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811results about How to "Thin structure" patented technology

Interconnect module with reduced power distribution impedance

InactiveUS6847527B2Reduced impedance powerReduced ground distributionLight absorption dielectricsSemiconductor/solid-state device detailsSolder ballOperating frequency
An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.
Owner:3M INNOVATIVE PROPERTIES CO

Rotor cooling system for synchronous machines with conductive sleeve

A wound field synchronous machine includes direct oil cooling along a conductive sleeve with elongated semi-arcuate shaped channels which alternate with damper bar channels containing tie-rod supports structures. With a reduction in sleeve thickness permitted by the direct cooling, the overall weight of the machine is reduced.
Owner:HAMILTON SUNDSTRAND CORP

Flexible capacitance type touch sensor production method

The invention relates to a method for producing flexible capacitor touch sensor, characterized in composed of middle layer preparation of PDMS, preparation of flexible PI substrate, graph metal sensitive electrode and relative electric connection, preparation of a first high-elasticity dielectric layer PDMS and a second flexible dielectric layer PI, graph metal drive electrode and relative electric connection, graph a top flexible insulation protective layer PI, separation of the flexible capacitor touch sensor. The invention optimizes and combines techniques, to realize the compatibility of organic flexible material PDMS, PI and traditional MEMS technique. And the capacitor touch sensor has compact structure, high mechanical strength, and high flexibility, while the product can contact the surface with any curvature to sense the volumes of normal force and tangent force, and be applied for the production of flexile capacitor touch sensor array.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same

A thin, planar semiconductor device having electrodes on both surfaces is disclosed. This semiconductor device is provided with an IC chip and a wiring layer having one side that is electrically connected to surface electrodes of the IC chip. On this surface of the wiring layer, conductive posts are provided on wiring of the wiring layer, and an insulating resin covers all portions not occupied by the IC chip and conductive posts. The end surfaces of the conductive posts are exposed from the insulating resin and are used as first planar electrodes. In addition, a resist layer is formed on the opposite surface of the wiring layer. Exposed portions are formed in the resist layer to expose desired wiring portions of the wiring layer. These exposed portions are used as second planar electrodes. Stacking semiconductor devices of this construction enables an improvement in the integration of semiconductor integrated circuits.
Owner:RENESAS ELECTRONICS CORP

Guidewire for crossing occlusions or stenoses

Systems and methods for crossing stenosis, partial occlusions, or complete occlusions within a body lumen. The systems generally include an elongate member such as a hollow guidewire that houses a rotatable and translatable drive shaft. The drive shaft typically has a distal portion that is advanced to create a path in the occlusive material that is large enough to allow the hollow guidewire to cross the occlusive material.
Owner:REVASCULAR THERAPEUTICS

Apparatus for and method of forming seals in fuel cells and fuel cell stacks

A sealing technique is provided for forming complex and multiple seal configurations for fuel cells and other electrochemical cells. To provide a seal, for sealing chambers for oxidant, fuel and / or coolant, a groove network is provided extending through the various elements of the fuel cell assembly. A source of seal material is then connected to an external filling port and injected into the groove network, and the seal material is then cured to form the seal. There is thus formed a “seal in place”, that is robust and can accommodate variations in tolerances and dimensions, and that can be bonded, where possible, to individual elements of the fuel cell assembly. This avoids the difficulty, labor intensive cost and complexity of manually assembling many individual gaskets into complex groove shapes and the like. The seal material can be selected to be comparable with a wide variety of gases, liquid coolants and the like.
Owner:HYDROGENICS CORP
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