The invention belongs to the technical field of
high polymer materials, supramolecular materials and adhesives, and particularly relates to an
epoxy resin
hot melt adhesive and a preparation method thereof. The
epoxy resin
hot melt adhesive material is prepared from
epoxy resin, polyether amine and a polyether amine ureido
pyrimidone derivative, wherein under a high-temperature condition, UPy is dissociated, and the
hot melt adhesive flows to infiltrate the surface of an adhered object, and under a low-temperature condition, UPy is associated, the
hot melt adhesive is cured, and the adhered objects are adhered together. According to the invention, the epoxy resin
hot melt adhesive based on UPy has the advantages of repeatable bonding, high
bonding strength, wide bonding range, high bonding speed, low bonding temperature, adjustable
bonding strength, environment friendliness and the like; the prepared epoxy resin
hot melt adhesive is simple in structure and wide in
raw material source; in the preparation process of the epoxy resin hot melt adhesive, no
solvent is used, the
solid content of the hot melt adhesive is 100%, and the epoxy resin hot melt adhesive is an environment-friendly adhesive; and the process is simple, no by-product is generated, no waste is discharged, and the atom
utilization rate is 100%.