864results about How to "Improve product reliability" patented technology

A vehicle backup monitoring and alarm system which comprises a system of three closed circuit video cameras, three laser-based distance detection systems and an associated monitor is disclosed. A camera and a laser-based distance detection system are mounted on each side, as well as the rear of the motor vehicle or large truck, and coupled to one monitor, located by the driver, which displays all three images simultaneously. The distance to the closest object, displayed by each camera, as determined by the laser-based distance detection system, is superimposed over the respective object in the monitor. If any of these said distances fall below a minimum predetermined distance, the numeric representation will flash and an audible alarm will sound.

A method and method that builds accurate operational profiles for COTS software. The systems and methods disclosed allow software vendors to detect misused and unused features; identify common machine configurations for a given piece of software or software component; monitor changing user habits as new software version are released; derive more accurate testing methods for in-house testing purposes; and create user manuals which focus on those features most frequently used, or misused, by users. The disclosed system and method provides the tools enabling a software certification laboratory (SCL) to gather detailed usage data and failure data for a software application as it is used in the field. With this data the SCL can confidently issue certificates of reliability for software products.

A dust collecting unit of a vacuum cleaner is provided. The dust collecting unit includes: a plurality of storing chambers and a plurality of filtering chambers provided in the inside of a multi-cyclone dust collecting unit. To improve reliability of the product, the storing chambers and the filtering chambers are integrally formed as one body.

Disclosed is a solid-state imaging device receiving incident light from a backside thereof. The imaging device includes a semiconductor layer on which a plurality of pixels including photoelectric converters and pixel transistors are formed, a wiring layer formed on a first surface of the semiconductor layer, a pad portion formed on a second surface of the semiconductor layer, an opening formed to reach a conductive layer of the wiring layer, and an insulating film extendedly coated from the second surface to an internal side-wall of the opening so as to insulate the semiconductor layer.

A nanoparticle-enhanced liquid crystal phase shifter is provided including a first substrate layer, a plurality of electrodes attached to the substrate layer, a ground plane layer attached to a second substrate layer, and a liquid crystal layer between the ground plane layer and the first substrate layer, including a suspension of a liquid crystal material and highly polarizable nanoparticles having specific shape and size characteristics.

A toothbrush with a refillable toothpaste chamber which provides for the storage of toothpaste of choice within the handle section is disclosed. The toothpaste tube mates with a matching threaded connection on the lower surface of the handle to allow filling of the present invention with no or minimal wasted toothpaste. When the conventional toothpaste tube is removed, a pressurizing pump is installed to allow the user to pressurize the toothpaste chamber. To dispense the toothpaste product, the user simply activates a valve to allow the flow of toothpaste up the handle of the toothbrush where it exits from within the brush assembly of the toothbrush. The toothpaste chamber holds a sufficient amount of toothpaste to allow for several tooth brushing cycles or for a period of use during short travel times. When the internal supply is depleted, the present invention is refilled by repeating the above process.

System and method for synchronizing shutter glasses with a display system. An embodiment comprises displaying a first image from a first image stream on a display plane, displaying a second image from a second image stream on the display plane, and displaying a synchronization signal on the display plane, during a first, a second, and a third display period, respectively. The first image and the second image are displayed at least partially on the same area of the display plane and the first and the second display periods do not overlap. The display of the synchronization signal on the display plane enables the elimination of a dedicated synchronization signal broadcast unit, thereby reducing the cost while increasing the reliability of a display system.

An electric wheeled apparatus comprises a main body, at least one wheel supported by the main body in a rotatable manner; an electric motor configured to apply torque to the at least one wheel, a battery interface configured to removably receive at least one battery pack which is originally designed as a power source of an electric power tool, and an electric circuit unit configured to electrically connect the at least one battery pack attached to the battery interface with the electric motor.

MRI operates by passing current through gradient coils to create a magnetic field. Creation of the magnetic field requires a relatively high current which causes a large heat build up within the MRI, especially in the patient space. The present invention provides for a hollow conductor through which a coolant can be passed directly during the application of current.

A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material filled within the space formed between the semiconductor chip and the glass frame, a build-up layer formed on the glass frame and the semiconductor chip such that the build-up layer is electrically connected to the semiconductor chip, and a plurality of conductive elements mounted on the build-up layer so that the semiconductor chip is electrically connected to external devices. With the use of the glass frame and low-modulus buffer material, the wafer level semiconductor package thus-obtained is free from warpage, chip-crack, and delamination problems and the reliability thereof is enhanced. A method for fabricating the wafer level semiconductor package is also provided.

A touch-sensitive device includes a transparent substrate, a touch-sensing structure, a decorative layer, a trace layer, a passivation layer and a sheltering layer. The touch-sensing structure is disposed on the transparent substrate and located in a touch-sensitive region. The decorative layer is disposed on the transparent substrate and located in a non-touch-sensitive region, and the trace layer is disposed on the decorative layer. The passivation layer is disposed on the transparent substrate and at least covers the touch-sensing structure and the trace layer. The sheltering layer is disposed at least on the passivation layer and located in the non-touch-sensitive region.

The invention is an electrical power converter using multiple, high frequency switching elements where the individual switching elements are operated in a synchronous, time-skewed arrangement to provide optimum ripple current cancellation.

A multisided display device includes a flexible substrate configured to have a shape of a polyhedron and including a plurality of flattened portions, a plurality of bending portions, a first surface having a plurality of pixels thereon, and a second surface opposite the first surface, a plurality of rigid substrates corresponding to the plurality of flattened portions and positioned at the second surface of the flexible substrate, a scan driver for supplying a scan signal to the plurality of pixels, and a data driver for supplying a data signal to the plurality of pixels.

Provided are an organic light emitting display (OLED) and a method of fabricating the same capable of improving product reliability by forming an auxiliary electrode line to be in contact with a second electrode power supply line to remove an organic layer on the auxiliary electrode line and minimize the organic layer on a pixel region, thereby preventing pixel shrinkage resulting from degradation of an organic emission layer caused by out-gassing from the organic layer.

A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.

An improved remote vehicle starting apparatus with timer which allows for the remote starting of a motor vehicle to allow for the preheating or pre-cooking of the passenger compartment of said motor vehicle under extreme temperature conditions is disclosed. The apparatus consists of a transmitting unit, located with the driver, and a receiver unit that is located in the driver's vehicle. The transmitting unit allows the user to set predetermined times at which to start the vehicle, before work for example, and includes an LCD display that indicates both the time of day and the time(s) at which the vehicle will be started. The transmitter also includes a manual switch, by which the user may start the vehicle, regardless of the time settings. The receiver installs in the vehicle and is wired into the vehicle ignition circuitry, allowing the engine to be started by key in a conventional manner, or by the remote transmitter. Depending on the weather conditions, the user simply either leaves the cooling or heating system activated when leaving the vehicle before use of the present invention. In this manner, when the apparatus starts the motor vehicle, the passenger compartment will begin to warm or cool prior to the driver returning.

A solar module device. The device has a substrate having a surface region. The device has one or more photovoltaic regions overlying the surface region of the substrate. In a preferred embodiment, each of the photovoltaic strips is derived from dicing a solar cell in to each of the strips. Each of the strips is a functional solar cell. The device also has an impact resistant glass member having a plurality of elongated concentrating elements spatially arranged in parallel configuration and operably coupled respectively to the plurality of elongated concentrating elements. Preferably, the impact resistant glass has a strength of at least 3× greater than a soda lime glass, e.g., conventional soda lime glass for conventional solar cells, e.g., a low iron soda lime glass. In a preferred embodiment, the impact resistant glass member comprises a planar region and a concentrator region comprising the plurality of elongated concentrating element spatially arranged in parallel configuration.

A display apparatus, such as an organic light emitting diode (“OLED”) display, is driven by thin film transistors (“TFTs”), including a driving TFT and a switching TFT, and a pixel electrode. The display apparatus includes an amorphous silicon layer for the switching TFT and a microcrystalline silicon or polycrystalline silicon layer for the driving TFT. The amorphous silicon layer and the microcrystalline silicon layer are separated by an insulating layer. The apparatus provides product reliability and high image quality. A method of manufacturing the apparatus is characterized by reducing processing steps, and using a special mask which is a half tone mask or a slit mask adapted to forming a source electrode and a drain electrode of the switching TFT or the driving TFT and a semiconductor layer during a photolithographic process.

A packaging substrate having an embedded through-via interposer is provided, including an encapsulant layer, a through-via interposer embedded in the encapsulant layer and having a plurality of conductive through-vias therein, a redistribution layer embedded in the encapsulant layer and formed on the through-via interposer so as to electrically connect with first end surfaces of the conductive through-vias, and a built-up structure formed on the encapsulant layer and the through-via interposer for electrically connecting second end surfaces of the conductive through-vias. As such, the first end surfaces of the conductive through-vias are electrically connected to the redistribution layer to thereby be electrically connected to electrode pads of a semiconductor chip having smaller pitches, while the second end surfaces of the conductive through-vias electrically connect with conductive vias of the built-up structure having larger pitches, thereby allowing the packaging substrate to be coupled with the semiconductor chip.

Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.

A display substrate includes a signal line, a test switch, a test pad, and a first electrostatic dispersion line. The signal line is formed in the display area of a base substrate. The test switch is formed in a peripheral area of the base substrate surrounding the display area. The test switch applies a test signal to the signal line. The test pad is electrically connected to the test switch and receives the test signal The first electrostatic dispersion line is extended from the test pad to an end of the base substrate.

A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material filled within the space formed between the semiconductor chip and the glass frame, a build-up layer formed on the glass frame and the semiconductor chip such that the build-up layer is electrically connected to the semiconductor chip, and a plurality of conductive elements mounted on the build-up layer so that the semiconductor chip is electrically connected to external devices. With the use of the glass frame and low-modulus buffer material, the wafer level semiconductor package thus-obtained is free from warpage, chip-crack, and delamination problems and the reliability thereof is enhanced. A method for fabricating the wafer level semiconductor package is also provided.

A fuel cell assembly including: a membrane electrode assembly and current collector sub-unit including (i) a polymer electrolyte membrane having a cathode side and an anode side; (ii) catalyst layers disposed, respectively, on both sides of the polymer electrolyte membrane; (iii) gas diffusion layers disposed, respectively, on sides of both catalyst layers, wherein the gas diffusion layers are laminated on the catalyst layers; and (iv) porous current collectors disposed, respectively, on sides of both gas diffusion layers, wherein the porous current collectors are laminated on the gas diffusion layers. The fuel cell assembly also includes a hydrogen supplier layer disposed on the anode side of the sub-unit, sealed to the edges of the sub-unit and forming an anode chamber; and a hydrogen inlet and a hydrogen outlet connected the anode chamber.

A multi-chip IC package encapsulates a chip under asymmetric longer single-side leads. The package mainly comprises a plurality of leads that have asymmetric length at two sides of a leadframe, a plurality of die-attach tape strips, a first chip having a plurality of single-side pads under the longer side leads, at least a second chip disposed above the longer side leads, a plurality of bonding wires and a molding compound. The die-attach tape strips are mutually parallel and adhered onto the lower surfaces of the longer side leads to adhere the first chip. There is at least a mold-flow channel formed through the first chip, the longer side leads and the die-attach tape strips. The bonding wires electrically connect the single-side pads of the first chip to the leads at the two sides of the leadframe through a non-central gap. The molding compound encapsulates the first chip, the second chip, the bonding wires and portions of the leads at the two sides of the leadframe and fills up the mold-flow channel. The mold-flow channel formed by means of the die-attach tape strips may increase the encapsulated area of the first chip by the molding compound to enhance product reliability of semiconductor package.

Strip metallic thin films each having a width of 180 μm or so are disposed in parallel at intervals of 10 μm to 50 μm on the surface of a protection layer formed on the silicon substrate and at their corresponding spots located on the upper side of an analog circuit formed in a silicon substrate. These strip metallic thin films are connected to one another at their ends or centers to form a comb-like shield section and one end thereof is connected to its corresponding external connecting post. Incidentally, the shield section is formed by copper plating in the same process as redistribution wirings that connect electrode pads at an outer peripheral portion of the silicon substrate to their corresponding external connecting posts. Since the encapsulating resin and the protection layer are reliably adhered to each other when the upper portions of the redistribution wirings and the shield section are sealed with the encapsulating resin, the shield section is adhered to the encapsulating resin and has no fear of being peeled therefrom.

Disclosed is a method of manufacturing a flat-panel display device, includes: laminating a thermosetting resin film on a sealing substrate; stacking the sealing substrate having the thermosetting resin film laminated thereon, and an element substrate having a light-emitting element together under a vacuum atmosphere with the thermosetting resin film and the light-emitting element facing inwardly, and with a frame-shaped sealing material around the thermosetting resin film interposed between the two substrates; joining the sealing substrate and the element substrate together under a vacuum atmosphere by the sealing material situated between the sealing substrate and the element substrate stacked together; and heat-curing the thermosetting resin film situated between the sealing substrate and the element substrate stacked together, under an air atmosphere.