High-weldability environment-friendly superfine solder wire for intelligent manipulator welding and preparation method thereof

A technology of intelligent manipulator and solder wire, applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problem of easy broken core of solder wire, achieve short production cycle, long quality assurance period, and prevent waste Effect

Active Publication Date: 2020-08-28
中山翰华锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problem that the existing solder wire is easy to break the core, the present invention provides a highly solderable and environmentally friendly ultra-fine solder wire for intelligent manipulator welding

Method used

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  • High-weldability environment-friendly superfine solder wire for intelligent manipulator welding and preparation method thereof
  • High-weldability environment-friendly superfine solder wire for intelligent manipulator welding and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] A high-weldable environment-friendly ultra-fine solder wire for intelligent manipulator welding, including the following components by weight, 97.2% solder alloy, 2.80% flux, wherein the composition of the solder alloy is as shown in Table 2, the flux The composition ratio is described in Table 3, and its preparation method comprises the following steps:

[0031] Weigh each component according to the weight percentages in Table 2 and Table 3, and set aside; add rosin into the reaction kettle and heat to 130°C, add solvent and thermosetting resin and stir for 20 minutes after dissolving, then add thixotropic agent and stir until completely dissolved, Lower the temperature to 90°C, add active agent, surfactant and corrosion inhibitor and stir for 60 minutes, cool to obtain flux; melt the tin into the melting furnace and melt to 360°C, heat and stir for 20 minutes, remove the tin slag, add Stir silver, copper, and molybdenum for 20 minutes, then heat up to 430°C, add ceriu...

Embodiment 2

[0033] A high-weldable environment-friendly ultra-fine solder wire for intelligent manipulator welding, comprising the following components by weight, 97.40% solder alloy, 2.60wt% flux, wherein the composition ratio of the solder alloy is shown in Table 2. The component distribution of flux is as described in table 3, and its preparation method comprises the following steps:

[0034] Weigh each component according to the weight percentages in Table 2 and Table 3, and set aside; add the rosin into the reactor and heat it to 135°C, after it dissolves, add the solvent and the thermosetting resin and stir for 30 minutes, then add the thixotropic agent and stir until it is completely dissolved. Lower the temperature to 80°C, add active agent, surfactant and corrosion inhibitor and stir for 50 minutes, cool to obtain flux; melt the tin into the melting furnace and melt to 350-360°C, keep stirring for 250min, then remove the tin slag , add silver, copper, molybdenum and stir for 10 m...

Embodiment 3

[0036] A high-weldability environment-friendly ultra-fine solder wire for intelligent manipulator welding, comprising the following components by weight, 96.9wt% solder alloy, 3.1wt% flux, wherein the composition ratio of the solder alloy is shown in Table 2, The component distribution of flux is as described in table 3, and its preparation method comprises the following steps:

[0037] Weigh each component according to the weight percentages in Table 2 and Table 3, and set aside; add rosin into the reaction kettle and heat to 150°C, after dissolving, add solvent and thermosetting resin and stir for 2 minutes, then add thixotropic agent and stir until completely dissolved, Lower the temperature to 80°C, add active agent, surfactant and corrosion inhibitor and stir for 40 minutes, cool to obtain flux; melt the tin into the melting furnace and melt to 355°C, keep stirring for 25 minutes, remove the tin slag, add Stir silver, copper and molybdenum for 10 minutes, then raise the t...

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Abstract

The invention discloses a high-weldability environment-friendly superfine solder wire for intelligent manipulator welding and a preparation method thereof. The superfine solder wire comprises 96.9 wt%-98.1 wt% of solder alloy and 1.9 wt%-3.1 wt% of scaling powder, wherein the solder alloy comprises the components of tin, silver, copper, molybdenum, cerium, tellurium and lutetium, by adding the cerium, the structure of the solder can be changed, so that crystal grains are refined, solder joint bridges are reduced, the surface wettability of the solder alloy is changed, and the creep property and the tensile property are improved; the addition of tellurium can improve the corrosion resistance, the wear resistance and the strength of the material, the tensile strength of the solder can be improved, the generation of tin whiskers can be prevented; lutetium has good electrical conductivity and ductility and extremely high activity, and is excellent in effect of improving electric heating performance and oxidation resistance in soldering tin alloy powder, so that tensile strength and toughness of the solder are improved, the wettability of solder wires is good, the tensile strength is excellent, and lead-free and environment-friendly effects are achieved. The superfine solder wire has the advantages of being high in weldability and not prone to core breakage, and high weldability andlead-free environment-friendly development of products are achieved when the superfine solder wire is applied to the high-end application field of intelligent manipulator welding and the like.

Description

【Technical field】 [0001] The invention belongs to the technical field of welding materials, and in particular relates to a high-weldable environment-friendly ultra-fine solder wire used for welding with an intelligent robot and a preparation method thereof. 【Background technique】 [0002] With the development of electronic products and their technology, products are gradually developing towards functionalization and miniaturization, and the requirements for solder wire are getting higher and higher. The microelectronic interconnection material industry is also growing with the development of the domestic electronic industry Gradually growing up, ordinary solder wire products are not inferior to foreign products, but there is still a considerable gap with foreign products in more refined products and high-end applications such as robot welding, and some even completely rely on imports. For example, for micro-electronic assemblies (SMT), circuit boards, components, micro-conne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36B23K35/40
CPCB23K35/262B23K35/3613B23K35/3612B23K35/40
Inventor 李爱良周建龙斌李义成汪亮
Owner 中山翰华锡业有限公司
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