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Method and structure for encapsulating transparent substrate detector chip

A detector chip and transparent substrate technology, which is applied in the packaging field of transparent substrate detector chips, can solve the problems of large volume, airtight performance to be improved, and uncompact packaging structure, etc., and achieve small size, simple and compact packaging structure , low cost effect

Inactive Publication Date: 2014-03-26
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The packaging structure obtained by this packaging method is not compact, the volume is large, and the airtight performance needs to be improved

Method used

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  • Method and structure for encapsulating transparent substrate detector chip
  • Method and structure for encapsulating transparent substrate detector chip
  • Method and structure for encapsulating transparent substrate detector chip

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Embodiment Construction

[0030] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0031] In the following description numerous details are set forth in order to provide a thorough understanding of the invention, but the invention may also be practiced otherwise than as described herein.

[0032] In addition, when describing the embodiments of the present invention, for convenience of explanation, the cross-sectional views showing device structures are not partially enlarged according to the general scale, and the schematic diagrams are only examples, which do not constitute limitations to the present invention.

[0033] Next, the packaging method and packaging structure of the embodiment of the present invention will be described in detail by taking the packaging of the FPA chip of the optical readout thermal-mechanical ...

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Abstract

The invention provides a method for encapsulating a transparent substrate infrared detector chip. The chip comprises a transparent substrate and a chip sensitive structure arranged on the transparent substrate; the method comprises the steps of growing a first intermediate on the transparent substrate to form a first pattern surrounding the chip sensitive structure; growing a second intermediate corresponding to the first intermediate on an other substrate made of a material with high transmittance of rays with preset wave band; and encapsulating the chip sensitive structure by the first intermediate and the second intermediate through a bonding process. The encapsulating structure by the method is simple, has good air tightness and simple manufacture process and is low in cost and suitable for wafer level encapsulation.

Description

technical field [0001] The invention relates to the technical field of microfabrication, in particular to a package of a transparent substrate detector chip. Background technique [0002] Infrared detection technology is widely used in early warning, guidance, night vision, tracking and space technology, astronomy, medicine and other fields. Therefore, people's demand for it is constantly expanding. Driven by this scale of demand, the development and industrial production of infrared detectors have developed by leaps and bounds. At present, the detectors that have been developed and put into use include: cooled photon quantum detectors, quantum well infrared detectors, uncooled microbolometers, pyroelectric electric readout infrared detectors, thermopile electric readout infrared detectors Detectors, diode-type electrically readout infrared detectors. Among them, the chip in the infrared detector as the core is the focus of research and development. With the continuous de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B81C3/00B81B3/00G01J5/04
Inventor 刘瑞文焦斌斌陈大鹏叶甜春
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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