56results about How to "Experimental environment requirements are low" patented technology

The invention provides a portable seabed shallow geological hazard simulation device, which comprises an experimental assembly, a fluid conveying assembly and a pressure adjustment assembly, wherein the experimental assembly is used for simulating seabed shallow geological characteristics, the fluid conveying assembly is used for injecting an experimental fluid into the experimental assembly, thepressure adjustment assembly is used for adjusting the pressure inside the experimental assembly, the experimental assembly is internally preset with gravel used for simulating the unconsolidated formation, and two ends of the pressure adjustment assembly are respectively connected with the experimental assembly and the fluid conveying assembly. The portable seabed shallow geological hazard simulation device has the advantages of ensuring the safety of offshore oil and gas exploration and development and being convenient to carry.

The metal foil numerical control cutting and gluing direct forming additive manufacturing equipment and method of the present invention, the device includes a conveyor belt, the conveyor belt passes through a laser cutting machine, and a digital programming route is arranged inside, and a computer combines a manipulator to complete the cutting station. The final workpiece is sliced ​​and programmed in advance and then digitally cut to obtain special-shaped metal foil for additive manufacturing slicing. The suction cup completes the separation of waste and metal special-shaped foil, and glues to complete the lamination operation of the final metal structure. Cycle operation until the workpiece blank of the designed shape is obtained, and solidified to realize additive manufacturing. This method takes advantage of the ultra-soft characteristics of the metal foil, and under the cooperation of the mold, the metal structural parts with complex shapes are stacked layer by layer. Compared with traditional additive manufacturing, this method greatly shortens the processing process and greatly reduces costs by using lower-priced metal foils. In addition, all waste materials are recycled during the entire production process, without reaching the melting point temperature and long-term heating and molding, saving energy and reducing pollution.

The invention discloses an experiment device and method for simulating in-situ secondary explosion, and is suitable for researches on the in-situ secondary explosion of combustible gas and liquid steam. An explosion pipeline serves as a main body part of the device and consists of a left section and a right section, and a flame arrester is mounted between the two sections; when mixed gas in the pipeline is ignited, the gas in the first pipeline is subjected to initial explosion; under the flame arresting action of the flame arrester, the gas in the second pipeline cannot be exploded; after the initial explosion in the first pipeline, the gas generates relatively high negative pressure, so that part of the gas in the second pipeline is sucked into the first pipeline to be subjected to secondary explosion. Pressure sensors and flame sensors which are mounted at different parts on the pipeline are used for testing change conditions of the pressure and flame signals in the pipeline, and a data acquirer and a computer are used for obtaining a pressure and flame curve for analyzing the signals, so that the development process of the in-situ secondary explosion can be researched deeply, and the mechanism of the in-situ secondary explosion can be further explored.

The present invention relates to a free multi-view real time three-dimension reconstructing system and a method thereof. The system consists of a CCD vidicon, a computer assembled with a multi-channel image collecting card and a plane demarcating template. Two concentric circles and eight tangential paths with prolonged lines crossing the circle center are drawn on the center of the plane demarcating template and are used for demarcating the vidicon parameter. In the technical proposal of the present invention, a reconstructing object is fixed at the center of the demarcating template; the template is held by hand to drive the reconstructing object to rotate freely within the range of the view and the depth of field of a vidicon at a fixed position; image collection and object reconstruction are processed synchronously, thereby being capable of finding concentrated missed view in time and displaying reconstruction result in real time. The three-dimension reconstructing method comprises the steps of image segmentation, full-automatic vidicon demarcation and the three-dimension reconstruction of object shape, etc. The three-dimension reconstructing system of the present invention isbased on the computer vision technology, and the reconstructing method is based on the profile recovery shape and can realize free multi-view real time three-dimension reconstruction.

The invention provides a preparation method for a copper substrate for vertical LED (light-emitting diode) chips, which includes the following steps: (1) a P-type metal electrode layer is deposited on the surface of an epitaxial wafer, a layer of Au is then plated on the P-type metal electrode layer, and thereby a first substrate is obtained; (2) the first substrate is cleaned, and after a degreasing effect is achieved, H2SO4 is used for surface activation; (3) a phosphorized copper anode is blackened, and is then cleaned; (4) the first substrate treated in step 2 and the phosphorized copper anode treated in step 3 are put into copper plating solution and electroplated, so that an electroplated sample is obtained; (5) the electroplated sample is cleaned in order to remove residual copper plating solution, so that the copper substrate is obtained. The preparation method has the characteristics of simple process and low preparation cost, moreover, the copper substrate prepared by the method has the characteristics of no burrs, good surface uniformity, good smoothness, low roughness and good thermal and electric conductivities, and thereby a chip which is prepared by adopting the copper substrate has high light extraction efficiency.