Manufacturing method for high-conduction transparent glass-based circuit board
A circuit board manufacturing and transparent glass technology, applied in transparent dielectrics, printed circuit manufacturing, circuit substrate materials, etc., can solve the problems of poor electrical conductivity, difficult soldering of electronic components, poor adhesion, etc. Neatly arranged and strong binding effect
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[0025] The present invention will be further described below in conjunction with embodiment.
[0026] The present invention provides a high-conductivity transparent glass-based circuit board manufacturing process, comprising the following steps:
[0027] (1) Print the conductive paste on the air surface of the glass plate; the conductive paste is composed of conductive powder, low-temperature glass powder, B Base cellulose, terpineol and dibutyl maleate, wherein the conductive powder is a mixture of graphene powder or metal powder and graphene powder; if the conductive powder is a mixture of metal powder and graphene powder, graphite The mass percentage of olefin powder in the conductive paste is 2‰~5%;
[0028] (2) Bake the glass plate covered with the conductive paste at a temperature of 120-150° C. for 100-200 seconds;
[0029] (3) Place the glass plate in a temperature environment of 550-600°C for 300-360 seconds, then place it in a temperature environment of 710-730°C f...
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