yield reduction, and achieve the effects of avoiding welding process, low cost and high reliability

Active Publication Date: 2016-01-13
苏州盛维新电子科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal welding leads to a substantial increase in the cost of the device, and also easily leads to a decrease in yield

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A packaging structure and packaging method of a mems adjustable optical attenuator
  • A packaging structure and packaging method of a mems adjustable optical attenuator
  • A packaging structure and packaging method of a mems adjustable optical attenuator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] The present invention will be further described below in conjunction with specific embodiment:

[0048] Such as figure 1 , figure 2 ,and image 3 As shown, a package structure of a MEMS tunable optical attenuator includes a focusing lens 4, a pigtail tube 3 with an input optical fiber 31 and an output optical fiber 32, and an optical chip 5 made by a micro-electromechanical system. The focusing lens is a self-focusing lens. The pigtail sleeve with input optical fiber and output optical fiber is fixed in the first hollow cylindrical magnet 11 with adhesive glue to form the first magnetic assembly 1; one end of the self-focusing lens is an optical signal incident surface, and the other end has a light reflection surface 41. Focusing lens light convergence point is located on light reflection surface 41; Self-focusing lens is fixed in the second hollow cylindrical magnet 21 with adhesive glue; The ends of the two hollow cylindrical magnets 21 for engaging with the fir...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an encapsulation structure for an MEMS (micro-electromechanical system) variable optical attenuator. The encapsulation structure comprises a focusing lens, a tail fiber sleeve and an optical chip, wherein the optical chip is manufactured by adopting the MEMS, the tail fiber sleeve is fixedly arranged in a hollow cylindrical magnet through bonding glue for forming a magnetic assembly 1, one end of the focusing lens is a light signal incident surface, the other end of the focusing lens is provided with a light reflecting surface, the focusing lens is fixedly arranged in the other hollow cylindrical magnet through bonding agents, the optical chip is fixedly arranged on the end part, used for being sucked with the magnetic assembly 1, on the hollow cylindrical magnet through bonding agents, and a magnetic assembly 2 is formed; the magnetic assembly 1 and the magnetic assembly 2 which are in a mutual magnetic suction state and are reinforced through the bonding agents form a variable optical attenuator assembly, the optical attenuator assembly is arranged in a hollow external protecting sleeve, in addition, two ends of the external protecting sleeve are filled and encapsulated by bonding agents, and the variable optical attenuator is formed. The invention aims at providing the encapsulation structure and an encapsulation method for the MEMS with the advantages of miniaturization, low cost and high reliability.

Description

technical field [0001] The invention relates to an optical attenuator, in particular to a packaging structure and a packaging method of a MEMS adjustable optical attenuator. Background technique [0002] With the rapid development of informatization and high-speed broadband networks, traditional communication networks are developing into high-speed, intelligent optical fiber communication networks. Therefore, miniaturized, dynamically adjustable and intelligent optical devices have become indispensable key devices in new optical communication networks. [0003] Variable Optical Attenuator, the main function of VOA in optical communication network is to control the intensity of transmitted optical signal, especially with dense wavelength division multiplexing DWDM transmission system, optical fiber amplifier EDFA and optical receiver in optical communication network It is widely used in multiple optical signal transmission channels, and the gain flatness or power balance of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/26G02B6/32
Inventor 李四华李维杨忠钰施林伟
Owner 苏州盛维新电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com