113 results about "Spherical array" patented technology

The invention relates to a carrier-free grid-array IC (Integrated Circuit) chip packaging part and a preparation method thereof. The carrier-free grid-array IC chip packaging part comprises inner pins, IC chips, soldering pads, bonding lines and plastic-sealed bodies, wherein the inner pins are arranged into a multi-row matrix type on the front surface of the packaging part, and multiple rows of exposed round gold-plated contacts approximately to squares are arranged on the back surface of the packaging part; the IC chips are positioned on the upper surfaces of the inner pins, the inner pins and the IC chips are bonded through glue membranes, the soldering pads on the IC chips are connected with the inner pins through the bonding lines, and the glue membranes, the IC chips, the bonding lines and the edges of the inner pins are surrounded by the plastic-sealed bodies to form an integrated circuit. In the invention, since spherical array contacts approximately to squares are adopted, the structure is simple and flexible, and the radiating effect is good. The finished-product rate of a copper lead frame (L / F) is high, and the material cost is lowered. Since the copper lead frame (L / F) is adopted for replacing a ceramic baseplate, a PCB (Printed Circuit Board) baseplate or a BT (Bismaleimide Triazine) baseplate, the complicated layout design is saved, the designing and manufacturing cycle is shorter, the pilot production process is quickened, products are promoted to be on the market in advance, and the first market opportunity is obtained.

A laser optical system using optical fiber transmission, includes a first optical fiber for transmitting laser light emitted from a laser oscillator, a collimator lens for collimating laser light emitted from the first optical fiber, a spherical array lens including a plurality of cells for converging laser light emitted from the collimator lens into a plurality of spots, a plurality of second optical fibers each having a smaller core diameter than the first optical fiber and configured to admit the laser light converged into the corresponding spot by the spherical array lens, the second optical fibers having output ends that have mutually parallel axial lines and are arranged linearly in a single row, and a linearization optical unit for shaping laser light emitted from the second optical fibers into laser light having a linear cross section at an illuminated surface.

The present invention relates to the self-assembly of a spherical-morphology block copolymer into V-shaped grooves of a substrate. Although spherical morphology block copolymers typically form a body-centered cubic system (bcc) sphere array in bulk, the V-shaped grooves promote the formation of a face-centered cubic system (fcc) sphere array that is well ordered. In one embodiment, the (111) planes of the fcc sphere array are parallel to the angled side walls of the V-shaped groove. The (100) plane of the fcc sphere array is parallel to the top surface of the substrate, and may show a square symmetry among adjacent spheres. This square symmetry is unlike the hexagonal symmetry seen in monolayers of spherical domains and is a useful geometry for lithography applications, especially those used in semiconductor applications.