418results about How to "Reduce manufacturing complexity" patented technology

A device having touch sensor input functionality, comprises first and second control electrodes (40,42) lying in a common plane. The device is operable in at least two modes, comprising: a first mode in which the light transmission characteristics are altered by controlling the movement of the charged particles under the influence of control signals applied to the first and second control electrodes; and a second mode in which the first and second control electrodes are coupled to a capacitance sensing means, for detecting a change in capacitance caused by the proximity of an object to be detected.

Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.

A window-type ball grid array (WBGA) semiconductor package with a lead frame as a chip carrier and a method for fabricating the same are provided. The lead frame has a plurality of leads encompassing an opening, each lead having an upper surface and an opposing lower surface. A resin material is pre-molded on the lower surfaces of the leads, with wire-bonding portions and ball-implanting portions defined on the leads being exposed. At least a chip is mounted on the upper surfaces of the leads and covers the opening, allowing the chip to be electrically connected to the wire-bonding portions of the leads by a plurality of bonding wires via the opening. Then, an encapsulant is formed to encapsulate the chip and fill into the opening for encapsulating the bonding wires. Finally, solder balls are implanted on the ball-implanting portions of the leads to complete fabrication of the semiconductor package.

A corner joint of a frame for fixing a solar panel disposed between two adjacent frame pieces of the frame includes an L shaped member and a sheath. Two ends of the L shaped member separately extend to one corresponding frame piece of the two adjacent frame pieces to form an extending arm plugged into a latching slot defined in an end of the corresponding frame piece. The L shaped member further includes a bending portion defining a mortise extending to the extending arm. The sheath includes two adjacent joint surfaces for abutting the two adjacent frame pieces. The sheath defines an upper receiving space and a lower receiving space therein. The upper receiving space and the lower receiving space are separately exposed from the joint surfaces. The upper receiving space and the lower receiving space are configured for receiving a corner of the solar panel and the bending portion, respectively. The sheath further includes a tenon capable of being plugged into the mortise and received in the latching slot such that the sheath joins the L shaped member and the solar panel. The corner joint can be easily molded and the manufacturing cost thereof is low.

The invention provides an enhanced graphene waveguide photodetector for an integrally-distributed Bragg reflection grating. The photodetector is manufactured on an SOI substrate and comprises an optical waveguide, an insulating transparent thin film, a graphene thin film, a first metal electrode, a second metal electrode and a gate electrode window. The optical waveguide is formed on the substrate in the longitudinal direction. The insulating transparent thin film is evenly manufactured on the substrate and covers the optical waveguide. The graphene thin film is manufactured on the insulating transparent thin film and covers the middle of the strip-shaped optical waveguide. The first metal electrode is provided with a contact end and a strip-shaped electrode end, the contact end of the first metal electrode is manufactured on one side of the insulating transparent thin film, and the electrode end of the first metal electrode is longitudinally manufactured on the graphene thin film. The second metal electrode is provided with a contact end and a strip-shaped electrode end, the contact end of the second metal electrode is manufactured on one side of the insulating transparent thin film, and the electrode end of the second metal electrode is longitudinally manufactured on the graphene thin film. The gate electrode window is formed on the insulating transparent thin film and located on any exposed surface of the insulating transparent thin film. The graphene photodetector is integrated with the waveguide, a resonant cavity and the like, and the defect of low optical responsivity is overcome.

A wavelength tunable silicon-on-insulator (SOI) laser comprising: a laser cavity including: a semiconductor gain medium having a front end and a back end; and a phase-tunable waveguide platform coupled to the front end of the semiconductor gain medium; wherein the phase-tunable waveguide platform includes a first Distributed Bragg Reflector (DBR) and a second Distributed Bragg Reflector (DBR); at least one of the Distributed Bragg Reflectors having a comb reflectance spectrum; and wherein a mirror of the laser cavity is located at the back end of the semiconductor gain medium.

Methods to etch features in a substrate with a multi-layered double patterning mask. The multi-layered double patterning mask includes a carbonaceous mask layer, a first cap layer on the carbonaceous mask layer and a second cap layer on the first cap layer. After forming the multi-layered mask, a first lithographically defined pattern is etched into the second cap layer. A double pattern that is a composition of the first lithographically defined pattern etched in the second cap layer and a second lithographically defined pattern is then etched into the first cap layer and the carbonaceous mask layer. The double pattern formed in the carbonaceous mask layer is then transferred to a substrate layer and any portion of the multi-layered mask remaining is then removed.

A wear cover for use on a gas turbine transition duct support bracket is disclosed. The wear cover, which is manufactured from a single piece of sheet metal, does not require complex manufacturing processes or tools, thereby reducing component cost. The wear cover comprises first and second leg portions substantially parallel to each other and each generally perpendicular to a third leg portion. Each of the leg portions serve to protect a surface of a support bracket finger from excessive wear associated with frictional contact with mounting blocks of a transition duct. The wear cover is designed to slip onto a support bracket finger through a first opening and is fixed to the finger by a means such as welding.

A link assembly forming a 6 bar linkage is integrally combined with a spring having a laterally coiled strand to form a hinge that is particularly well adapted to be installed in a small footprint. Such a unit is well adapted for installation within a peripheral channel of a vehicle body opening and to prop the closure in its open position. The present invention also provides a method for reducing packaging footprint of a vehicle closure hinge by integrating the 6 bar linkage with the laterally coiled strand, and selecting a strand shaping to reduce radial dimension of the coil and the coil cross-section while maximizing the radial dimension of material in the strand.