37results about How to "Extended conduction path" patented technology

A microwave probe having a metal tip on the free end of a microcantilever. In one embodiment, a pyramidal pit is isotropically etched in a device wafer of monocrystalline silicon. Oxidation may sharpen the pit. Deposited metal forms the metal tip in the pit and a bottom shield. Other metal sandwiched between equally thick dielectric layers contact the tip and form a conduction path along the cantilever for the probe and detected signals. Further metal forms a top shield overlying the conduction path and the dielectrically isolated tip and having equal thickness to the bottom shield, thus producing together with the symmetric dielectric layers a balanced structure with reduced thermal bending. The device wafer is bonded to a handle wafer. The handle is formed and remaining silicon of the device wafer is removed to release the cantilever.

A wire harness includes at least one conducting path, and a tubular exterior member that covers the conducting path. The exterior member has a shape changed portion in at least one position. The shape changed portion includes at least one small tube portion which includes an accommodation space necessary for accommodating the conducting path, a tube continuous portion one end of which is continuous with an end of the small tube portion, and a large tube portion which is continuous with another end of the tube continuous portion and includes a tubular shape that is larger in outer shape than the small tube portion.

Disclosed is an electrode active material comprising: a core layer capable of repeating lithium intercalation / deintercalation; an amorphous carbon layer; and a crystalline carbon layer, successively, wherein the crystalline carbon layer comprises sheet-like carbon layer units, and the c-axis direction of the sheet-like carbon layer units is perpendicular to a tangent direction of the electrode active material particle. A secondary battery comprising the same electrode active material is also disclosed.

This invention provides a system capable of melting solder and removing the melted solder from a substrate. The heating system includes a desoldering tool having at least two handles, a first handle and a second handle. This way, an operator may grip the first handle or the second handle depending on the operator's preference of gripping the desoldering tool. The first handle has a cavity adapted to releaseably receive a storage where the melted solder can be deposited and stored. The storage may have a divot adapted to receive a key from the first handle so that the storage may be orientated in a predetermined position relative to the cavity. The cavity in the first handle is exposed so that the storage can be readily inserted or replaced. This allows the operator to easily replace and maintain the desoldering tool without a significant downtime. The first handle is adapted to receive a heater cartridge having a transition section to couple the leading section and the electrical cartridge in a staggered manner. This configuration allows the leading section to have a shortened channel that is substantially straight and aligned with the passage formed within the first handle to minimize the resistant to flow of the melted solder through the channel which is then deposited into the storage.

The invention relates to the field of beauty instruments, and discloses an equipment main body of a beauty instrument and a contact type beauty instrument. An equipment main body of the beauty instrument provided by the invention comprises a heat dissipation piece. The heat dissipation piece is provided with a thermal coupling surface which is used for being thermally coupled with a heating surface of the operation head so as to dissipate heat from the operation head, the operation head is provided with a contact surface and a heating surface, and the contact surface is used for making contact with a skin part and cooling the skin part; wherein the heat dissipation piece extends from the head of the equipment main body to the tail of the equipment main body, so that the heat dissipation piece can fully dissipate heat of the operation head and the equipment main body, the heat conduction path during heat dissipation is prolonged, and the heat backtracking phenomenon is reduced.

The invention provides a processing system for waste cables. A cutter can cut waste power cables on a conveyor belt through vertical reciprocation; a conveying device is arranged on a discharge side of the conveyor belt and used for conveying the cut waste power cables into a smashing device; the smashing device comprises a vibrating screen, an upper smashing mechanism and a lower smashing mechanism, and the vibrating screen is located between the upper smashing mechanism and the lower smashing mechanism and can reciprocate vertically; a lower separating device is located below a discharge port of the smashing device and used for separating copper grains and rubber grains falling from the discharge port of the smashing device; an upper separating device is located above the lower separating device and used for removing magnetic metal impurities from the copper grains and the rubber grains when the copper grains and the rubber grains are separated by the lower separating device. The processing system has the effects of being high in continuity, short in processing period, convenient to operate and high in automation degree, and purity of the recovered copper grains and rubber grainsis high.

The electrical contact enhancing coating is a composition that includes finely divided precious metal particles mixed with a dielectric carrier to form a coating. The dielectric carrier is a vegetable oil (preferably soybean-based) carrier of the type used as a dielectric coolant in power transformers, and is preferably high in antioxidant content. In a first embodiment, the precious metal is 100% silver having an average particle size of about 5-10 μm. In a second embodiment, the precious metal is about 65-85% silver and 15-35% gold (average particle size 0.5-1.8 μm), by weight. In a third embodiment, the precious metal is about 65-85% silver, 12.5-30% gold, and 2.5-5% palladium (average particle size 0.5-1.8 μm), by weight. The precious metals may be cryogenically treated prior to mixing with the dielectric carrier.

The present invention provides a method for the fabrication of a LaZrGa(OH)x metal hydroxide precursor with a co-precipitation method in a continuous TFR reactor. The present invention also provides a method for the fabrication of an ion-doped all-solid-state lithium-ion conductive material with lithium ionic conductivity, and mixing which in the polymer base material, using a doctor-blade coating method to prepare a free standing double layered and triple layered organic-inorganic hybrid solid electrolyte membrane. Furthermore, the present invention provides an all-solid-state lithium battery using the aforementioned hybrid solid electrolyte membrane and measure the electrochemical performance. The all-solid-state lithium battery may enhance the lithium ionic conductivity, and lower the interfacial resistance between the solid electrolyte membrane and the electrode, therefore the battery may have excellent performance, and prevent the lithium-dendrite formation effectively to enhance the safety.

The invention relates to a low temperature optical system support device with high heat insulation efficiency and small thermal stress influence. In the device, a support inner ring is fixedly connected with a second heat insulation ring through three second support blocks which are uniformly distributed at the periphery of the support inner ring; the second heat insulation ring is fixedly connected with a first heat insulation ring through three transition blocks which are uniformly distributed at the periphery of the second heat insulation ring; and the first heat insulation ring is fixedlyconnected with a support outer ring through three first support blocks which are uniformly distributed at the periphery of the support outer ring. By the support device with a dual glass reinforced plastic annular structural form, a heat conduction path is prolonged, the thermal resistance between a high temperature end and a low temperature end is increased, and the heat insulation efficiency ofthe component is greatly improved; and as a flexible link in the structural component, the glass reinforced plastic annular structure bears main thermal deformation, reduces applied force acting on an optical system, ensures the precision of the optical system and improves the detecting capability of the optical system.