Method for preparing transparent glass-based double-layer circuit board

Abstract

The invention provides a method for preparing a transparent glass-based double-layer circuit board. The method comprises the following steps: trepanning on a glass substrate, mounting a hollow copper tube, printing and curing conductive paste on the glass substrate in sequence, finally maintaining the glass substrate in a high temperature environment for a period of time, and then cooling the glass substrate to the normal temperature to fuse the conductive paste and the glass substrate to integrally form conductive circuits, wherein the conductive circuits are distributed on the surface of the glass substrate and become a part of the glass substrate, and the two conductive circuits are conducted by the hollow copper tube to obtain the transparent glass-based double-layer circuit board. According to the method provided by the invention, common glass is used as an insulating board, compared with the existing double-sided wiring printed circuit board, the prepared transparent glass-based double-layer circuit board can guarantee high transparency, the transparency exceeds 90%, the cost is low, the conductive paste printed on the glass substrate is prepared in such a manner that single surfaces are cured in sequence and then are simultaneously fused, so that the double layers of conductive circuits are formed in on piece, the quality of the double layers of conductive circuits is consistent, and thus the product quality is guaranteed.

Description

technical field [0001] The invention relates to a preparation method of a double-layer circuit board, in particular to a preparation method of a transparent glass-based double-layer circuit board, and belongs to the technical field of electronic devices. Background technique [0002] As a national pillar industry, the electronics industry has developed rapidly in recent years, especially for terminal products that are light, thin, short, and small. For its basic industry—the printed circuit board industry, it has proposed high-density, small-volume, Higher requirements such as high conductivity. Circuit board technology has developed rapidly under this background, and industries in various weak current fields, such as computers and peripheral auxiliary systems, medical equipment, mobile phones, digital (camera) cameras, communication equipment, precision instruments, aerospace, etc. The process and quality of printed circuit boards have put forward many specific and clear t...

AI Technical Summary

Problems solved by technology

The coating etching process is to coat a layer of conductive paste on the surface of the glass plate, and use the etching method to make the circuit. The electronic circuit of this glass-based circuit board is combined with the glass plate through an adhesive. Since the glass molecules are compatible with any element except fluorine No chemical reaction can occur, so this coating process is basically a spraying process, which is a bonding process of organic materials mixed with conductive metal particles. The adhesive reduces the purity of the conductive paste and makes the conductivity very poor. The best material Also only 1×10 -4 Ω, it is difficult to solder electronic components, and it is also difficult to realize functional circuits

The low-temperature silver paste process is to screen-print low-temperature silver paste circuits on the surface of the glass plate, which is realized by baking and curing within 200°C. This method cannot achieve high conductivity because the silver paste also contains a large amount of organic bonding materials. Conductivity can only reach 3×10 -5 Ω, electronic components are still difficult to solder, poor adhesion