The invention provides a method for preparing a transparent glass-based double-layer circuit board. The method comprises the following steps: trepanning on a glass substrate, mounting a hollow copper tube, printing and curing conductive paste on the glass substrate in sequence, finally maintaining the glass substrate in a high temperature environment for a period of time, and then cooling the glass substrate to the normal temperature to fuse the conductive paste and the glass substrate to integrally form conductive circuits, wherein the conductive circuits are distributed on the surface of the glass substrate and become a part of the glass substrate, and the two conductive circuits are conducted by the hollow copper tube to obtain the transparent glass-based double-layer circuit board. According to the method provided by the invention, common glass is used as an insulating board, compared with the existing double-sided wiring printed circuit board, the prepared transparent glass-based double-layer circuit board can guarantee high transparency, the transparency exceeds 90%, the cost is low, the conductive paste printed on the glass substrate is prepared in such a manner that single surfaces are cured in sequence and then are simultaneously fused, so that the double layers of conductive circuits are formed in on piece, the quality of the double layers of conductive circuits is consistent, and thus the product quality is guaranteed.