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76results about How to "Minimize region" patented technology

Laser irradiation apparatus and method for manufacturing semiconductor device

InactiveUS20050111105A1Minimize regionImaging optical system can be miniaturizedSemiconductor/solid-state device manufacturingCondensersSemiconductorLens array
When a rectangular image having homogeneous intensity distribution is transferred by an imaging optical system, aberration adversely affects the homogeneity of the intensity distribution. The present invention provides a laser irradiation apparatus that can suppress the aberration due to the imaging optical system typified by a cylindrical lens, that can enlarge the square measure of the beam spot in which the intensity distribution is homogenous, and that can anneal the irradiated surface homogeneously efficiently. Moreover, the present invention provides a method for manufacturing a semiconductor device with the use of the laser irradiation apparatus. In the present invention, the divergence of the laser beam is suppressed and the size of the imaging optical system is miniaturized by using an off-axis lens array such as an off-axis cylindrical lens array. By the miniaturization, it is possible to reduce the cost, to facilitate the maintenance, and to suppress the aberration. By suppressing the aberration, the homogeneity of the intensity distribution of the beam spot can be improved.
Owner:SEMICON ENERGY LAB CO LTD

Methods of Minimizing Etch Undercut and Providing Clean Metal Liftoff

A method of minimizing etch undercut and providing clean metal liftoff in subsequent metal deposition is provided. In one embodiment a bilayer resist mask is employed and used for etching of underlying substrate material and subsequent metal liftoff. In one embodiment, the top layer resist such as positive photoresist which is sensitive to selected range of energy, such as near UV or violet light, is first patterned by standard photolithography techniques and resist development in a first developer to expose portion of a bottom resist layer which is sensitive to a different selected range of energy, such as deep UV light. The exposed portion of the bottom layer resist is then removed by anisotropic etching such as oxygen reactive ion etching using the top layer resist as the etch mask to expose portion of the underlying substrate. This minimizes the undercut in the bottom resist around the top photoresist opening. The resultant patterned bilayer resist stack is then used as the etch mask for the subsequent etching of the exposed portion of the underlying substrate material. Because there is no undercut in the bottom resist layer, the etch undercut in the substrate material is also minimized relative to the edges of the top photoresist opening.
Owner:TRIQUINT SEMICONDUCTOR

Turbine blade cooling with a hollow airfoil configured to minimize a distance between a pin array section and the trailing edge of the air foil

A turbine blade with a generally hollow airfoil having an outer wall that defines a chamber for receiving cooling air, the airfoil comprising a leading edge that resides in an upstream direction, a trailing edge that resides in a downstream direction, a convex suction side, a concave pressure side, and an insert disposed within the chamber that is configured to initially receive at least a portion of the cooling air entering the chamber and direct the cooling air through a plurality of insert apertures to cool the inner surface of the outer wall, the insert further comprising a configuration that generally conforms to the contour of the outer wall of the chamber but in spaced relation thereto, wherein the chamber and insert narrow as they extend toward the trailing edge, the insert eventually terminating and the chamber eventually terminating at a pin array section, wherein a first distance exists that comprises the generally axial distance between the position of downstream termination point of the insert and the position of an upstream beginning point of the pin array section, wherein the pin array section, at a downstream end, comprises a plurality of openings that define an inlet to a plurality of trailing edge cooling apertures, and wherein the chamber, the insert, and the pin array section are configured such that the first distance is approximately minimized.
Owner:GENERAL ELECTRIC CO

Pre-process before cutting a wafer and method of cutting a wafer

A pre-process before cutting a wafer is described. The wafer comprises a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.
Owner:UNITED MICROELECTRONICS CORP

Transparent display device

Disclosed is a transparent display device that includes a plurality of column lines and a plurality of horizontal lines crossing each other to define a plurality of pixel regions in a matrix, each column line including at least two data lines and a voltage line, and each horizontal line including a gate line; a first transparent electrode in each emission region; a transparent organic light emitting layer on the first electrode; and a second transparent electrode on the organic light emitting layer, wherein each pixel region includes a transmissive region and a circuit region, and wherein the transmissive region includes at least two emission regions that are divided by a first transparent bank pattern.
Owner:LG DISPLAY CO LTD
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