Flip-chip high-heat-radiation spheroidal array encapsulation structure
An array packaging, high heat dissipation technology, applied in electrical components, electric solid devices, circuits, etc., can solve the problems affecting the electrothermal performance and reliability of products, poor thermal conductivity of plastic substrates, poor heat dissipation semiconductor packaging, etc., to achieve stress absorption. The function is beneficial, the package structure is compact, and the effect of meeting the ultra-high heat dissipation requirements
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[0029] Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.
[0030] Embodiments of the present invention relate to a flip-chip high heat dissipation ball array packaging structure, such as figure 1 As shown, it includes a chip 2, an electrical interconnection material 3, an underfill material 4, a substrate 5, a molding compound 6 and a solder ball 7, and the package structure also includes a spring heat sink 1; the front side of the chip 2 is planted with The electrical interconnection...
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