The invention relates to a carrier-free grid-array IC (
Integrated Circuit)
chip packaging part and a preparation method thereof. The carrier-free grid-array IC
chip packaging part comprises inner pins, IC chips,
soldering pads, bonding lines and plastic-sealed bodies, wherein the inner pins are arranged into a multi-row
matrix type on the front surface of the packaging part, and multiple rows of exposed round gold-plated contacts approximately to squares are arranged on the back surface of the packaging part; the IC chips are positioned on the upper surfaces of the inner pins, the inner pins and the IC chips are bonded through glue membranes, the
soldering pads on the IC chips are connected with the inner pins through the bonding lines, and the glue membranes, the IC chips, the bonding lines and the edges of the inner pins are surrounded by the plastic-sealed bodies to form an
integrated circuit. In the invention, since
spherical array contacts approximately to squares are adopted, the structure is simple and flexible, and the radiating effect is good. The finished-product rate of a
copper lead frame (L / F) is high, and the material cost is lowered. Since the
copper lead frame (L / F) is adopted for replacing a
ceramic baseplate, a PCB (
Printed Circuit Board) baseplate or a BT (Bismaleimide
Triazine) baseplate, the complicated
layout design is saved, the designing and manufacturing cycle is shorter, the
pilot production process is quickened, products are promoted to be on the market in advance, and the first market opportunity is obtained.